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Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing Disco Corporation×CrowdStrike× add + AMD AMD+ ASE Technology Holding ASX+ ASM International ASMIY+ ASML ASML+ ASMPT ASMVY+ ASUSTeK Computer ASUUY+ Adobe ADBE+ Advantest ATEYY+ Alibaba Group BABA+ Alphabet GOOGL+ Amazon AMZN+ Ambarella AMBA+ Amkor Technology AMKR+ Amphenol APH+ AppLovin APP+ Apple AAPL+ Applied Digital APLD+ Applied Materials AMAT+ Applied Optoelectronics AAOI+ Arista Networks ANET+ Arm Holdings ARM+ Astera Labs ALAB+ Axcelis Technologies ACLS+ Baidu BIDU+ Bloom Energy BE+ Broadcom AVGO+ C3.ai AI+ CXMT 688825.SS+ Cadence Design Systems CDNS+ Camtek CAMT+ Celestica CLS+ Cerebras Systems CBRS+ ChipMOS Technologies IMOS+ Ciena CIEN+ Cipher Mining CIFR+ Cisco Systems CSCO+ Cloudflare NET+ Coca-Cola KO+ Coherent Corp COHR+ Comfort Systems USA FIX+ Constellation Energy CEG+ Core Scientific CORZ+ CoreWeave CRWV+ Corning GLW+ Credo Technology CRDO+ Datadog DDOG+ Deere & Company DE+ Dell Technologies DELL+ Digital Realty Trust DLR+ DigitalOcean DOCN+ Duolingo DUOL+ EMCOR Group EME+ Eaton ETN+ Eli Lilly and Company LLY+ Equinix EQIX+ Everpure, Inc. P+ Everspin Technologies MRAM+ Extreme Networks EXTR+ Fabrinet FN+ Flex FLEX+ FormFactor FORM+ GE Vernova GEV+ Gigabyte Technology 2376.TW+ GitLab GTLB+ GlobalFoundries GFS+ Hewlett Packard Enterprise HPE+ Hon Hai Precision (Foxconn) HNHPF+ Hua Hong Semiconductor 1347.HK+ Hut 8 HUT+ IBM IBM+ IREN IREN+ Intel INTC+ Inventec 2356.TW+ Iron Mountain IRM+ JCET Group 600584.SS+ JPMorgan Chase JPM+ Jabil JBL+ Johnson Controls International JCI+ KLA Corporation KLAC+ Kioxia Holdings KXIAY+ Kulicke & Soffa KLIC+ Lam Research LRCX+ Lattice Semiconductor LSCC+ Lenovo Group LNVGY+ Lumentum Holdings LITE+ MACOM Technology Solutions MTSI+ Macronix International 2337.TW+ Marvell Technology MRVL+ MaxLinear MXL+ MediaTek 2454.TW+ Meta Platforms META+ MiTAC Holdings 3706.TW+ Micron MU+ Microsoft MSFT+ MiniMax 0100.HK+ Moderna MRNA+ Modine Manufacturing MOD+ MongoDB MDB+ Montage Technology 688008.SS+ NVIDIA NVDA+ Nanya Technology 2408.TW+ Nebius Group NBIS+ NetApp NTAP+ Netflix NFLX+ Netlist NLST+ Nokia NOK+ Nova Ltd NVMI+ Onto Innovation ONTO+ Oracle ORCL+ Palantir Technologies PLTR+ Palo Alto Networks PANW+ Pegatron 4938.TW+ Penguin Solutions PENG+ Pfizer PFE+ Phison Electronics 8299.TWO+ Powell Industries, Inc. POWL+ Powerchip Semiconductor Manufacturing Corporation 6770.TW+ Powertech Technology 6239.TW+ Qualcomm QCOM+ Quanta Computer 2382.TW+ RELX plc RELX+ Rambus RMBS+ SAP SAP+ SK Hynix SKHY+ Salesforce CRM+ Samsung Electronics 005930.KS+ SanDisk SNDK+ Sanmina SANM+ Schneider Electric SBGSY+ Seagate Technology STX+ Semiconductor Manufacturing International Corporation 0981.HK+ Semtech SMTC+ ServiceNow NOW+ Silicon Motion Technology SIMO+ Snowflake SNOW+ SoundHound AI SOUN+ Space Exploration Technologies Corp. (SpaceX) SPCX+ Super Micro Computer SMCI+ Synopsys SNPS+ TE Connectivity TEL+ TSMC TSM+ Talen Energy TLN+ Tempus AI TEM+ Tencent Holdings TCEHY+ TeraWulf WULF+ Teradyne TER+ Tesla, Inc. TSLA+ The Walt Disney Company DIS+ Tokyo Electron 8035.T+ Tongfu Microelectronics 002156.SZ+ Tower Semiconductor TSEM+ Trane Technologies TT+ United Microelectronics Corporation UMC+ Vanguard International Semiconductor 5347.TWO+ Vertiv VRT+ Visa V+ Vistra VST+ Walmart WMT+ Western Digital WDC+ Winbond Electronics 2344.TW+ Wistron 3231.TW+ Wiwynn 6669.TW+ X-FAB Silicon Foundries XFAB.PA+ X-energy XE+ Zhipu AI 2513.HK+ nVent Electric NVT
Disco Corporation DSCSY ai moat: latest change 2026-04-22 CrowdStrike CRWD ai moat: latest change 2026-03-05
Moat rating wide

