Compare moats

The FY2026 10-K (filed 2026-08-27) shows IREN holds an input the industry competes on: it names 'access to secured and energized power' first among what it believes are the principal competitive factors in its industry, and reports 'executed grid connection agreements, letters of agreement or equivalents representing approximately 5GW of total power capacity' in the United States, Canada, Spain and Australia as of June 30, 2026. It does not claim an advantage over rivals in that input. It says 'Certain competitors may have access to more competitively priced power, a greater access to power and a better capacity to timely secure grid connections,' and 'Many of our competitors have greater financial, technical or commercial resources, longer cloud operating histories or larger customer bases, compared to us.' Operating AI Cloud Services capacity was approximately 40MW at June 30, 2026, and the stored XBRL fundamentals from this 10-K show an FY2026 operating loss of about $1,046.7M on revenue of about $707.0M, so no durable advantage is yet demonstrated.

source: sec.gov

The FY2025 10-K's own competitive-strengths list leads with "leading brands with high levels of consumer recognition and loyalty" and "a worldwide network of bottlers and distributors of Company products", and the trademarks behind those brands are "valid as long as they are in use and/or their registrations are properly maintained" — an IP right the filing gives no expiry. Gross margin rose 59.5% to 61.1% to 61.6% across FY2023-FY2025 on the XBRL in the same annual filings, in an industry the filing itself calls "highly competitive".

source: sec.gov

The FY2025 20-F argues ASEH out-competes IDM in-house lines because serving "a large base of customers across a wide range of products" lets it "reduce costs and shorten production cycles through high-capacity utilization and process expertise" and gives its equipment "a longer useful life" — a real but bounded edge, since the same filing calls the global packaging and testing market "highly competitive", notes "most of our customers obtain services from more than one source", flags foundry encroachment ("TSMC has offered advanced packaging technologies such as integrated fan-out"), and warns that "some of our competitors may have superior financial, marketing, manufacturing, research and development and technological resources than we do", offering P.R.C. government support of its domestic semiconductor companies as the example.

source: sec.gov

The FY2026 10-K's asserted advantage is control from owning its data centers, 'including the associated land, grid connections and substations', which it believes allows it 'to benefit from more sustainable cash flows and operational flexibility relative to operators that rely upon third-party colocation services or short-term land leases'. Its only scale language is a belief that its 'procurement scale, deployment experience and direct control over the data center layer' lets it bring new compute into service 'rapidly and at scale', a deployment-speed claim, and it 'generally target[s]' regions with 'low-cost and attractive renewable energy sources', a siting target rather than a demonstrated cost position. It does not claim a cost or scale lead: it says 'Many of our competitors are larger, have longer operating histories and significantly greater resources than we do' and that certain competitors 'may have access to more competitively priced power, a greater access to power and a better capacity to timely secure grid connections.' There is no network effect or lock-in either, since existing contracts have 'terms ranging from month to month up to five years'. No enumerated moat source is grounded.

source: sec.gov

The filing locates the durable assets in intellectual property rather than scale: "our sparkling beverage and other beverage formulas are among the important trade secrets of our Company", and "We also own numerous trademarks that are very important to our business", which are "valid as long as they are in use and/or their registrations are properly maintained" — unlike a patent, no fixed term.

source: sec.gov

The advantage the 20-F actually claims is unit economics from volume, not lock-in: specialization and "economies of scale by providing services to a large base of customers", high capacity utilization spreading "relatively high fixed costs", and equipment that lasts longer because of the breadth of the order book. Capital intensity reinforces it — the filing says "semiconductor businesses are capital intensive and require significant investment in expensive equipment manufactured by a limited number of vendors", with the equipment market itself "characterized by intense demand, limited supply, and long delivery cycles".

source: sec.gov

The 10-K lists IREN's competitors as hyperscalers (Amazon Web Services, Google Cloud, Microsoft Azure, Oracle Cloud) and specialized AI Cloud Services providers (CoreWeave, Nebius, Crusoe, Lambda, Nscale, SpaceX and others). It says IREN began providing AI Cloud Services in 2024 and cites its 'shorter operating history in AI Cloud Services relative to some competitors', and states 'Some of our competitors have longer operating histories, larger customer bases, more comprehensive IP portfolios and patent protections, more design wins, and greater financial, sales, marketing and distribution resources than we do.' Operating AI Cloud Services capacity was approximately 40MW at June 30, 2026. The filing describes a smaller, later entrant that trails some competitors on operating history, customer base and resources, with its progress so far resting on two anchor contracts (a ~$9.7B five-year Microsoft agreement and a ~$3.4B five-year NVIDIA contract) rather than any claimed category position.

