Skip to content

Compare moats

Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing Wistron×Amkor Technology× add + AMD AMD+ ASE Technology Holding ASX+ ASM International ASMIY+ ASML ASML+ Adobe ADBE+ Advantest ATEYY+ Alibaba Group BABA+ Alphabet GOOGL+ Amazon AMZN+ Amphenol APH+ AppLovin APP+ Apple AAPL+ Applied Digital APLD+ Applied Materials AMAT+ Applied Optoelectronics AAOI+ Arista Networks ANET+ Arm Holdings ARM+ Astera Labs ALAB+ Bloom Energy BE+ Broadcom AVGO+ C3.ai AI+ CXMT 688825.SS+ Cadence Design Systems CDNS+ Celestica CLS+ Cerebras Systems CBRS+ Ciena CIEN+ Cisco Systems CSCO+ Cloudflare NET+ Coca-Cola KO+ Coherent Corp COHR+ Constellation Energy CEG+ CoreWeave CRWV+ Corning GLW+ Credo Technology CRDO+ CrowdStrike CRWD+ Datadog DDOG+ Dell Technologies DELL+ Digital Realty Trust DLR+ Duolingo DUOL+ Eaton ETN+ Eli Lilly and Company LLY+ Equinix EQIX+ Everpure, Inc. P+ Fabrinet FN+ GE Vernova GEV+ GitLab GTLB+ GlobalFoundries GFS+ Hewlett Packard Enterprise HPE+ Hon Hai Precision (Foxconn) HNHPF+ Hut 8 HUT+ IBM IBM+ IREN IREN+ Intel INTC+ JPMorgan Chase JPM+ KLA Corporation KLAC+ Kioxia Holdings KXIAY+ Lam Research LRCX+ Lumentum Holdings LITE+ Marvell Technology MRVL+ MediaTek 2454.TW+ Meta Platforms META+ Micron MU+ Microsoft MSFT+ Moderna MRNA+ MongoDB MDB+ Montage Technology 688008.SS+ NVIDIA NVDA+ Nebius Group NBIS+ NetApp NTAP+ Netflix NFLX+ Nokia NOK+ Oracle ORCL+ Palantir Technologies PLTR+ Palo Alto Networks PANW+ Penguin Solutions PENG+ Pfizer PFE+ Powell Industries, Inc. POWL+ Qualcomm QCOM+ SAP SAP+ SK Hynix SKHY+ Salesforce CRM+ Samsung Electronics 005930.KS+ SanDisk SNDK+ Schneider Electric SBGSY+ Seagate Technology STX+ ServiceNow NOW+ Snowflake SNOW+ SoundHound AI SOUN+ Space Exploration Technologies Corp. (SpaceX) SPCX+ Super Micro Computer SMCI+ Synopsys SNPS+ TE Connectivity TEL+ TSMC TSM+ Talen Energy TLN+ Tempus AI TEM+ Tencent Holdings TCEHY+ Teradyne TER+ Tesla, Inc. TSLA+ The Walt Disney Company DIS+ Tokyo Electron TOELY+ Trane Technologies TT+ United Microelectronics Corporation UMC+ Vertiv VRT+ Visa V+ Vistra VST+ Walmart WMT+ Western Digital WDC+ Wiwynn 6669.TW+ X-energy XE
Wistron 3231.TW ai moat: latest change 2026-04-28 Amkor Technology AMKR ai moat: latest change 2026-02-20
Moat rating none

The 2025 annual report (English translation filed with TWSE 2026-04-28) shows scale without a protected return: revenue of NT$2.1865 trillion, up 108%, at a gross profit margin of 6.1% and a consolidated operating profit margin of 3.6%, with gross profit up 59.33% against net revenues up 108.39%. The report's own list of unfavorable factors opens with "Intense Price Competition and Declining Gross Profit Margins" and says the IT industry, "with its relatively low barriers to entry, has attracted numerous manufacturers, leading to fierce competition", while its key-buyer table puts Buyer A at 39.32%, Buyer E at 21.21% and Buyer I at 12.81% of 2025 net sales. A large, competitive incumbent whose own filing concedes the entry barriers are relatively low: no moat is claimable.

