Compare moats
Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.
| MediaTek | Dell Technologies | ASE Technology Holding | |
|---|---|---|---|
| Moat rating | narrow Counterpoint's public quarterly AP-SoC table, published 8 September 2026, shows MediaTek first in all ten quarters it covers (Q1 2024 through Q2 2026), never below 31%, with the nearest rival never above 30% -- a sustained position, not one good quarter. What the same table does not show is a widening one: the share oscillates inside a 31% to 41% band, the Q1 readings step down 41% (2024), 38% (2025), 33% (2026), and the 31% of Q2 2026 matches the lows already set in Q4 2024 and Q4 2025 rather than breaking them; Q2-on-Q2 the series runs 34%, 36%, 31%. Counterpoint also records MediaTek's shipments down more than 30% year-over-year in the quarter, the mainstream and entry tiers hit by the memory shortage and the premium tier by a 'slowdown in sales of Dimensity 9000 series powered devices.' MediaTek's own 2Q26 remarks show the gross line holding and the operating line not: gross margin 46.2%, down only 0.1 percentage points sequentially and guided at 46% plus or minus 1.5 for Q3, while operating income fell 22.2% year-over-year on revenue up 1.2% as operating expenses rose to NT$47.4 billion from NT$44.5 billion. A first place held for ten quarters without extending it, and earning less on it, is defensible rather than compounding. | narrow The FY2026 10-K describes advantages that are real but shallow, and a revenue mix that is diluting them. It names them as 'our end-to-end solutions portfolio, go-to-market capabilities, supply chain, and global services' and calls the direct sales channel 'a significant competitive advantage', while conceding it faces 'ongoing product and price competition in all areas of our business from both branded and generic competitors' and, on components, that 'any disruption that may occur because of our dependence on single- or limited-source vendors would not disproportionately disadvantage us relative to our competitors' - i.e. no differentiated supply position. The filing's own margin table shows where the franchise actually earns: total gross margin fell from 23.8% of net revenue in Fiscal 2024 to 22.2% in Fiscal 2025 to 20.0% in Fiscal 2026, and inside that, product gross margin fell 17.5% to 15.8% to 13.7% while services gross margin rose 40.8% to 41.4% to 44.8%. Narrow rather than none, because the high-margin services and storage core is intact and its margin rate improved; narrow rather than wide, because the line that is growing carries a 13.7% product gross margin and the filing attributes the whole decline to it. | narrow The FY2025 20-F argues ASEH out-competes IDM in-house lines because serving "a large base of customers across a wide range of products" lets it "reduce costs and shorten production cycles through high-capacity utilization and process expertise" and gives its equipment "a longer useful life" — a real but bounded edge, since the same filing calls the global packaging and testing market "highly competitive", notes "most of our customers obtain services from more than one source", flags foundry encroachment ("TSMC has offered advanced packaging technologies such as integrated fan-out"), and warns that "some of our competitors may have superior financial, marketing, manufacturing, research and development and technological resources than we do", offering P.R.C. government support of its domestic semiconductor companies as the example. |
| Moat type | intangibles ip MediaTek manufactures nothing itself -- its 2Q26 remarks describe 'deep design-technology co-optimization (DTCO) with TSMC' and close collaboration with advanced-packaging partners -- so the durable asset cannot be plant scale, and the remarks do not claim customer lock-in either. They locate it in a reusable design library: 'Building on our industry-leading IP portfolio, we offer best-in-class, pre-validated subsystems solutions for memory, I/O, and connectivity' -- which, the company says, 'largely reduces design complexity and shortens time to market for our data center customers'. The same remarks itemise 448G SerDes with a Co-Package Copper system solution, CPO development on TSMC's COUPE platform, and an end-to-end 3.5D platform with 'best-in-class 3.5D IP, packaging, and design flows,' and say design wins come 'backed by our industry-leading IPs, deep ecosystem partnerships, and proven execution capabilities'. The spending behind that library shows in the cost line: operating expenses of NT$47.4 billion in the quarter against NT$44.5 billion a year earlier, with the Q3 operating expense ratio guided at 31% plus or minus 2 points. It is the same library MediaTek re-amortises across mobile, edge and now data-center ASIC. | cost scale The filing locates the advantage in scale of distribution