Compare moats
Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.
| MediaTek | Wiwynn | United Microelectronics Corporation | |
|---|---|---|---|
| Moat rating | narrow Counterpoint's public quarterly AP-SoC table, published 8 September 2026, shows MediaTek first in all ten quarters it covers (Q1 2024 through Q2 2026), never below 31%, with the nearest rival never above 30% -- a sustained position, not one good quarter. What the same table does not show is a widening one: the share oscillates inside a 31% to 41% band, the Q1 readings step down 41% (2024), 38% (2025), 33% (2026), and the 31% of Q2 2026 matches the lows already set in Q4 2024 and Q4 2025 rather than breaking them; Q2-on-Q2 the series runs 34%, 36%, 31%. Counterpoint also records MediaTek's shipments down more than 30% year-over-year in the quarter, the mainstream and entry tiers hit by the memory shortage and the premium tier by a 'slowdown in sales of Dimensity 9000 series powered devices.' MediaTek's own 2Q26 remarks show the gross line holding and the operating line not: gross margin 46.2%, down only 0.1 percentage points sequentially and guided at 46% plus or minus 1.5 for Q3, while operating income fell 22.2% year-over-year on revenue up 1.2% as operating expenses rose to NT$47.4 billion from NT$44.5 billion. A first place held for ten quarters without extending it, and earning less on it, is defensible rather than compounding. | narrow The 2025 annual report (published 2026-04-30) shows a real but shallow position: products deployed in "more than 750 hyperscale data centers" and, on the Company's own internally assessed shipment volume, "more than 10% of global server shipments and nearly 30% of global ODM-Direct server shipments" in 2025 — while the same report's own list of negative factors names "Excessive concentration of customers" and a market "getting more and more competitive", discloses three customers at 41.48%, 26.03% and 10.43% of 2025 net sales, and reports 2025 gross profit up 109.77% against revenue up 163.68% for an 8.3% gross margin. Defensible incumbency, not a durable one. | narrow The FY2025 20-F Competition section cuts both ways: UMC calls itself "one of the world's largest independent semiconductor foundries" with production capacity "currently among the largest of all semiconductor foundries in the world" and says it believes it competes favorably with competitors on each principal element of foundry competition, yet in the same section concedes that "[s]ome of our competitors have substantially greater production, financial, research and development and marketing resources than we have" and that "several new dedicated foundries have commenced operations and compete directly with us," whose entry is "likely to initiate a trend of competitive pricing and create potential overcapacity in legacy technology" that "may erode our profit margins." A real but bounded advantage, not a durable wide one. |
| Moat type | intangibles ip MediaTek manufactures nothing itself -- its 2Q26 remarks describe 'deep design-technology co-optimization (DTCO) with TSMC' and close collaboration with advanced-packaging partners -- so the durable asset cannot be plant scale, and the remarks do not claim customer lock-in either. They locate it in a reusable design library: 'Building on our industry-leading IP portfolio, we offer best-in-class, pre-validated subsystems solutions for memory, I/O, and connectivity' -- which, the company says, 'largely reduces design complexity and shortens time to market for our data center customers'. The same remarks itemise 448G SerDes with a Co-Package Copper system solution, CPO development on TSMC's COUPE platform, and an end-to-end 3.5D platform with 'best-in-class 3.5D IP, packaging, and design flows,' and say design wins come 'backed by our industry-leading IPs, deep ecosystem partnerships, and proven execution capabilities'. The spending behind that library shows in the cost line: operating expenses of NT$47.4 billion in the quarter against NT$44.5 billion a year earlier, with the Q3 operating expense ratio guided at 31% plus or minus 2 points. It is the same library MediaTek re-amortises across mobile, edge and now data-center ASIC. | switching costs The report's "Competitive niche" section locates the advantage in the customer program rather than in IP or unit cost: "highly customized solutions for hyperscale data centers", "end-to-end technical integration capabilities ranging from server design and system integration to large-scale L10/L11 rack-level delivery", and a one-stop service "covering product design, integration, optimization, deployment, and after-sales services" across a base of more than 750 hyperscale data centers. Every advantage the section claims is about integration work and customer proximity, none about patents or proprietary silicon, and an 8.3% gross margin is not the profile of a cost advantage; what is left is the friction in an installed, co-designed rack program. | intangibles ip The 20-F states plainly that "Our success depends on our ability to obtain patents, licenses and other intellectual property (IP) rights covering our production processes and activities," and reports more than 16,700 patents worldwide as of December 31, 2025, of which more than 7,490 are in the U.S., 623 domestic and foreign patents granted in 2025 alone, NT$17,725 million of R&D (7.5% of operating revenues) and 1,591 R&D professionals. The Competition section names where UMC believes it wins: it competes favorably "particularly [on] our technical competence and research and development capabilities." The proprietary specialty-process library, not scale or a network, is the cited source of the advantage. |
