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Compare moats

Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing ASE Technology Holding×NetApp×Amkor Technology× maximum of 3 — remove one to swap
ASE Technology Holding ASX ai moat: latest change 2026-04-01 NetApp NTAP ai moat: latest change 2026-06-05 Amkor Technology AMKR ai moat: latest change 2026-02-20
Moat rating narrow

The FY2025 20-F argues ASEH out-competes IDM in-house lines because serving "a large base of customers across a wide range of products" lets it "reduce costs and shorten production cycles through high-capacity utilization and process expertise" and gives its equipment "a longer useful life" — a real but bounded edge, since the same filing calls the global packaging and testing market "highly competitive", notes "most of our customers obtain services from more than one source", flags foundry encroachment ("TSMC has offered advanced packaging technologies such as integrated fan-out"), and warns that "some of our competitors may have superior financial, marketing, manufacturing, research and development and technological resources than we do", offering P.R.C. government support of its domestic semiconductor companies as the example.

source: sec.gov

narrow

The FY2026 10-K shows a real, durable lock but not an unassailable one. On the durable side: "Our cloud storage services are based on the same ONTAP data management software that underpins our on-premises ONTAP storage infrastructure offerings", and the same filing's income statement shows the company holding a gross margin near 71% across all three reported years - $4,433M on $6,268M in FY2024, $4,613M on $6,572M in FY2025 and $4,899M on $6,925M in FY2026 - while revenue grew from $6,268M to $6,925M and income from operations widened from 19% to 24% of net revenues. Holding that margin through the memory-cost shock the same filing discloses is the commercial evidence the lock is worth something. On the limiting side, the filing says competition "is intense", that in public cloud "customers may choose native cloud services that are consumed as operating expenses", and that "New competitors or alliances among existing competitors could emerge and quickly gain significant market share" - and IDC's 1Q26 external-storage tracker (Blocks & Files, 2026-06-16, cited on the AFF/ASA product row below) ranks NetApp second behind Dell, not first.

source: sec.gov

narrow

The FY2025 10-K describes a real but bounded edge. On the plus side, Amkor says "Our scale and geographic diversity allow us to qualify production at multiple sites, optimize asset utilization and absorb large orders that require quick turnaround." It also says "Amkor has built long-standing relationships with most of the world's leading semiconductor companies over the last five decades." And it says that "in line with industry practice, customers usually require us to pass a lengthy and rigorous qualification process that may take several months". It falls short of wide because the same filing calls the market "highly competitive", names ASE Technology, JCET Group and Powertech Technology as rivals, and says Amkor faces Asian providers "including companies with significantly greater processing capacity, financial resources". It also says foundries "substantially larger than us" have expanded into packaging and test, and that IDMs and foundries "may decide to shift some or all of their outsourced packaging and test services to internally sourced capacity". Returns are thin: MD&A gross margin was 14.0% in 2025, 14.8% in 2024 and 14.5% in 2023, with a 7.0% operating margin in 2025.

source: sec.gov

Moat type cost scale

The advantage the 20-F actually claims is unit economics from volume, not lock-in: specialization and "economies of scale by providing services to a large base of customers", high capacity utilization spreading "relatively high fixed costs", and equipment that lasts longer because of the breadth of the order book. Capital intensity reinforces it — the filing says "semiconductor businesses are capital intensive and require significant investment in expensive equipment manufactured by a limited number of vendors", with the equipment market itself "characterized by intense demand, limited supply, and long delivery cycles".

source: sec.gov

switching costs

The FY2026 10-K makes the source of the advantage explicit and it is the cost of leaving the data-management layer, not a network or a patent estate. The same ONTAP software runs the on-premises arrays and the cloud services ("Our cloud storage services are based on the same ONTAP data management software that underpins our on-premises ONTAP storage infrastructure offerings"), and the AFF family "allows customers to connect to clouds for more data services, data tiering, caching, and disaster recovery". A customer's volume layout, snapshot and replication workflow and operating tools therefore carry from the array into Azure, AWS and Google rather than being abandoned at the cloud boundary — the filing describes NetApp as "the only provider of enterprise-grade storage services natively embedded in the world's largest public cloud providers", so the usual moment of escape is instead the moment the relationship renews.

source: sec.gov

cost scale

Part of the 10-K's cost/scale case applies to the whole industry, not to Amkor alone. It says packaging and test service providers "can typically use their assets to support a broad range of customers and multiple end markets, potentially generating more efficient use of their production assets and a more cost-effective solution", in contrast to IDMs running their own lines. The Amkor-specific support is its footprint, which it calls "a key differentiator", and its purchasing scale: "By leveraging our purchasing power and operational expertise, we look to secure favorable pricing and supply agreements for materials and equipment, further enhancing our competitive position." It adds: "We also negotiate worldwide pricing agreements with our major suppliers to take advantage of the scale of our operations." Against other OSATs the scale edge is limited, because Item 1A concedes Asian rivals "including companies with significantly greater processing capacity, financial resources". Multi-month customer qualification and long customer relationships add a secondary switching-cost element. IP is not the source: "Although our patents are an important element of our intellectual property strategy, we are not materially dependent on any one patent or any one technology."

