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Compare moats

Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing United Microelectronics Corporation×Qualcomm×CXMT× maximum of 3 — remove one to swap
United Microelectronics Corporation UMC ai moat: latest change 2026-04-30 Qualcomm QCOM ai moat: latest change 2026-07-29 CXMT 688825.SS ai moat: latest change 2026-08-29
Moat rating narrow

The FY2025 20-F Competition section cuts both ways: UMC calls itself "one of the world's largest independent semiconductor foundries" with production capacity "currently among the largest of all semiconductor foundries in the world" and says it believes it competes favorably with competitors on each principal element of foundry competition, yet in the same section concedes that "[s]ome of our competitors have substantially greater production, financial, research and development and marketing resources than we have" and that "several new dedicated foundries have commenced operations and compete directly with us," whose entry is "likely to initiate a trend of competitive pricing and create potential overcapacity in legacy technology" that "may erode our profit margins." A real but bounded advantage, not a durable wide one.

source: sec.gov

narrow

Qualcomm's advantage is real but concentrated in one segment. The FY2025 10-K (filed 2025-11-05) describes its portfolio as "the most widely and extensively licensed in the industry" and says the industry "generally recognizes that any company seeking to develop, manufacture and/or sell certain cellular products requires a license or other rights to use our patents". That licensing leg produced $5,582M of FY2025 revenue against $38,367M at QCT, where Apple, Samsung and Xiaomi are all named in the vertical-integration risk factor and Apple already "utilizes its own modem... in certain of its smartphones". The filing frames the QCT loss as expected rather than realised.

source: sec.gov

none

CXMT's 2026 interim report (published 2026-08-29) names scale and IDM technology as core competencies, but also concedes gaps. It says that compared with the leading international manufacturers the Company 'still has a certain gap in overall scale, technology accumulation and customer resources' (与国际头部厂商相比,公司在整体规模、技术积累、客户资源等方面仍然存在一定差距). It describes its scale effect as 'gradually emerging' (逐步显现), and its gross-margin risk covers the case where the scale effect cannot materialise over the long term (公司规模效应长期无法显现). Its excess returns span a single shortage. The retained-earnings note shows an accumulated deficit of ¥36.65bn entering 2026, after ¥1.87bn of 2025 net profit attributable to the parent, and the first-half 2025 net loss attributable to shareholders was ¥2.33bn. Then first-half 2026 revenue rose 873.64%, which the report attributes to the global DRAM supply shortage, higher prices and sharply higher volumes, and the main-business gross margin reached 84.84%.

source: static.cninfo.com.cn

Moat type intangibles ip

The 20-F states plainly that "Our success depends on our ability to obtain patents, licenses and other intellectual property (IP) rights covering our production processes and activities," and reports more than 16,700 patents worldwide as of December 31, 2025, of which more than 7,490 are in the U.S., 623 domestic and foreign patents granted in 2025 alone, NT$17,725 million of R&D (7.5% of operating revenues) and 1,591 R&D professionals. The Competition section names where UMC believes it wins: it competes favorably "particularly [on] our technical competence and research and development capabilities." The proprietary specialty-process library, not scale or a network, is the cited source of the advantage.

source: sec.gov

intangibles ip

The durable asset is intellectual property accumulated since Qualcomm's founding "in 1985". The patents have "broad coverage in many countries, including Brazil, China, India, Japan, South Korea, Taiwan, the United States and countries in Europe" and are licensed "to hundreds of companies on industry-accepted terms", with royalties set as "a percentage of the wholesale (i.e., licensee's) selling price... subject to per unit minimums and/or per unit caps". R&D of $9,042M equalled 20% of revenues. Manufacturing is fabless "other than for certain of our RFFE modules and RF filter products", for which Qualcomm owns fabs in Germany and Singapore.

source: sec.gov

none

On the report's own evidence, no candidate moat source qualifies. Cost scale: the report calls DRAM a highly standardised product (高度标准化的产品) in which the cost advantage of scale is a core competency. But CXMT ranks fourth globally by capacity, and the report, calculating on sales, puts Samsung, SK hynix and Micron at 33.96%, 34.48% and 23.41% of the 2025 global DRAM market, so the scale advantage lies with the leaders. IP: it reports 4,484 domestic patents (3,744 of them invention patents) and 3,400 overseas patents as of 2026-06-30. Yet it describes its core technology as reaching 'international advanced level' (国际先进水平) and flags possible IP disputes with competitors. Switching costs: ¥133.48bn of ¥150.31bn first-half 2026 revenue went through distributors, who under the report's revenue note decide their own resale prices.