source: sec.gov

The filing claims leading BRANDS but never category leadership, and names "PepsiCo, Inc." as "a primary competitor" in many countries, alongside Nestle S.A., Keurig Dr Pepper Inc., Danone S.A., Suntory Beverage & Food Limited, Anheuser-Busch InBev, Kirin Holdings, Heineken N.V., Diageo plc and Red Bull GmbH.

source: sec.gov

The 20-F calls ASEH "a leading provider of semiconductor manufacturing services in assembly and testing" and "a market leader in SiP technologies from design to assembly with high-volume manufacturing", and says it has "established ourselves as a leader through the successful introduction of leading-edge advanced packaging solutions, which have played a pivotal role in bringing advanced ASIC and HBM products to the marketplace" — but the hedged "we believe we are among the leaders in such packaging processes and technologies", alongside named consolidating rivals (Jiangsu Changjiang Electronics Technology/STATS ChipPAC, Amkor/J-Devices, Tianshui Huatian Technology/Unisem) and TSMC's InFO, describes shared rather than sole leadership.

source: sec.gov

The 10-K's risk factors state 'Our competitors' products, services and technologies may be cheaper or provide better functionality or features than ours, which has resulted and may in the future result in lower-than-expected selling prices or demand for our products.' They also say long-term contract pricing 'is generally fixed or agreed at the time of contracting', so if market pricing for comparable capacity rises during a contract's term 'we will not benefit from those increases with respect to capacity already committed under our existing long-term contracts', and that if customers suffer a downturn or discontinue its services it 'may be compelled to offer more flexible terms, lower our prices or risk losing a significant customer.' The stored XBRL fundamentals from this 10-K show FY2026 revenue of about $707.0M against an operating loss of about $1,046.7M, so there is no margin record yet that evidences pricing power.

source: sec.gov

Three consecutive years of gross-margin expansion — 59.5% (FY2023), 61.1% (FY2024), 61.6% (FY2025) — through an inflationary period. The filing discloses the countervailing force itself: competitive pressures "may restrict our and our bottlers' ability to increase prices".

source: sec.gov

The 20-F states the industry has "a general trend toward declining prices for products and services of a given technology over time" and that ASEH's own "average selling prices of our packaging and testing services have experienced sharp declines" under "intense price competition". FY2025 consolidated gross margin was 17.7% (up from 16.3%), and management attributes the gain to "higher packaging and testing revenue mix and higher factory utilization" rather than price; the EMS half earned a 9.2% gross margin on raw-material costs equal to 78.7% of EMS revenue, and the five largest customers supplied 46.5% of 2025 operating revenues.

source: sec.gov

Downstream AI-cloud operator: owns grid-connected data centers and deploys NVIDIA/AMD GPU systems it rents to hyperscalers, frontier labs, AI developers and enterprises (anchor customers Microsoft and NVIDIA).

Outside this graph's supply chain: an AI-adopting incumbent whose beverage business buys AI as a tool rather than supplying it.

Back-end contractor to the AI silicon chain: the 20-F ties its FOCoS, FOCoS-Bridge and 2.5D/3D lines to "ASICs and HBM for HPC, networking, server and AI/ML applications" and "AI accelerators for AI training", and warns that a slowdown in AI demand would leave "lower utilization rates for our specialized equipment".

• AI Cloud Services (bare metal and managed GPU compute) Unknown · Moderate source: sec.gov
• AI infrastructure software (Mirantis k0rdent AI) Unknown · Low source: sec.gov
• Bitcoin mining (in wind-down) Unknown · Low source: sec.gov
• Owned data centers and grid-connected power portfolio Unknown · Moderate source: sec.gov

• Alcohol ready-to-drink Unknown · Low source: sec.gov
• Trademark Coca-Cola Unknown · Deep source: sec.gov
• Trademark Sprite, Fanta and other sparkling brands Unknown · Deep source: sec.gov
• Water, sports, coffee and tea Unknown · Moderate source: sec.gov

• Electronic manufacturing services (USI Group) Challenger · Low source: sec.gov
• Leading-edge advanced packaging (FOCoS, FOCoS-Bridge, 2.5D/3D IC, co-packaged optics) Top 3 · Deep source: sec.gov
• Semiconductor packaging services Top 3 · Moderate source: sec.gov
• Semiconductor testing services Top 3 · Moderate source: sec.gov
• System-in-Package (SiP) and module solutions Leader · Moderate source: sec.gov

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Editorial prior, not backtested.

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