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Compare moats

Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing Amkor Technology×Bloom Energy× add + AMD AMD+ ASE Technology Holding ASX+ ASM International ASMIY+ ASML ASML+ Adobe ADBE+ Advantest ATEYY+ Alibaba Group BABA+ Alphabet GOOGL+ Amazon AMZN+ Amphenol APH+ AppLovin APP+ Apple AAPL+ Applied Digital APLD+ Applied Materials AMAT+ Applied Optoelectronics AAOI+ Arista Networks ANET+ Arm Holdings ARM+ Astera Labs ALAB+ Broadcom AVGO+ C3.ai AI+ CXMT 688825.SS+ Cadence Design Systems CDNS+ Celestica CLS+ Cerebras Systems CBRS+ Ciena CIEN+ Cisco Systems CSCO+ Cloudflare NET+ Coca-Cola KO+ Coherent Corp COHR+ Constellation Energy CEG+ CoreWeave CRWV+ Corning GLW+ Credo Technology CRDO+ CrowdStrike CRWD+ Datadog DDOG+ Dell Technologies DELL+ Digital Realty Trust DLR+ Duolingo DUOL+ Eaton ETN+ Eli Lilly and Company LLY+ Equinix EQIX+ Everpure, Inc. P+ Fabrinet FN+ GE Vernova GEV+ GitLab GTLB+ GlobalFoundries GFS+ Hewlett Packard Enterprise HPE+ Hon Hai Precision (Foxconn) HNHPF+ Hut 8 HUT+ IBM IBM+ IREN IREN+ Intel INTC+ JPMorgan Chase JPM+ KLA Corporation KLAC+ Kioxia Holdings KXIAY+ Lam Research LRCX+ Lumentum Holdings LITE+ Marvell Technology MRVL+ MediaTek 2454.TW+ Meta Platforms META+ Micron MU+ Microsoft MSFT+ Moderna MRNA+ MongoDB MDB+ Montage Technology 688008.SS+ NVIDIA NVDA+ Nebius Group NBIS+ NetApp NTAP+ Netflix NFLX+ Nokia NOK+ Oracle ORCL+ Palantir Technologies PLTR+ Palo Alto Networks PANW+ Penguin Solutions PENG+ Pfizer PFE+ Powell Industries, Inc. POWL+ Qualcomm QCOM+ SAP SAP+ SK Hynix SKHY+ Salesforce CRM+ Samsung Electronics 005930.KS+ SanDisk SNDK+ Schneider Electric SBGSY+ Seagate Technology STX+ ServiceNow NOW+ Snowflake SNOW+ SoundHound AI SOUN+ Space Exploration Technologies Corp. (SpaceX) SPCX+ Super Micro Computer SMCI+ Synopsys SNPS+ TE Connectivity TEL+ TSMC TSM+ Talen Energy TLN+ Tempus AI TEM+ Tencent Holdings TCEHY+ Teradyne TER+ Tesla, Inc. TSLA+ The Walt Disney Company DIS+ Tokyo Electron TOELY+ Trane Technologies TT+ United Microelectronics Corporation UMC+ Vertiv VRT+ Visa V+ Vistra VST+ Walmart WMT+ Western Digital WDC+ Wistron 3231.TW+ Wiwynn 6669.TW+ X-energy XE
Amkor Technology AMKR ai moat: latest change 2026-02-20 Bloom Energy BE ai moat: latest change 2026-02-09
Moat rating narrow

The FY2025 10-K describes a real but bounded edge. On the plus side, Amkor says "Our scale and geographic diversity allow us to qualify production at multiple sites, optimize asset utilization and absorb large orders that require quick turnaround." It also says "Amkor has built long-standing relationships with most of the world's leading semiconductor companies over the last five decades." And it says that "in line with industry practice, customers usually require us to pass a lengthy and rigorous qualification process that may take several months". It falls short of wide because the same filing calls the market "highly competitive", names ASE Technology, JCET Group and Powertech Technology as rivals, and says Amkor faces Asian providers "including companies with significantly greater processing capacity, financial resources". It also says foundries "substantially larger than us" have expanded into packaging and test, and that IDMs and foundries "may decide to shift some or all of their outsourced packaging and test services to internally sourced capacity". Returns are thin: MD&A gross margin was 14.0% in 2025, 14.8% in 2024 and 14.5% in 2023, with a 7.0% operating margin in 2025.

