Compare moats
Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.
| MediaTek | Hon Hai Precision (Foxconn) | Amkor Technology | |
|---|---|---|---|
| Moat rating | narrow Counterpoint's public quarterly AP-SoC table, published 8 September 2026, shows MediaTek first in all ten quarters it covers (Q1 2024 through Q2 2026), never below 31%, with the nearest rival never above 30% -- a sustained position, not one good quarter. What the same table does not show is a widening one: the share oscillates inside a 31% to 41% band, the Q1 readings step down 41% (2024), 38% (2025), 33% (2026), and the 31% of Q2 2026 matches the lows already set in Q4 2024 and Q4 2025 rather than breaking them; Q2-on-Q2 the series runs 34%, 36%, 31%. Counterpoint also records MediaTek's shipments down more than 30% year-over-year in the quarter, the mainstream and entry tiers hit by the memory shortage and the premium tier by a 'slowdown in sales of Dimensity 9000 series powered devices.' MediaTek's own 2Q26 remarks show the gross line holding and the operating line not: gross margin 46.2%, down only 0.1 percentage points sequentially and guided at 46% plus or minus 1.5 for Q3, while operating income fell 22.2% year-over-year on revenue up 1.2% as operating expenses rose to NT$47.4 billion from NT$44.5 billion. A first place held for ten quarters without extending it, and earning less on it, is defensible rather than compounding. | narrow The advantage the company documents is real but sits almost entirely below the gross line: the 2Q26 release cites EMS market share that 'exceeds 40%', over 240 campuses across 24 countries and CNC/SMT automation 'close to 100%', while the same quarter's gross margin was 6.12% — 21 bps below 2Q25's 6.33% per the results deck — and operating margin was 3.75%. | narrow The FY2025 10-K describes a real but bounded edge. On the plus side, Amkor says "Our scale and geographic diversity allow us to qualify production at multiple sites, optimize asset utilization and absorb large orders that require quick turnaround." It also says "Amkor has built long-standing relationships with most of the world's leading semiconductor companies over the last five decades." And it says that "in line with industry practice, customers usually require us to pass a lengthy and rigorous qualification process that may take several months". It falls short of wide because the same filing calls the market "highly competitive", names ASE Technology, JCET Group and Powertech Technology as rivals, and says Amkor faces Asian providers "including companies with significantly greater processing capacity, financial resources". It also says foundries "substantially larger than us" have expanded into packaging and test, and that IDMs and foundries "may decide to shift some or all of their outsourced packaging and test services to internally sourced capacity". Returns are thin: MD&A gross margin was 14.0% in 2025, 14.8% in 2024 and 14.5% in 2023, with a 7.0% operating margin in 2025. |
| Moat type | intangibles ip MediaTek manufactures nothing itself -- its 2Q26 remarks describe 'deep design-technology co-optimization (DTCO) with TSMC' and close collaboration with advanced-packaging partners -- so the durable asset cannot be plant scale, and the remarks do not claim customer lock-in either. They locate it in a reusable design library: 'Building on our industry-leading IP portfolio, we offer best-in-class, pre-validated subsystems solutions for memory, I/O, and connectivity' -- which, the company says, 'largely reduces design complexity and shortens time to market for our data center customers'. The same remarks itemise 448G SerDes with a Co-Package Copper system solution, CPO development on TSMC's COUPE platform, and an end-to-end 3.5D platform with 'best-in-class 3.5D IP, packaging, and design flows,' and say design wins come 'backed by our industry-leading IPs, deep ecosystem partnerships, and proven execution capabilities'. The spending behind that library shows in the cost line: operating expenses of NT$47.4 billion in the quarter against NT$44.5 billion a year earlier, with the Q3 operating expense ratio guided at 31% plus or minus 2 points. It is the same library MediaTek re-amortises across mobile, edge and now data-center ASIC. | cost scale Rotating CEO Michael Chiang attributes the sustained operational performance to 'its global footprint and economies of scale', more than 240 sites in 24 countries, 'vertically integrated and highly automated operations' and 'a high in-house production ratio of key components'; the results deck's closing slide is titled 'Vertical integration of AI supply chain L1 to L12 optimizes cost structure'. | cost scale Part of the 10-K's cost/scale case applies to the whole industry, not to Amkor alone. It says packaging and test service providers "can typically use their assets to support a broad range of customers and multiple end markets, potentially generating more efficient use of their production assets and a more cost-effective solution", in contrast to IDMs running their own lines. The Amkor-specific support is its footprint, which it calls "a key differentiator", and its purchasing scale: "By leveraging our purchasing power and operational expertise, we look to secure favorable pricing and supply agreements for materials and equipment, further enhancing our competitive position." It adds: "We also negotiate worldwide pricing agreements with our major suppliers to take advantage of the scale of our operations." Against other OSATs the scale edge is limited, because Item 1A concedes Asian rivals "including companies with significantly greater processing capacity, financial resources". Multi-month customer qualification and long customer relationships add a secondary switching-cost element. IP is not the source: "Although our patents are an important element of our intellectual property strategy, we are not materially dependent on any one patent or any one technology." |