source: static.cninfo.com.cn

Leadership fast follower

UMC describes a deliberate follow strategy in the 20-F: it intends "to avoid investments in technologies that do not present commercial potential for volume production" and believes "it is beneficial to defer investment in premature equipment needed to claim the earliest advanced technology and instead to purchase more advanced and less expensive versions of such equipment from vendors who design this equipment based on pre-production lessons learned from the earliest technology." The node ladder bears this out: the most advanced process in production in 2025 is Fab 12A's 0.014 micron, wafers at 14 nanometers and under rounded to 0.0% of wafer sales in each of 2023, 2024 and 2025, and the next rung — UMC's own 12nm FinFET process, which Intel replicated in 2025 "based on our electrical design rules and UMC-verified process" for manufacture at its Arizona fab — is only "expected to begin in 2027."

source: sec.gov

co leader

Leadership is clear in licensing and contested in silicon. The 10-K names no rival licensing programme and asserts the portfolio is "the most widely and extensively licensed in the industry", while calling QCT's industries "intensely competitive" and naming eleven competitors (Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP, Qorvo, Samsung, Skyworks, TI, UNISOC); "continue to be a leader in mobile" appears in a list of things future success depends on, so it reads as aspiration, not share. The band therefore rests on the licensing leg, roughly 13% of revenue. FY2025 10%-plus customers were 21%, 20% and 13%; in 9M FY2026 only two cleared 10%.

source: sec.gov

fast follower

TrendForce (2026-09-24) reports that CXMT's global DRAM revenue share rose to 9.5% in 2Q26 from 7.6% in 1Q26, 'placing it fourth behind Samsung at 39.4%, SK hynix at 24.9%, and Micron at 23.3%'. It is catching up through generation-skipping R&D. The interim report had its fifth process platform in customer certification, and a voluntary disclosure on 2026-09-21 announced that platform's mass production, adding that its products are not yet in scale sales and yields need time to ramp. TrendForce's listing analysis (2026-07-28) still says CXMT 'still trails Samsung, SK hynix, and Micron in advanced processes, product performance, yields, and certification by high-end customers'.

source: static.cninfo.com.cn

Pricing power weak

The 20-F claims no premium — "our current level of pricing is comparable to that of other leading foundries in each respective geometry" — and reports that 2025 average selling price declined 5.4%, driving gross margin down from 32.6% in 2024 to 29.0% in 2025 even as 12-inch-equivalent wafer shipments rose from 3,446 thousand to 3,870 thousand and average capacity utilization improved from 68.7% to 75.2%. It also notes that "[p]rices for wafers of a given level of technology generally decline over the processing technology life cycle."

source: sec.gov

moderate

QTL margins held at 72% in FY2025 and 73% in 9M FY2026, though Q3 FY2026 alone slipped to 69% from 71%, and the $111M revenue gain there is attributed to revenues per unit "primarily driven by favorable mix" rather than to price. At QCT, the fall to 26% from 30% is explained by "lower gross margin, primarily driven by higher product cost, partially offset by higher average selling prices" plus lower revenues, so the pressure is cost rather than price; FY2025 handsets rose $2,930M, of which $2.5B came from higher revenue per chipset. Against that, "declining average selling prices" is a standing risk-factor title, "particularly pronounced in emerging regions and China".

source: sec.gov

weak

CXMT is a price taker riding the cycle. The interim report attributes first-half revenue growth to the global DRAM supply shortage, rising prices and sharply higher volumes. It records industry prices between 2015 and 2025 as high as $7.89/GB and as low as $1.78/GB in first-half 2023, and it states that the continued steep price rise is not sustainable. Main-business revenue was ¥15.22bn against cost of ¥13.29bn in first-half 2025, and ¥150.04bn against ¥22.75bn in first-half 2026. Most sales go through distributors, who set their own resale prices.