source: sec.gov

Leadership co leader

The 20-F calls ASEH "a leading provider of semiconductor manufacturing services in assembly and testing" and "a market leader in SiP technologies from design to assembly with high-volume manufacturing", and says it has "established ourselves as a leader through the successful introduction of leading-edge advanced packaging solutions, which have played a pivotal role in bringing advanced ASIC and HBM products to the marketplace" — but the hedged "we believe we are among the leaders in such packaging processes and technologies", alongside named consolidating rivals (Jiangsu Changjiang Electronics Technology/STATS ChipPAC, Amkor/J-Devices, Tianshui Huatian Technology/Unisem) and TSMC's InFO, describes shared rather than sole leadership.

source: sec.gov

co leader

IDC's 1Q26 external enterprise storage systems tracker, as reported by Blocks & Files on 2026-06-16 (cited in full on the AFF/ASA product row below), ranks NetApp second worldwide behind Dell and ahead of Everpure, Huawei and HPE, attributing the placing to "its growing all-flash business and cloud-integrated data management". Second of five ranked vendors, in a market whose leader is someone else, is a shared front rank rather than an owned one - and the distinct claim NetApp makes in the FY2026 10-K is positional rather than volumetric: being "the only provider of enterprise-grade storage services natively embedded in the world's largest public cloud providers".

source: sec.gov

co leader

The FY2025 10-K opens: "Amkor is the world's largest U.S. headquartered outsourced semiconductor assembly and test service provider (“OSAT”) and is a global leader in outsourced semiconductor packaging and test services." It claims to be a global leader, not the leader, and its one superlative is limited to U.S.-headquartered providers. It names ASE Technology, JCET Group and Powertech Technology as rivals. It concedes Asian competitors "including companies with significantly greater processing capacity, financial resources". About the key competitive factors it lists, it says only "We believe we are competitive in these areas."

source: sec.gov

Pricing power weak

The 20-F states the industry has "a general trend toward declining prices for products and services of a given technology over time" and that ASEH's own "average selling prices of our packaging and testing services have experienced sharp declines" under "intense price competition". FY2025 consolidated gross margin was 17.7% (up from 16.3%), and management attributes the gain to "higher packaging and testing revenue mix and higher factory utilization" rather than price; the EMS half earned a 9.2% gross margin on raw-material costs equal to 78.7% of EMS revenue, and the five largest customers supplied 46.5% of 2025 operating revenues.

source: sec.gov

moderate

It holds price rather than raising it. On the figures filed with the FY2026 10-K, gross margin was 70.7% of revenue in FY2024 ($4,433M on $6,268M), 70.2% in FY2025 ($4,613M on $6,572M) and 70.7% in FY2026 ($4,899M on $6,925M) - flat across three years in which revenue grew from $6,268M to $6,925M - and it held that level while absorbing a component-cost shock. It is no stronger than that because the filing's own risk factor lists "competitive pricing, customer price sensitivity" and "pricing and discounting pressures" among the drivers of gross margin, and discloses that the company "experienced inflationary pressure and supply chain constraints beginning in the second half of fiscal 2026, resulting in increased costs for memory and other components, which have affected our gross margins" - a cost shock it is absorbing rather than fully passing on.

source: sec.gov

weak

Item 1A of the FY2025 10-K says "Prices for packaging and test services have generally declined over time, and sometimes prices can change significantly in relatively short periods of time." It also says "We expect downward pressure on average selling prices for our packaging and test services to continue in the future, and this pressure may intensify during downturns in business." MD&A gross margin was 14.0% in 2025 against 14.8% in 2024 and 14.5% in 2023. The notes say the longer test-equipment depreciation life "reduced depreciation expense by approximately $59 million in 2024". Materials alone were 55.2% of 2025 net sales. The customer base is concentrated: the ten largest customers were 72% of 2025 net sales, with Apple at 29.8% and Qualcomm at 11.1%, and the filing flags "a reduction in orders or decrease in price from a significant customer" as a risk.

source: sec.gov

Summary

ASEH sells turnkey assembly and test at a scale most captive IDM lines cannot match: the 20-F says it is "involved in all stages of the semiconductor manufacturing process except circuit design and wafer fabrication", and leans on Taiwan, "currently the largest center for outsourced semiconductor manufacturing in the world", plus a "strategic alliance with TSMC", to sit next to the foundries its customers already use. The durable part is cost position from utilization, not customer capture — the filing concedes customers multi-source and that foundries are moving into advanced packaging from above.