| Leadership | co leader Counterpoint has MediaTek ahead of every rival in all ten quarters of its public table -- 31% against Qualcomm's 23% and Apple's 19% in Q2 2026 -- but that count covers smartphone application processors only, and MediaTek's 2Q26 remarks put mobile phone at 41% of group revenue, no longer its largest business. Smart Edge Platforms is larger at 53%, and while the remarks claim 'continued market share gains across connectivity, computing and automotive products', no independent count of those positions appears in the sources used here. In data center MediaTek holds nothing yet: production of its first AI accelerator ASIC is scheduled for the fourth quarter of 2026, and 15% to 20% is a 2027 target raised from 10% to 15% a quarter earlier. Inside its core market the flagship tier is a stated plan rather than a claimed position -- a 2nm SoC launching in the third quarter and, 'together with ongoing engagements with global players, we will increase our presence continuously in the flagship smartphone market in 2027' -- while Counterpoint records MediaTek's premium-tier shipments declining on a 'slowdown in sales of Dimensity 9000 series powered devices.' | clear leader Company-stated: the release describes Hon Hai Technology Group as 'the world's largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500', with EMS market share that 'exceeds 40%' across its four product segments. No independent ranking is cited in the source. | co leader The FY2025 10-K opens: "Amkor is the world's largest U.S. headquartered outsourced semiconductor assembly and test service provider (“OSAT”) and is a global leader in outsourced semiconductor packaging and test services." It claims to be a global leader, not the leader, and its one superlative is limited to U.S.-headquartered providers. It names ASE Technology, JCET Group and Powertech Technology as rivals. It concedes Asian competitors "including companies with significantly greater processing capacity, financial resources". About the key competitive factors it lists, it says only "We believe we are competitive in these areas." |
| Pricing power | moderate The 2Q26 remarks describe price as cost pass-through rather than capture: 'As rising costs across the supply chain have become an industry-wide reality, we are taking pricing actions to ensure these increases are appropriately reflected in our product pricing', with the full-year aim, 'through our disciplined pricing strategy', to 'deliver our full year gross margin within the current quarter guidance range' -- holding a band, not widening it. The realised figures show that defence working: gross margin 46.2%, down 0.1 percentage points sequentially, with Q3 guided at 46% plus or minus 1.5 points. The 2.9-point year-over-year decline is not an erosion rate; the company states it 'was mainly due to a one-time benefit in the year-ago quarter.' Holding a mid-40s gross margin through a market the company expects to decline 'by about 15% in units this year' is genuine discipline, but passing rising costs through to defend a guided band is not the ability to price above it. | weak Gross margin was 6.12% in 2Q26 and 6.15% in 1H26, and the results deck shows the quarter 21 bps below 2Q25's 6.33% even as revenue grew 41% year-on-year; the group frames profitability against its own 3% operating-margin target, met at 3.67% in 1H26 — margins of that order leave little headroom to price above cost. | weak Item 1A of the FY2025 10-K says "Prices for packaging and test services have generally declined over time, and sometimes prices can change significantly in relatively short periods of time." It also says "We expect downward pressure on average selling prices for our packaging and test services to continue in the future, and this pressure may intensify during downturns in business." MD&A gross margin was 14.0% in 2025 against 14.8% in 2024 and 14.5% in 2023. The notes say the longer test-equipment depreciation life "reduced depreciation expense by approximately $59 million in 2024". Materials alone were 55.2% of 2025 net sales. The customer base is concentrated: the ten largest customers were 72% of 2025 net sales, with Apple at 29.8% and Qualcomm at 11.1%, and the filing flags "a reduction in orders or decrease in price from a significant customer" as a risk. |
| Summary | MediaTek is the largest supplier of smartphone application processors by units and has been for as long as Counterpoint's public quarterly table runs. Across all ten quarters it covers, Q1 2024 through Q2 2026, MediaTek is first every time and never below 31%, while the nearest rival never clears 30%; in Q2 2026 it holds 31% against Qualcomm's 23%, Apple's 19%, UNISOC's 13%, Samsung's 9% and HiSilicon's 5%. That is a real, independently counted position, and it is the only part of MediaTek's business for which such a count exists in the sources used here. The same table is the clearest evidence that the position is being defended rather than extended. MediaTek's share moves inside a 31% to 41% band across the ten quarters, and the top of that band has come down -- 41% in Q1 2024, 38% in Q1 2025, 33% in Q1 2026 -- while the 31% of Q2 2026 matches the lows already set in Q4 2024 and Q4 2025 rather than breaking them; measured like for like against the same quarter a year earlier the series runs 34%, 36%, 31%. Counterpoint records MediaTek's shipments falling more than 30% year-over-year in the quarter -- hit in the mainstream and entry tiers by the memory shortage, and in the premium tier by a slowdown in Dimensity 9000 series devices -- while Samsung's Exynos climbed to 9% on Galaxy S26 base variants and mid-tier A-series wins. MediaTek's own 2Q26 remarks show the gross line holding and the operating line not: gross margin of 46.2%, down 0.1 percentage points sequentially and guided at 46% plus or minus 1.5 for the third quarter, against operating income down 22.2% year-over-year on revenue up 1.2%, with