source: sec.gov

narrow

FY2025 10-K (Item 1, filed 2026-02-09): a proprietary solid-oxide platform protected by 380 active U.S. utility patents plus 183 pending, with speed-to-power the company says can deliver onsite power 'within approximately 90 days' — real but contested advantages: the same 10-K's Item 1A calls distributed generation and hydrogen 'still emerging markets' whose acceptance is uncertain, and revenue concentration was 43%/13%/12% across three customers in FY2025 (sec.gov/Archives/edgar/data/1664703/000162828026006516/be-20251231.htm).

source: sec.gov

Moat type cost scale

Part of the 10-K's cost/scale case applies to the whole industry, not to Amkor alone. It says packaging and test service providers "can typically use their assets to support a broad range of customers and multiple end markets, potentially generating more efficient use of their production assets and a more cost-effective solution", in contrast to IDMs running their own lines. The Amkor-specific support is its footprint, which it calls "a key differentiator", and its purchasing scale: "By leveraging our purchasing power and operational expertise, we look to secure favorable pricing and supply agreements for materials and equipment, further enhancing our competitive position." It adds: "We also negotiate worldwide pricing agreements with our major suppliers to take advantage of the scale of our operations." Against other OSATs the scale edge is limited, because Item 1A concedes Asian rivals "including companies with significantly greater processing capacity, financial resources". Multi-month customer qualification and long customer relationships add a secondary switching-cost element. IP is not the source: "Although our patents are an important element of our intellectual property strategy, we are not materially dependent on any one patent or any one technology."

source: sec.gov

intangibles ip

The FY2025 10-K states 'Intellectual property is an essential differentiator for our business' and details 380 active U.S. utility patents, 252 active international patents, trade secrets around cell printing, and a purpose-built copy-exact Newark manufacturing facility — the moat rests on proprietary solid-oxide technology and manufacturing know-how, not network effects or locked-in customers (Item 1, Intellectual Property / Manufacturing Facilities).

source: sec.gov

Leadership co leader

The FY2025 10-K opens: "Amkor is the world's largest U.S. headquartered outsourced semiconductor assembly and test service provider (“OSAT”) and is a global leader in outsourced semiconductor packaging and test services." It claims to be a global leader, not the leader, and its one superlative is limited to U.S.-headquartered providers. It names ASE Technology, JCET Group and Powertech Technology as rivals. It concedes Asian competitors "including companies with significantly greater processing capacity, financial resources". About the key competitive factors it lists, it says only "We believe we are competitive in these areas."

source: sec.gov

clear leader

Scoped to fuel-cell-based onsite power for datacenters: Energy Changemakers (2026-07-04) positions Bloom as the market leader in fuel-cell deployment for AI datacenters — Brookfield framework expanded $5B→$25B, Oracle up to 2.8 GW, Equinix 100+ MW across 19 US datacenters, AEP gigawatt-scale — with FuelCell Energy the named challenger at smaller aggregate scale (~450/380/360 MW deals). In onsite power broadly (vs. turbines and engines) Bloom is one option among several (energychangemakers.com/fuel-cells-gain-ground-in-data-centers/).

source: sec.gov

Pricing power weak

Item 1A of the FY2025 10-K says "Prices for packaging and test services have generally declined over time, and sometimes prices can change significantly in relatively short periods of time." It also says "We expect downward pressure on average selling prices for our packaging and test services to continue in the future, and this pressure may intensify during downturns in business." MD&A gross margin was 14.0% in 2025 against 14.8% in 2024 and 14.5% in 2023. The notes say the longer test-equipment depreciation life "reduced depreciation expense by approximately $59 million in 2024". Materials alone were 55.2% of 2025 net sales. The customer base is concentrated: the ten largest customers were 72% of 2025 net sales, with Apple at 29.8% and Qualcomm at 11.1%, and the filing flags "a reduction in orders or decrease in price from a significant customer" as a risk.