Third-party estimates put Disco's world share far ahead of any rival, and its own results show that share earning exceptional returns that have lasted for years. Gendai Business (Kodansha, 2025-12-30, https://gendai.media/articles/-/161100) puts Disco's world share at 70-80% in each of grinders, polishers and dicers. TechNews (2025-12-16), in an article built on a Nikkei report about new laser saws, says in its own closing paragraph, without attributing the figure to Nikkei, that Disco holds about 80% of semiconductor cutting equipment, and Morningstar's company profile estimates 60%-70% of the dicing and grinding industry as of 2025. The FY2025 results (2026-04-22) show gross profit margin of 70.1%, after 70.6% in FY2024 and 67.8% in FY2023, plus an operating income margin of 42.3% and ROE of 25.1%. The four-year cumulative ordinary income margin was 41.4%, which the FY2025 financial review (https://www.disco.co.jp/eg/ir/library/doc/fr/fr20260422.pdf) says met Disco's goal of 20% or more 'for 10 consecutive years'. The technology risk Disco names on its risk-factor page (https://www.disco.co.jp/eg/ir/mginfo/risk.html) is a new method that could replace its core tooling: 'If a processing technology emerges to challenge precision diamond tooling in the future', its performance may be adversely affected. It says it is developing laser and plasma processing for materials that are difficult to process with precision diamond tooling. None of the share sources states its methodology.

source: disco.co.jp

narrow

Narrow rather than wide because the FY2026 10-K argues both ways and its own risk factors are the harder side: it describes a self-reinforcing data advantage and says "we do not believe any of our competitors currently have a true platform offering equivalent to the Falcon platform", but the same filing calls the market for security and IT operations solutions "intensely competitive, fragmented", warns that "Competitive pricing pressure may reduce our gross profits", and still carries the July 19 Incident as having "had, and is expected to continue to have, an adverse effect on our business, sales, customer and partner relations, reputation" more than two years after it occurred.

source: sec.gov

Moat type intangibles ip

Disco's Business page (https://www.disco.co.jp/eg/ir/mginfo/bg_business.html) says its 'greatest strength lies in our four distinct business fields, each interwoven to provide total solutions'. The four are diamond-abrasive consumables, made since 1937, with 'tens of thousands of blades and grinding/polishing wheels in our inventory'; precision processing equipment, most of it 'customized to meet our customers' wide ranging requirements'; application know-how; and after-sales service. The application know-how comes from laboratories, including 70-plus private test booths at the Tokyo head office, where engineers 'perform test cuts with the materials provided by the customer in order to recommend solutions'. The page calls providing 'the best processing results in the form of our processing solutions' 'the core element offered by DISCO'. The June 2026 Top Message (https://www.disco.co.jp/eg/ir/mginfo/message.html) keeps manufacturing in-house as 'a source of technological innovation, market responsiveness, and competitiveness'. The asset is accumulated process know-how spanning tool, machine and processing parameters. The pages cite no patent count.