operating expenses of NT$47.4 billion against NT$44.5 billion a year earlier. Unit leadership held while the return on it did not. What MediaTek re-uses is design IP. It manufactures nothing itself -- the remarks describe deep design-technology co-optimization with TSMC and close work with advanced-packaging partners -- and they locate the durable asset in a pre-validated library of memory, I/O and connectivity subsystems, 448G SerDes with a Co-Package Copper system solution, CPO development on TSMC's COUPE platform, and an end-to-end 3.5D platform. The spending behind that library is visible in the cost line: operating expenses of NT$47.4 billion in the quarter against NT$44.5 billion a year earlier, with the Q3 operating expense ratio guided at 31% plus or minus 2 points against a gross margin guided at 46% plus or minus 1.5 -- an operating cost base running near a third of revenue. That library is now pointed at two adjacencies. Smart Edge Platforms -- connectivity, computing, automotive and TV SoCs -- is now the larger business, at 53% of revenue in Q2 against mobile's 41%, and grew 26% year-over-year while mobile fell 20%. And the company says it has built its first AI accelerator ASIC for a major US cloud customer, with production scheduled for the fourth quarter of 2026. One adjacency is a target and one is a contribution, and this profile treats them as exactly that. The data center share figure of 15% to 20% is a 2027 target against a served market MediaTek itself sizes at US$80 billion, raised from 10% to 15% only one quarter earlier, and production of the first ASIC was still scheduled for the fourth quarter at the date of the remarks. The RTX Spark AI PC work is corroborated by NVIDIA's own announcement, which credits MediaTek with collaborating on the custom CPU design and contributing to its power efficiency, performance and connectivity -- but the superchip, its Grace CPU, its NVLink-C2C interconnect and its software stack are NVIDIA's, and the systems ship from PC makers, so what MediaTek holds is a design contribution rather than a franchise with a share to count. The claimed share gains in connectivity, computing and automotive carry no number and no third-party count. The honest reading is a company with one durable, independently verified franchise it is holding rather than extending, funding a credible but still unproven move into higher-value silicon on the strength of its IP portfolio. | Foxconn's own 2Q26 disclosure rests the business on scale and integration: over 240 campuses in 24 countries, EMS market share above 40%, CNC and SMT automation close to 100%, and an L1-to-L12 in-house chain for AI racks — high-speed cable, power busbars, sockets and connectors, enclosures, chassis, heatsinks, PCB/PCBA, compute and switch trays, manifolds, racks — which management says lets the group 'maintain sound operating efficiency and yields in the face of high unit price and highly complex AI products'. Cloud and networking products were 51% of 2Q26 revenue, the company says it 'continues to expand its market share in AI server racks', and its stated AI advantage is 'providing complete, end-to-end system solutions, rather than just single products'. The counterweight is in the same release: 6.12% gross margin and a 3.75% operating margin on NT$2.53 trillion of quarterly revenue. | Amkor is a back-end contractor; the 10-K says "We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test and drop shipment services." It also says "Our customers include most of the world's largest semiconductor companies." Advanced Products (flip chip, memory and wafer-level packages) were 82.8% of its $6,708M in 2025 net sales. The durable part of its position is scale and a multi-country footprint, which the filing calls "a key differentiator", backed by multi-month customer qualification and customer relationships it dates back "over the last five decades". On Arizona, the filing says: "Construction began in the second half of 2025, and we believe that this investment will strengthen our ability to serve customers seeking to regionalize their supply chains and will enhance our participation in U.S. semiconductor initiatives." Price caps the moat. The 10-K says "We expect downward pressure on average selling prices for our packaging and test services to continue in the future, and this pressure may intensify during downturns in business." It also says foundries "substantially larger than us" have expanded their operations to include packaging and test services. |
| Chain position | A fabless designer sitting between its customers and the TSMC-centred manufacturing chain. The 2Q26 remarks describe 'deep design-technology co-optimization (DTCO) with TSMC' and close work with advanced-packaging partners to build 'high-performance ASICs across a broad range of very-large chip sizes using CoWoS and EMIB-T technologies' at nodes down to 2nm, and say MediaTek creates 'significant value beyond semiconductor by orchestrating other key components throughout the supply chain such as memory and substrate' -- a coordinator role as much as a design one. | Builds and integrates the rack-level AI systems the cloud buildout ships in: cloud and networking products were 51% of 2Q26 revenue, NVIDIA Vera Rubin NVL72 was shown at COMPUTEX 2026, and the company said on 12 Aug 2026 that Vera Rubin racks were entering mass production in the third quarter. | Back-end packaging and test step between wafer fabs and chip vendors. The 10-K says "the wafers that we receive from our customers are generally consigned to us", and Amkor serves IDMs, fabless companies, OEMs and contract foundries that outsource packaging and test. |
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| Long-horizon vote | +0.13 at weight 0.20 · swarm neutral Editorial prior, not backtested. | +0.13 at weight 0.20 · swarm neutral Editorial prior, not backtested. | +0.05 at weight 0.20 · swarm neutral Editorial prior, not backtested. |