source: sec.gov

moderate

Q2 2026 release: GAAP gross margin 33.4%, up 668 bps YoY, with 34.3% non-GAAP and raised FY26 guidance of ~34% non-GAAP gross margin — margin expansion during a supply-constrained turbine market suggests real but cyclical pricing leverage; the FY2025 10-K frames the core competition as grid electricity and combustion OEMs on cost, which caps pricing through the cycle (sec.gov/Archives/edgar/data/1664703/000162828026050150/ex991_q226financialresults.htm).

source: sec.gov

Summary

Amkor is a back-end contractor; the 10-K says "We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test and drop shipment services." It also says "Our customers include most of the world's largest semiconductor companies." Advanced Products (flip chip, memory and wafer-level packages) were 82.8% of its $6,708M in 2025 net sales. The durable part of its position is scale and a multi-country footprint, which the filing calls "a key differentiator", backed by multi-month customer qualification and customer relationships it dates back "over the last five decades". On Arizona, the filing says: "Construction began in the second half of 2025, and we believe that this investment will strengthen our ability to serve customers seeking to regionalize their supply chains and will enhance our participation in U.S. semiconductor initiatives." Price caps the moat. The 10-K says "We expect downward pressure on average selling prices for our packaging and test services to continue in the future, and this pressure may intensify during downturns in business." It also says foundries "substantially larger than us" have expanded their operations to include packaging and test services.

Bloom's edge is a single solid-oxide platform — 'cell printing, stack assemblies, and column configurations' — that serves both the Energy Server and the Bloom Electrolyzer, protected by 380 active U.S. patents and decades of materials know-how (FY2025 10-K, Item 1). Against its practical competition — grid power, gas reciprocating engines, small gas turbines, and other fuel-cell chemistries (PEM/MCFC/PAFC) — the 10-K claims higher efficiency, no combustion, 99.9% fleet availability on post-2020 non-redundant installs, and deployment in weeks-to-months while turbine OEMs are supply-constrained. That time-to-power window is currently being monetized in AI datacenters: the Q2 2026 release (2026-07-28) reported record revenue of $1,065.4M (+165.5% YoY) and management said all major U.S. hyperscalers have 'validated and approved' Bloom, calling it 'a standard for AI onsite power.' The moat is rated narrow, not wide: the 10-K's own risk factors stress that distributed generation is an emerging market with uncertain acceptance, three customers were 43%/13%/12% of FY2025 revenue, and industry coverage (Energy Changemakers, 2026-07-04) shows FuelCell Energy signing deals of comparable scale — the advantage is a technology-and-execution lead that rivals and turbine capacity additions can compress, not a structural lock.

Chain position

Back-end packaging and test step between wafer fabs and chip vendors. The 10-K says "the wafers that we receive from our customers are generally consigned to us", and Amkor serves IDMs, fabless companies, OEMs and contract foundries that outsource packaging and test.

Onsite prime-power supplier to AI infrastructure: per the FY2025 10-K, AEP is procuring up to 1 GW of Bloom fuel cells for AI datacenter loads, Brookfield established a financing framework (up to $5.0B over five years at signing, per the 10-K) housed in an AI Infrastructure Fund, and SK ecoplant (a ~2.5% Class A holder) distributes and co-assembles in Korea; the Q2 2026 release adds that all major U.S. hyperscalers plus over a dozen neoclouds, AI labs, and colocation operators have approved Bloom's systems.

Products (share / barrier)
  • 2.5D and high-density fan-out (HDFO) packaging for HPC/AI Unknown · Moderate source: sec.gov
  • Advanced system-in-package (SiP) modules Unknown · Moderate source: sec.gov
  • Mainstream wirebond, leadframe, power and MEMS packaging Unknown · Low source: sec.gov
  • Outsourced packaging and test (OSAT) services Top 3 · Moderate source: trendforce.com
  • Test services (wafer, package, burn-in and system-level test) Unknown · Moderate source: sec.gov
Long-horizon vote +0.05 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

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+0.20 at weight 0.20 · swarm bullish

Editorial prior, not backtested.

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