and supply, not in proprietary rights. It states 'Our world-class supply chain operates at significant scale', describes a direct sales force plus a partner network that produced 'approximately 40% of our net revenue' in Fiscal 2026, and lists supply chain and global services among its competitive advantages. The IP alternative is ruled out in the same document: with 25,859 granted patents held at January 30, 2026, Dell still says 'we are not substantially dependent on any single patent or group of related patents.' | cost scale The advantage the 20-F actually claims is unit economics from volume, not lock-in: specialization and "economies of scale by providing services to a large base of customers", high capacity utilization spreading "relatively high fixed costs", and equipment that lasts longer because of the breadth of the order book. Capital intensity reinforces it — the filing says "semiconductor businesses are capital intensive and require significant investment in expensive equipment manufactured by a limited number of vendors", with the equipment market itself "characterized by intense demand, limited supply, and long delivery cycles". |
| Leadership | co leader Counterpoint has MediaTek ahead of every rival in all ten quarters of its public table -- 31% against Qualcomm's 23% and Apple's 19% in Q2 2026 -- but that count covers smartphone application processors only, and MediaTek's 2Q26 remarks put mobile phone at 41% of group revenue, no longer its largest business. Smart Edge Platforms is larger at 53%, and while the remarks claim 'continued market share gains across connectivity, computing and automotive products', no independent count of those positions appears in the sources used here. In data center MediaTek holds nothing yet: production of its first AI accelerator ASIC is scheduled for the fourth quarter of 2026, and 15% to 20% is a 2027 target raised from 10% to 15% a quarter earlier. Inside its core market the flagship tier is a stated plan rather than a claimed position -- a 2nm SoC launching in the third quarter and, 'together with ongoing engagements with global players, we will increase our presence continuously in the flagship smartphone market in 2027' -- while Counterpoint records MediaTek's premium-tier shipments declining on a 'slowdown in sales of Dimensity 9000 series powered devices.' | co leader The 10-K's only positioning claim is the unquantified 'Dell Technologies is a leader in the global technology industry'; it names no competitor and gives no share anywhere. The band therefore rests on disclosed absolute scale - ISG net revenue of 60,826m and CSG net revenue of 50,984m in Fiscal 2026, operations in over 170 countries - set against the filing's own admission that hyperscale Infrastructure-as-a-Service buyers 'often buy their infrastructure directly from original design manufacturers', which caps how much of the market Dell can lead at all. | co leader The 20-F calls ASEH "a leading provider of semiconductor manufacturing services in assembly and testing" and "a market leader in SiP technologies from design to assembly with high-volume manufacturing", and says it has "established ourselves as a leader through the successful introduction of leading-edge advanced packaging solutions, which have played a pivotal role in bringing advanced ASIC and HBM products to the marketplace" — but the hedged "we believe we are among the leaders in such packaging processes and technologies", alongside named consolidating rivals (Jiangsu Changjiang Electronics Technology/STATS ChipPAC, Amkor/J-Devices, Tianshui Huatian Technology/Unisem) and TSMC's InFO, describes shared rather than sole leadership. |
| Pricing power | moderate The 2Q26 remarks describe price as cost pass-through rather than capture: 'As rising costs across the supply chain have become an industry-wide reality, we are taking pricing actions to ensure these increases are appropriately reflected in our product pricing', with the full-year aim, 'through our disciplined pricing strategy', to 'deliver our full year gross margin within the current quarter guidance range' -- holding a band, not widening it. The realised figures show that defence working: gross margin 46.2%, down 0.1 percentage points sequentially, with Q3 guided at 46% plus or minus 1.5 points. The 2.9-point year-over-year decline is not an erosion rate; the company states it 'was mainly due to a one-time benefit in the year-ago quarter.' Holding a mid-40s gross margin through a market the company expects to decline 'by about 15% in units this year' is genuine discipline, but passing rising costs through to defend a guided band is not the ability to price above it. | weak The filing describes price-taking and its own tables confirm it. It reports 'ongoing product and price competition in all areas of our business from both branded and