| Leadership | co leader Counterpoint has MediaTek ahead of every rival in all ten quarters of its public table -- 31% against Qualcomm's 23% and Apple's 19% in Q2 2026 -- but that count covers smartphone application processors only, and MediaTek's 2Q26 remarks put mobile phone at 41% of group revenue, no longer its largest business. Smart Edge Platforms is larger at 53%, and while the remarks claim 'continued market share gains across connectivity, computing and automotive products', no independent count of those positions appears in the sources used here. In data center MediaTek holds nothing yet: production of its first AI accelerator ASIC is scheduled for the fourth quarter of 2026, and 15% to 20% is a 2027 target raised from 10% to 15% a quarter earlier. Inside its core market the flagship tier is a stated plan rather than a claimed position -- a 2nm SoC launching in the third quarter and, 'together with ongoing engagements with global players, we will increase our presence continuously in the flagship smartphone market in 2027' -- while Counterpoint records MediaTek's premium-tier shipments declining on a 'slowdown in sales of Dimensity 9000 series powered devices.' | co leader The report claims "nearly 30% of global ODM-Direct server shipments" for 2025 on internally assessed volume, against an IDC Worldwide Quarterly Server Tracker base of approximately 7.7 million ODM-Direct units within roughly 16.78 million total 2025 server shipments — yet describes the Company only as "one of the major suppliers to international hyperscale data centers". Among the largest in its segment; the report makes no claim to be first. | fast follower UMC describes a deliberate follow strategy in the 20-F: it intends "to avoid investments in technologies that do not present commercial potential for volume production" and believes "it is beneficial to defer investment in premature equipment needed to claim the earliest advanced technology and instead to purchase more advanced and less expensive versions of such equipment from vendors who design this equipment based on pre-production lessons learned from the earliest technology." The node ladder bears this out: the most advanced process in production in 2025 is Fab 12A's 0.014 micron, wafers at 14 nanometers and under rounded to 0.0% of wafer sales in each of 2023, 2024 and 2025, and the next rung — UMC's own 12nm FinFET process, which Intel replicated in 2025 "based on our electrical design rules and UMC-verified process" for manufacture at its Arizona fab — is only "expected to begin in 2027." |
| Pricing power | moderate The 2Q26 remarks describe price as cost pass-through rather than capture: 'As rising costs across the supply chain have become an industry-wide reality, we are taking pricing actions to ensure these increases are appropriately reflected in our product pricing', with the full-year aim, 'through our disciplined pricing strategy', to 'deliver our full year gross margin within the current quarter guidance range' -- holding a band, not widening it. The realised figures show that defence working: gross margin 46.2%, down 0.1 percentage points sequentially, with Q3 guided at 46% plus or minus 1.5 points. The 2.9-point year-over-year decline is not an erosion rate; the company states it 'was mainly due to a one-time benefit in the year-ago quarter.' Holding a mid-40s gross margin through a market the company expects to decline 'by about 15% in units this year' is genuine discipline, but passing rising costs through to defend a guided band is not the ability to price above it. | weak 2025 gross margin was 8.3% and operating margin 6.7%; gross profit rose 109.77% while revenue rose 163.68%, so the margin narrowed as volume grew. The report discloses three customers at 41.48%, 26.03% and 10.43% of 2025 net sales, lists "Excessive concentration of customers" among its negative factors, and explains its main-supplier table with "The suppliers are designated by customers." | weak The 20-F claims no premium — "our current level of pricing is comparable to that of other leading foundries in each respective geometry" — and reports that 2025 average selling price declined 5.4%, driving gross margin down from 32.6% in 2024 to 29.0% in 2025 even as 12-inch-equivalent wafer shipments rose from 3,446 thousand to 3,870 thousand and average capacity utilization improved from 68.7% to 75.2%. It also notes that "[p]rices for wafers of a given level of technology generally decline over the processing technology life cycle." |
| Summary | MediaTek is the largest supplier of smartphone application processors by units and has been for as long as Counterpoint's public quarterly table runs. Across all ten quarters it covers, Q1 2024 through Q2 2026, MediaTek is first every time and never below 31%, while the nearest rival never clears 30%; in Q2 2026 it holds 31% against Qualcomm's 23%, Apple's 19%, UNISOC's 13%, Samsung's 9% and HiSilicon's 5%. That is a real, independently counted position, and it is the only part of MediaTek's business for which such a count exists in the sources used here. The same table is the clearest evidence that the position is being defended rather than extended. MediaTek's share moves inside a 31% to 41% band across the ten quarters, and the top of that band has come down -- 41% in Q1 2024, 38% in Q1 2025, 33% in Q1 2026 -- while the 31% of Q2 2026 matches the lows already set in Q4 2024 and Q4 2025 rather than breaking them; measured like for like against the same quarter a year earlier the series runs 34%, 36%, 31%. Counterpoint records MediaTek's shipments falling more than 30% year-over-year in the quarter -- hit in the mainstream and entry tiers by the memory shortage, and in the premium tier by a slowdown in Dimensity 9000 series devices -- while Samsung's Exynos climbed to 9% on Galaxy S26 base variants and mid-tier A-series wins. MediaTek's own 2Q26 remarks show the gross line holding and the operating line not: gross margin of 46.2%, down 0.1 percentage points sequentially and guided at 46% plus or minus 1.5 for the third quarter, against operating income down 