NetApp sells storage hardware but the asset is ONTAP, the data-management software that has run its arrays for over three decades and now also runs inside the three largest public clouds as a first-party service. The FY2026 10-K organises the company into two segments, Hybrid Cloud (AFF and ASA all-flash arrays, AFX for AI workloads, FAS hybrid-flash, E/EF-Series, StorageGRID object storage) and Public Cloud (Azure NetApp Files, Amazon FSx for NetApp ONTAP, Google Cloud NetApp Volumes, Cloud Volumes ONTAP), and states that both rest on the same ONTAP software. That is the whole argument: an enterprise that has standardised its snapshots, replication and multiprotocol access on ONTAP carries those habits with it when it moves workloads to a hyperscaler, and NetApp is paid on both sides of the move. The evidence that the lock has commercial value is the margin's steadiness: across the three years the FY2026 10-K reports, gross margin sat at 70.7%, 70.2% and 70.7% of revenue ($4,433M on $6,268M, $4,613M on $6,572M, $4,899M on $6,925M) while revenue grew, and the filing's own percentage-of-revenue table shows no mix shift doing that work - product and services held near 46% and 54% of revenue throughout. The limits are equally in the filing. NetApp is second, not first: IDC's 1Q26 tracker puts it behind Dell in external enterprise storage, and the 10-K's competition section concedes that cloud providers are simultaneously partners and rivals, that consumption models "may reduce overall demand for our traditional on-premises offerings sold through a capital expenditure (capex) model", and that alternative architectures "may reduce or eliminate demand for some of our offerings". Component exposure is real too: the filing discloses "inflationary pressure and supply chain constraints beginning in the second half of fiscal 2026, resulting in increased costs for memory and other components, which have affected our gross margins", and names NAND among the components whose supply can tighten. This is a durable second place built on software stickiness, not a structural monopoly.

Amkor is a back-end contractor; the 10-K says "We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test and drop shipment services." It also says "Our customers include most of the world's largest semiconductor companies." Advanced Products (flip chip, memory and wafer-level packages) were 82.8% of its $6,708M in 2025 net sales. The durable part of its position is scale and a multi-country footprint, which the filing calls "a key differentiator", backed by multi-month customer qualification and customer relationships it dates back "over the last five decades". On Arizona, the filing says: "Construction began in the second half of 2025, and we believe that this investment will strengthen our ability to serve customers seeking to regionalize their supply chains and will enhance our participation in U.S. semiconductor initiatives." Price caps the moat. The 10-K says "We expect downward pressure on average selling prices for our packaging and test services to continue in the future, and this pressure may intensify during downturns in business." It also says foundries "substantially larger than us" have expanded their operations to include packaging and test services.

Chain position

Back-end contractor to the AI silicon chain: the 20-F ties its FOCoS, FOCoS-Bridge and 2.5D/3D lines to "ASICs and HBM for HPC, networking, server and AI/ML applications" and "AI accelerators for AI training", and warns that a slowdown in AI demand would leave "lower utilization rates for our specialized equipment".

NetApp sits between the memory supply and the enterprise data centre. Upstream, the FY2026 10-K says "Third-party component costs make up a significant portion of our product costs" and singles out NAND as hard to manage "if supplies of certain components, including NAND, become limited relative to demand". Downstream, the hyperscalers are channel, partner and rival at once: the filing states "We both partner with and compete against cloud service providers through our cloud-based software and services offerings", while Azure NetApp Files, Amazon FSx for NetApp ONTAP and Google Cloud NetApp Volumes are delivered as those clouds' own natively embedded services. Distribution is a mix of direct sales and "an ecosystem of partners, including the leading cloud providers".

Back-end packaging and test step between wafer fabs and chip vendors. The 10-K says "the wafers that we receive from our customers are generally consigned to us", and Amkor serves IDMs, fabless companies, OEMs and contract foundries that outsource packaging and test.

Products (share / barrier)
  • Electronic manufacturing services (USI Group) Challenger · Low source: sec.gov
  • Leading-edge advanced packaging (FOCoS, FOCoS-Bridge, 2.5D/3D IC, co-packaged optics) Top 3 · Deep source: sec.gov
  • Semiconductor packaging services Top 3 · Moderate source: sec.gov
  • Semiconductor testing services Top 3 · Moderate source: sec.gov
  • System-in-Package (SiP) and module solutions Leader · Moderate source: sec.gov
  • 2.5D and high-density fan-out (HDFO) packaging for HPC/AI Unknown · Moderate source: sec.gov
  • Advanced system-in-package (SiP) modules Unknown · Moderate source: sec.gov
  • Mainstream wirebond, leadframe, power and MEMS packaging Unknown · Low source: sec.gov
  • Outsourced packaging and test (OSAT) services Top 3 · Moderate source: trendforce.com
  • Test services (wafer, package, burn-in and system-level test) Unknown · Moderate source: sec.gov
Long-horizon vote +0.05 at weight 0.20 · swarm neutral

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+0.13 at weight 0.20 · swarm neutral

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+0.05 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

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