generic competitors' and says 'We closely monitor market pricing, including the effect of foreign exchange rate movements, in an effort to provide the best value for our customers.' Total gross margin fell from 23.8% of net revenue in Fiscal 2024 to 22.2% in Fiscal 2025 to 20.0% in Fiscal 2026, with product gross margin down to 13.7%; CSG operating margin fell three straight years (7.6%, 6.1%, 5.6% of segment revenue); and non-GAAP operating income as a percentage of net revenue 'decreased 10 basis points to 8.8%' even as revenue grew 19%. Consolidated operating margin did rise 70 basis points to 7.2%, but the filing credits a lower operating expense rate for that, not price. | weak The 20-F states the industry has "a general trend toward declining prices for products and services of a given technology over time" and that ASEH's own "average selling prices of our packaging and testing services have experienced sharp declines" under "intense price competition". FY2025 consolidated gross margin was 17.7% (up from 16.3%), and management attributes the gain to "higher packaging and testing revenue mix and higher factory utilization" rather than price; the EMS half earned a 9.2% gross margin on raw-material costs equal to 78.7% of EMS revenue, and the five largest customers supplied 46.5% of 2025 operating revenues. |
| Summary | MediaTek is the largest supplier of smartphone application processors by units and has been for as long as Counterpoint's public quarterly table runs. Across all ten quarters it covers, Q1 2024 through Q2 2026, MediaTek is first every time and never below 31%, while the nearest rival never clears 30%; in Q2 2026 it holds 31% against Qualcomm's 23%, Apple's 19%, UNISOC's 13%, Samsung's 9% and HiSilicon's 5%. That is a real, independently counted position, and it is the only part of MediaTek's business for which such a count exists in the sources used here. The same table is the clearest evidence that the position is being defended rather than extended. MediaTek's share moves inside a 31% to 41% band across the ten quarters, and the top of that band has come down -- 41% in Q1 2024, 38% in Q1 2025, 33% in Q1 2026 -- while the 31% of Q2 2026 matches the lows already set in Q4 2024 and Q4 2025 rather than breaking them; measured like for like against the same quarter a year earlier the series runs 34%, 36%, 31%. Counterpoint records MediaTek's shipments falling more than 30% year-over-year in the quarter -- hit in the mainstream and entry tiers by the memory shortage, and in the premium tier by a slowdown in Dimensity 9000 series devices -- while Samsung's Exynos climbed to 9% on Galaxy S26 base variants and mid-tier A-series wins. MediaTek's own 2Q26 remarks show the gross line holding and the operating line not: gross margin of 46.2%, down 0.1 percentage points sequentially and guided at 46% plus or minus 1.5 for the third quarter, against operating income down 22.2% year-over-year on revenue up 1.2%, with operating expenses of NT$47.4 billion against NT$44.5 billion a year earlier. Unit leadership held while the return on it did not. What MediaTek re-uses is design IP. It manufactures nothing itself -- the remarks describe deep design-technology co-optimization with TSMC and close work with advanced-packaging partners -- and they locate the durable asset in a pre-validated library of memory, I/O and connectivity subsystems, 448G SerDes with a Co-Package Copper system solution, CPO development on TSMC's COUPE platform, and an end-to-end 3.5D platform. The spending behind that library is visible in the cost line: operating expenses of NT$47.4 billion in the quarter against NT$44.5 billion a year earlier, with the Q3 operating expense ratio guided at 31% plus or minus 2 points against a gross margin guided at 46% plus or minus 1.5 -- an operating cost base running near a third of revenue. That library is now pointed at two adjacencies. Smart Edge Platforms -- connectivity, computing, automotive and TV SoCs -- is now the larger business, at 53% of revenue in Q2 against mobile's 41%, and grew 26% year-over-year while mobile fell 20%. And the company says it has built its first AI accelerator ASIC for a major US cloud customer, with production scheduled for the fourth quarter of 2026. One adjacency is a target and one is a contribution, and this profile treats them as exactly that. The data center share figure of 15% to 20% is a 2027 target against a served market MediaTek itself sizes at US$80 billion, raised from 10% to 15% only one quarter earlier, and production of the first ASIC was still scheduled for the fourth quarter at the date of the remarks. The RTX Spark AI PC work is corroborated by NVIDIA's own announcement, which credits MediaTek with collaborating on the custom CPU design and contributing to its power efficiency, performance and connectivity -- but