source: static.cninfo.com.cn

Summary

UMC's durable asset is a proprietary mature- and specialty-node process library — 55/40/28/22nm embedded memory for MCU and automotive, 55/40/28/22/14nm embedded high-voltage for display drivers, 110/55nm BCD for power management, 55/28/22nm BSI-CSI for image sensors and 110/90/55/40nm RF-SOI — backed by more than 16,700 patents worldwide at end-2025 and 7.5% of revenue spent on R&D. That library keeps a concentrated customer base qualified into UMC's fabs (top ten customers were 57.0% of 2025 operating revenues; Texas Instruments, Intel, MediaTek, Realtek and Novatek are named as primary customers). What it does not buy is price: 2025 average selling price fell 5.4% and gross margin fell from 32.6% to 29.0%, while the filing warns that new dedicated foundries are likely to initiate competitive pricing and overcapacity in legacy technology.

Qualcomm has two legs pointing in opposite directions. QTL (FY2025 revenue $5,582M, EBT margin 72%) rests on a portfolio the 10-K calls "the most widely and extensively licensed in the industry", with royalties struck on the licensee's wholesale device price under per-unit minimums and caps; its durability is dated in the filing, since "our patent license agreements with key OEMs are generally long-term, with terms expiring at varying dates between fiscal 2027 and 2031", some with binding-arbitration renewal clauses, and Huawei's licence has already expired, removing its royalties from QTL revenue from Q2 FY2025. QCT ($38,367M, 87% of segment revenue) is the leg under pressure: its three 10%-plus customers all build their own silicon, Apple already ships its own modem, and QCT EBT margin fell to 26% in Q3 FY2026 from 30%.

CXMT (ChangXin) is a Hefei-based IDM that designs and fabricates DDR5 and LPDDR4X/LPDDR5/5X/LPDDR6 memory and sells DRAM wafers, chips and modules. Its 2026 interim report says it reached its fourth process platform through a 'generation-skipping' (跳代研发) R&D strategy, and that it ranks first in China and fourth globally by shipments and sales. First-half 2026 revenue was ¥150.31bn (DDR series ¥69.47bn, LPDDR series ¥78.19bn), with a main-business gross margin of 84.84%. TrendForce puts its 2Q26 DRAM revenue share at 9.5%, up from 7.6% in 1Q26. The position is real but recent. The report concedes gaps to the three leaders in scale, technology and customers. The customers it names are Alibaba Cloud, ByteDance, Tencent, Lenovo, Xiaomi, Transsion, Honor, OPPO and vivo. On 2026-06-08 the US Defense Department added its subsidiary ChangXin Memory to the Section 1260H list. TrendForce notes that export controls leave CXMT relying on DUV multiple patterning rather than EUV, and that its prospectus 'has not disclosed a clear mass-production timetable' for HBM. The report itself warns that the continued steep rise in DRAM prices is not sustainable (价格的持续大幅上涨不具备可持续性) as international makers add capacity.

Chain position

Mature- and specialty-node wafer supplier: 2025 wafer sales were 41.4% communication, 30.6% consumer and 11.6% computer, with the AI tie indirect — 2.5D silicon interposers with deep-trench capacitors shipped to major customers for HPC, cloud computing and LLM applications.

Every figure and quotation is drawn from the FY2025 10-K and the Q3 FY2026 10-Q. Where the filings state no market share, the share band is left unknown rather than inferred, and barrier bands follow the filings' own language, which states a barrier to entry only for automotive.

Upstream DRAM IDM selling wafers, chips and modules to server, smartphone, PC and automotive makers, mostly through distributors (¥133.48bn of ¥150.31bn first-half 2026 revenue).

Products (share / barrier)
  • 12-inch 28nm/22nm logic and specialty foundry Challenger · Moderate source: sec.gov
  • 12-inch silicon photonics Unknown · Moderate source: sec.gov
  • 2.5D silicon interposer and 3D hybrid bonding Unknown · Moderate source: sec.gov
  • 8-inch and legacy-node foundry (0.11 micron and above) Challenger · Moderate source: sec.gov
  • Embedded non-volatile memory platforms (eFlash, RRAM, MRAM) Unknown · Deep source: sec.gov
  • Specialty mixed-signal platforms (eHV, BCD, BSI-CSI, RF-SOI) Unknown · Moderate source: sec.gov
Long-horizon vote -0.01 at weight 0.20 · swarm neutral

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+0.13 at weight 0.20 · swarm bearish

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-0.06 at weight 0.20 · swarm bullish

Editorial prior, not backtested.

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