source: wistron.com

narrow

The FY2025 10-K describes a real but bounded edge. On the plus side, Amkor says "Our scale and geographic diversity allow us to qualify production at multiple sites, optimize asset utilization and absorb large orders that require quick turnaround." It also says "Amkor has built long-standing relationships with most of the world's leading semiconductor companies over the last five decades." And it says that "in line with industry practice, customers usually require us to pass a lengthy and rigorous qualification process that may take several months". It falls short of wide because the same filing calls the market "highly competitive", names ASE Technology, JCET Group and Powertech Technology as rivals, and says Amkor faces Asian providers "including companies with significantly greater processing capacity, financial resources". It also says foundries "substantially larger than us" have expanded into packaging and test, and that IDMs and foundries "may decide to shift some or all of their outsourced packaging and test services to internally sourced capacity". Returns are thin: MD&A gross margin was 14.0% in 2025, 14.8% in 2024 and 14.5% in 2023, with a 7.0% operating margin in 2025.

source: sec.gov

Moat type none

The report's "Competitive Niches" section lists operating capabilities rather than a durable barrier: an R&D team of "over 5,600 people", manufacturing bases in Taiwan, U.S.A., China, Mexico, Czech Republic, Vietnam and Malaysia, lean manufacturing, product quality, supplier relationships, global logistics and an experienced management team. None of these is a patent position or a customer lock-in: R&D expenses were 1.43% of 2025 revenue, the Company reports 120 U.S. and 122 Taiwan patents granted in 2025, and the niche section's description of brand clients "each comprising an equal share of our sales" sits beside a key-buyer table in which a single buyer took 39.32% of 2025 net sales.

source: wistron.com

cost scale

Part of the 10-K's cost/scale case applies to the whole industry, not to Amkor alone. It says packaging and test service providers "can typically use their assets to support a broad range of customers and multiple end markets, potentially generating more efficient use of their production assets and a more cost-effective solution", in contrast to IDMs running their own lines. The Amkor-specific support is its footprint, which it calls "a key differentiator", and its purchasing scale: "By leveraging our purchasing power and operational expertise, we look to secure favorable pricing and supply agreements for materials and equipment, further enhancing our competitive position." It adds: "We also negotiate worldwide pricing agreements with our major suppliers to take advantage of the scale of our operations." Against other OSATs the scale edge is limited, because Item 1A concedes Asian rivals "including companies with significantly greater processing capacity, financial resources". Multi-month customer qualification and long customer relationships add a secondary switching-cost element. IP is not the source: "Although our patents are an important element of our intellectual property strategy, we are not materially dependent on any one patent or any one technology."

source: sec.gov

Leadership at parity

Citing MIC (February 2026), the report puts the Company at approximately 18% of the roughly 135,350K notebooks, 24% of the 39,711K desktops and 22% of the 12,370K servers manufactured in Taiwan in 2025, and lists it among the major Taiwan ODMs in every category it charts (notebooks with Quanta, Compal, Inventec and Pegatron; servers with Hon Hai, Quanta, Inventec and MiTAC). It describes this only as "considerable market competitiveness" and claims no first-place rank.

source: wistron.com

co leader

The FY2025 10-K opens: "Amkor is the world's largest U.S. headquartered outsourced semiconductor assembly and test service provider (“OSAT”) and is a global leader in outsourced semiconductor packaging and test services." It claims to be a global leader, not the leader, and its one superlative is limited to U.S.-headquartered providers. It names ASE Technology, JCET Group and Powertech Technology as rivals. It concedes Asian competitors "including companies with significantly greater processing capacity, financial resources". About the key competitive factors it lists, it says only "We believe we are competitive in these areas."

source: sec.gov

Pricing power weak

2025 gross profit margin was 6.1% and consolidated operating profit margin 3.6%; gross profit rose 59.33% while net revenues rose 108.39%, so the margin narrowed. The report's first unfavorable factor is "Intense Price Competition and Declining Gross Profit Margins", and three buyers accounted for 39.32%, 21.21% and 12.81% of 2025 net sales.