22.2% year-over-year on revenue up 1.2%, with operating expenses of NT$47.4 billion against NT$44.5 billion a year earlier. Unit leadership held while the return on it did not. What MediaTek re-uses is design IP. It manufactures nothing itself -- the remarks describe deep design-technology co-optimization with TSMC and close work with advanced-packaging partners -- and they locate the durable asset in a pre-validated library of memory, I/O and connectivity subsystems, 448G SerDes with a Co-Package Copper system solution, CPO development on TSMC's COUPE platform, and an end-to-end 3.5D platform. The spending behind that library is visible in the cost line: operating expenses of NT$47.4 billion in the quarter against NT$44.5 billion a year earlier, with the Q3 operating expense ratio guided at 31% plus or minus 2 points against a gross margin guided at 46% plus or minus 1.5 -- an operating cost base running near a third of revenue. That library is now pointed at two adjacencies. Smart Edge Platforms -- connectivity, computing, automotive and TV SoCs -- is now the larger business, at 53% of revenue in Q2 against mobile's 41%, and grew 26% year-over-year while mobile fell 20%. And the company says it has built its first AI accelerator ASIC for a major US cloud customer, with production scheduled for the fourth quarter of 2026. One adjacency is a target and one is a contribution, and this profile treats them as exactly that. The data center share figure of 15% to 20% is a 2027 target against a served market MediaTek itself sizes at US$80 billion, raised from 10% to 15% only one quarter earlier, and production of the first ASIC was still scheduled for the fourth quarter at the date of the remarks. The RTX Spark AI PC work is corroborated by NVIDIA's own announcement, which credits MediaTek with collaborating on the custom CPU design and contributing to its power efficiency, performance and connectivity -- but the superchip, its Grace CPU, its NVLink-C2C interconnect and its software stack are NVIDIA's, and the systems ship from PC makers, so what MediaTek holds is a design contribution rather than a franchise with a share to count. The claimed share gains in connectivity, computing and automotive carry no number and no third-party count. The honest reading is a company with one durable, independently verified franchise it is holding rather than extending, funding a credible but still unproven move into higher-value silicon on the strength of its IP portfolio. | Wiwynn sells ODM-Direct — it designs and builds cloud and AI server systems to hyperscale operators' specifications rather than shipping a branded product — and the 2025 annual report grounds its edge in that relationship: "highly customized solutions", integration "from server design and system integration to large-scale L10/L11 rack-level delivery", Open Compute Project participation described as "a core competitive advantage in marketing to global hyperscale data centers", and products deployed in more than 750 hyperscale data centers as of the end of 2025. The report also says that high integration and testing abilities "increases the threshold of vendors in the assembly industry and creates entry barriers". Against that, the same report lists excessive customer concentration and an increasingly competitive market as its negative factors, discloses customers at 41.48%, 26.03% and 10.43% of 2025 net sales, explains its main-supplier table with "The suppliers are designated by customers", and reports an 8.3% gross margin on 2025 revenue of NT$950.66bn. | UMC's durable asset is a proprietary mature- and specialty-node process library — 55/40/28/22nm embedded memory for MCU and automotive, 55/40/28/22/14nm embedded high-voltage for display drivers, 110/55nm BCD for power management, 55/28/22nm BSI-CSI for image sensors and 110/90/55/40nm RF-SOI — backed by more than 16,700 patents worldwide at end-2025 and 7.5% of revenue spent on R&D. That library keeps a concentrated customer base qualified into UMC's fabs (top ten customers were 57.0% of 2025 operating revenues; Texas Instruments, Intel, MediaTek, Realtek and Novatek are named as primary customers). What it does not buy is price: 2025 average selling price fell 5.4% and gross margin fell from 32.6% to 29.0%, while the filing warns that new dedicated foundries are likely to initiate competitive pricing and overcapacity in legacy technology. |
| Chain position | A fabless designer sitting between its customers and the TSMC-centred manufacturing chain. The 2Q26 remarks describe 'deep design-technology co-optimization (DTCO) with TSMC' and close work with advanced-packaging partners to build 'high-performance ASICs across a broad range of very-large chip sizes using CoWoS and EMIB-T technologies' at nodes down to 2nm, and say MediaTek creates 'significant value beyond semiconductor by orchestrating other key components throughout the supply chain such as memory and substrate' -- a coordinator role as much as a design one. | The report's cloud/AI-server value-chain diagram places system assembling in the midstream and "Direct sales from original manufacturers" downstream selling to cloud service providers; Wiwynn describes itself as providing "IT equipment and rack system integration service to hyperscale data centers". 82.12% of 2025 revenue came from America. | Mature- and specialty-node wafer supplier: 2025 wafer sales were 41.4% communication, 30.6% consumer and 11.6% computer, with the AI tie indirect — 2.5D silicon interposers with deep-trench capacitors shipped to major customers for HPC, cloud computing and LLM applications. |
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| Long-horizon vote | +0.13 at weight 0.20 · swarm neutral Editorial prior, not backtested. | +0.05 at weight 0.20 · swarm bearish Editorial prior, not backtested. | -0.01 at weight 0.20 · swarm neutral Editorial prior, not backtested. |