source: disco.co.jp

network effects

The 10-K states the mechanism directly: "The more data that is fed into our Falcon platform, the more intelligent the AI Security Cloud becomes, the stronger our ability to anticipate and counter evolving adversary tradecraft, and the more our customers benefit, creating a powerful network effect that increases the overall value we provide."

source: sec.gov

Leadership clear leader

Third-party estimates agree that Disco leads by a wide margin. Gendai Business (Kodansha, 2025-12-30) puts its world share at 70-80% in each of grinders, polishers and dicers. TechNews (2025-12-16, https://technews.tw/2025/12/16/disco-three-equipment/), in an article built on a Nikkei report, calls it in its own closing paragraph the global leader in semiconductor cutting equipment with about 80%; it does not attribute that figure to Nikkei. Morningstar's profile (https://www.morningstar.com.au/investments/security/fra/D65/summary) calls it 'the world's largest manufacturer of semiconductor-grade saws and grinders' with an estimated 60%-70% share as of 2025. Disco's own IR pages (https://www.disco.co.jp/eg/ir/mginfo/msg_share.html) give no share figure and say growth in scale, 'including sales figures and global shares', 'is not our goal'. None of the articles names its data source.

source: disco.co.jp

co leader

Co-leader rather than clear leader because the only claim of platform primacy available is the company's own ("we do not believe any of our competitors currently have a true platform offering equivalent"), while the same 10-K describes a fragmented market and lists seven distinct categories of competitor, from legacy antivirus to network security, cloud security, identity and legacy SIEM vendors.

source: sec.gov

Pricing power strong

Gross profit margin was 67.8% in FY2023, 70.6% in FY2024, 70.1% in FY2025 and 71.3% in the April-June 2026 quarter, with a FY2025 operating income margin of 42.3%. Disco attributes the FY2025 dip to 'changes in the product and application mix' and says the margin 'Remained at a high level'. It attributes part of the 1Q FY2026 rise to 'favorable exchange rates' as well as 'high-value-added products'. A company-wide gross margin near 70% across three fiscal years is the pricing evidence; Disco publishes no list-price data.

source: disco.co.jp

moderate

The 10-K's risk factors state that "Competitive pricing pressure may reduce our gross profits" and that competing successfully may require "aggressive pricing", which is the company's own case against strong pricing power; the offsetting factor it cites is module consolidation on one sensor.

source: sec.gov

Summary

Disco makes the machines that thin wafers (grinders and polishers) and cut them into chips (blade dicing saws and laser saws), plus the diamond blades and wheels those machines use up. FY2025 (the year to March 2026) net sales were a record 436.9 billion yen, up 11.1%, with operating income of 185.0 billion yen. The results attribute the sales growth to 'an increase in shipments for generative AI'. Demand for 'advanced logic and HBM (High Bandwidth Memory)' stayed high, while power-semiconductor demand was sluggish as EV demand slowed. Grinder shipments rose 17% in FY2025 against 1% for dicers, and IC applications were 76% of fourth-quarter grinder shipments. Consumables were 21% of FY2025 shipments. In the April-June 2026 quarter their sales hit a record 'Due to higher customer facility operation rates and favorable exchange rates', a recurring stream tied to machine usage. In that quarter net sales rose 27.1% to 114.3 billion yen at a 71.3% gross profit margin. Disco discloses forecasts only one quarter ahead because of 'drastic and rapid fluctuations in customer willingness to invest'. Its risk factors name a technology that could 'challenge precision diamond tooling' as a threat to the business.

A single lightweight sensor collects enterprise data once and reuses it across 33 cloud modules, and the pooled telemetry trains the models every customer is then defended by — the 10-K calls this crowdsourced, high-fidelity data "cloud-scale AI" and treats it as the fundamental differentiator from competitors.

Chain position

Upstream back-end equipment and consumables supplier to chipmakers and packaging houses. In the April-June 2026 quarter, IC applications were 70% of dicer shipments and 79% of grinder shipments, and Asia took 82% of sales: Taiwan 34%, China 27% (including local factories of foreign manufacturers) and Korea 11%.

AI-native security platform — an adopter and reseller of AI rather than a supplier of AI infrastructure.

Products (share / barrier)
Long-horizon vote +0.42 at weight 0.20 · swarm bearish

Editorial prior, not backtested.

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+0.13 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

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