source: wistron.com

weak

Item 1A of the FY2025 10-K says "Prices for packaging and test services have generally declined over time, and sometimes prices can change significantly in relatively short periods of time." It also says "We expect downward pressure on average selling prices for our packaging and test services to continue in the future, and this pressure may intensify during downturns in business." MD&A gross margin was 14.0% in 2025 against 14.8% in 2024 and 14.5% in 2023. The notes say the longer test-equipment depreciation life "reduced depreciation expense by approximately $59 million in 2024". Materials alone were 55.2% of 2025 net sales. The customer base is concentrated: the ten largest customers were 72% of 2025 net sales, with Apple at 29.8% and Qualcomm at 11.1%, and the filing flags "a reduction in orders or decrease in price from a significant customer" as a risk.

source: sec.gov

Summary

Wistron is a Taiwanese ODM whose business, per its 2025 annual report, "primarily covers the R&D, manufacturing, testing and after-sales services" of servers and AI computing devices, notebooks, desktops, monitors and other electronics, with 3C electronics at 98.5% of 2025 sales. Revenue more than doubled to NT$2.1865 trillion on what the Chairman's letter calls "triple-digit percentage growth in revenue from AI and general-purpose servers", and the report cites MIC data placing the Company at approximately 18% of Taiwan-made notebooks, 24% of desktops and 22% of servers in 2025. Against that, the gross profit margin was 6.1%, the report's own unfavorable factors name intense price competition, declining gross margins and relatively low barriers to entry, and three buyers took 39.32%, 21.21% and 12.81% of 2025 net sales. The long-term plan is to expand the proportion of higher-margin products such as AI computing devices and servers, and the manufacturing policy aims automation and AI-driven intelligent manufacturing at "higher-complexity, technically demanding product segments — expanding gross margins" — a stated path toward an advantage, not evidence that one exists yet.

Amkor is a back-end contractor; the 10-K says "We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test and drop shipment services." It also says "Our customers include most of the world's largest semiconductor companies." Advanced Products (flip chip, memory and wafer-level packages) were 82.8% of its $6,708M in 2025 net sales. The durable part of its position is scale and a multi-country footprint, which the filing calls "a key differentiator", backed by multi-month customer qualification and customer relationships it dates back "over the last five decades". On Arizona, the filing says: "Construction began in the second half of 2025, and we believe that this investment will strengthen our ability to serve customers seeking to regionalize their supply chains and will enhance our participation in U.S. semiconductor initiatives." Price caps the moat. The 10-K says "We expect downward pressure on average selling prices for our packaging and test services to continue in the future, and this pressure may intensify during downturns in business." It also says foundries "substantially larger than us" have expanded their operations to include packaging and test services.

Chain position

Contract designer-manufacturer for brand and cloud customers: the report describes "professional OEM services supporting clients with world renowned brands", lists CPUs, SSDs and DRAM as main materials, and among its 2025 R&D results lists GPU servers supporting NVIDIA B300, AMD MI355 and Intel Gaudi 3.

Back-end packaging and test step between wafer fabs and chip vendors. The 10-K says "the wafers that we receive from our customers are generally consigned to us", and Amkor serves IDMs, fabless companies, OEMs and contract foundries that outsource packaging and test.

Products (share / barrier)
  • 2.5D and high-density fan-out (HDFO) packaging for HPC/AI Unknown · Moderate source: sec.gov
  • Advanced system-in-package (SiP) modules Unknown · Moderate source: sec.gov
  • Mainstream wirebond, leadframe, power and MEMS packaging Unknown · Low source: sec.gov
  • Outsourced packaging and test (OSAT) services Top 3 · Moderate source: trendforce.com
  • Test services (wafer, package, burn-in and system-level test) Unknown · Moderate source: sec.gov
Long-horizon vote -0.06 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

see exactly how it voted →

+0.05 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

see exactly how it voted →