the superchip, its Grace CPU, its NVLink-C2C interconnect and its software stack are NVIDIA's, and the systems ship from PC makers, so what MediaTek holds is a design contribution rather than a franchise with a share to count. The claimed share gains in connectivity, computing and automotive carry no number and no third-party count. The honest reading is a company with one durable, independently verified franchise it is holding rather than extending, funding a credible but still unproven move into higher-value silicon on the strength of its IP portfolio. | The AI-server line is enormous and it is not a moat - the FY2026 10-K says so in its own margin bridge. AI-optimized servers net revenue went 1,873m in Fiscal 2024 to 9,286m in Fiscal 2025 to 24,683m in Fiscal 2026 (+396% then +166%), lifting total ISG revenue to 60,826m (+40%). Over the same year ISG operating income as a percentage of segment revenue fell 110 basis points to 11.7% 'due to a decline in gross margin rate that outpaced the decline in operating expense rate. Gross margin rate decreased primarily as the result of a shift in mix towards our AI-optimized servers offerings', and the Fiscal 2027 outlook repeats the expectation of 'margin rate pressure resulting from a continuing shift in mix towards our AI-optimized servers offerings'. The cleanest test of pass-through is the filing's product-versus-services split: product net revenue grew 27% to 90,405m at a 13.7% gross margin (down from 15.8% and 17.5%), while services net revenue fell 4% to 23,133m at a 44.8% gross margin. The AI boom arrived entirely as thin product revenue and did not pull the profitable services book along with it. What Dell adds is described plainly as integration: it uses contract manufacturers, buys components from suppliers and 'subsequently sell[s] those components to the manufacturer', and its own 'manufacturing process consists of assembly, software installation, functional testing, and quality control'. The bypass is named too: 'We also face competition from non-traditional IT companies, including large Infrastructure-as-a-Service providers, that often buy their infrastructure directly from original design manufacturers. Competitive pressures could increase if customers choose to move existing workloads to these providers.' What survives as a moat is the part an ODM cannot sell an enterprise: a direct sales force and account teams, a global service and support footprint whose gross margin rate is still rising, storage that held revenue within 3% of flat through the whole mix shift, and Dell Payment Solutions financing that produces multiyear recurring arrangements. | ASEH sells turnkey assembly and test at a scale most captive IDM lines cannot match: the 20-F says it is "involved in all stages of the semiconductor manufacturing process except circuit design and wafer fabrication", and leans on Taiwan, "currently the largest center for outsourced semiconductor manufacturing in the world", plus a "strategic alliance with TSMC", to sit next to the foundries its customers already use. The durable part is cost position from utilization, not customer capture — the filing concedes customers multi-source and that foundries are moving into advanced packaging from above. |
| Chain position | A fabless designer sitting between its customers and the TSMC-centred manufacturing chain. The 2Q26 remarks describe 'deep design-technology co-optimization (DTCO) with TSMC' and close work with advanced-packaging partners to build 'high-performance ASICs across a broad range of very-large chip sizes using CoWoS and EMIB-T technologies' at nodes down to 2nm, and say MediaTek creates 'significant value beyond semiconductor by orchestrating other key components throughout the supply chain such as memory and substrate' -- a coordinator role as much as a design one. | Integrator between accelerator and component suppliers and enterprise or sovereign buyers: the 10-K says Dell purchases components from suppliers, sells them on to contract manufacturers, and performs 'assembly, software installation, functional testing, and quality control', then reaches customers through a direct sales force and a partner network that generated about 40% of Fiscal 2026 net revenue. | Back-end contractor to the AI silicon chain: the 20-F ties its FOCoS, FOCoS-Bridge and 2.5D/3D lines to "ASICs and HBM for HPC, networking, server and AI/ML applications" and "AI accelerators for AI training", and warns that a slowdown in AI demand would leave "lower utilization rates for our specialized equipment". |
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| Long-horizon vote | +0.13 at weight 0.20 · swarm neutral Editorial prior, not backtested. | +0.05 at weight 0.20 · swarm neutral Editorial prior, not backtested. | +0.05 at weight 0.20 · swarm neutral Editorial prior, not backtested. |