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Compare moats

Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing Tokyo Electron×CXMT× add + AMD AMD+ ASE Technology Holding ASX+ ASM International ASMIY+ ASML ASML+ Adobe ADBE+ Advantest ATEYY+ Alibaba Group BABA+ Alphabet GOOGL+ Amazon AMZN+ Amkor Technology AMKR+ Amphenol APH+ AppLovin APP+ Apple AAPL+ Applied Digital APLD+ Applied Materials AMAT+ Applied Optoelectronics AAOI+ Arista Networks ANET+ Arm Holdings ARM+ Astera Labs ALAB+ Bloom Energy BE+ Broadcom AVGO+ C3.ai AI+ Cadence Design Systems CDNS+ Celestica CLS+ Cerebras Systems CBRS+ Ciena CIEN+ Cisco Systems CSCO+ Cloudflare NET+ Coca-Cola KO+ Coherent Corp COHR+ Constellation Energy CEG+ CoreWeave CRWV+ Corning GLW+ Credo Technology CRDO+ CrowdStrike CRWD+ Datadog DDOG+ Dell Technologies DELL+ Digital Realty Trust DLR+ Duolingo DUOL+ Eaton ETN+ Eli Lilly and Company LLY+ Equinix EQIX+ Everpure, Inc. P+ Fabrinet FN+ GE Vernova GEV+ GitLab GTLB+ GlobalFoundries GFS+ Hewlett Packard Enterprise HPE+ Hon Hai Precision (Foxconn) HNHPF+ Hut 8 HUT+ IBM IBM+ IREN IREN+ Intel INTC+ JPMorgan Chase JPM+ KLA Corporation KLAC+ Kioxia Holdings KXIAY+ Lam Research LRCX+ Lumentum Holdings LITE+ Marvell Technology MRVL+ MediaTek 2454.TW+ Meta Platforms META+ Micron MU+ Microsoft MSFT+ Moderna MRNA+ MongoDB MDB+ Montage Technology 688008.SS+ NVIDIA NVDA+ Nebius Group NBIS+ NetApp NTAP+ Netflix NFLX+ Nokia NOK+ Oracle ORCL+ Palantir Technologies PLTR+ Palo Alto Networks PANW+ Penguin Solutions PENG+ Pfizer PFE+ Powell Industries, Inc. POWL+ Qualcomm QCOM+ SAP SAP+ SK Hynix SKHY+ Salesforce CRM+ Samsung Electronics 005930.KS+ SanDisk SNDK+ Schneider Electric SBGSY+ Seagate Technology STX+ ServiceNow NOW+ Snowflake SNOW+ SoundHound AI SOUN+ Space Exploration Technologies Corp. (SpaceX) SPCX+ Super Micro Computer SMCI+ Synopsys SNPS+ TE Connectivity TEL+ TSMC TSM+ Talen Energy TLN+ Tempus AI TEM+ Tencent Holdings TCEHY+ Teradyne TER+ Tesla, Inc. TSLA+ The Walt Disney Company DIS+ Trane Technologies TT+ United Microelectronics Corporation UMC+ Vertiv VRT+ Visa V+ Vistra VST+ Walmart WMT+ Western Digital WDC+ Wistron 3231.TW+ Wiwynn 6669.TW+ X-energy XE
Tokyo Electron TOELY ai moat: latest change 2026-09-15 CXMT 688825.SS ai moat: latest change 2026-08-29
Moat rating narrow

Integrated Report 2026 (issued 2026-09-15) documents strong positions across the line: by Tokyo Electron's own estimate it ranks No. 1 in diffusion furnaces, batch deposition, metal deposition, coater/developers, gas chemical etch and wafer probers, No. 2 in plasma etch and bonders and No. 3 in cleaning, and holds a "100% share" of coater/developers for EUV lithography; its installed base, industry-leading by its own estimate, is approximately 100,000 units, growing by approximately 4,000-6,000 units a year; and its 26,592 patents rank No. 1 in the semiconductor production equipment industry on the LexisNexis PatentSight+ database. Reported returns stayed high through a sales decline: gross profit margin stayed between 44.6% and 47.1% and ROE between 21.8% and 37.2% across fiscal 2022-2026, including fiscal 2024 when net sales fell to ¥1,830.5 billion. The share ranks, the EUV share and the installed-base lead are company estimates, not third-party data.

source: tel.com

none

CXMT's 2026 interim report (published 2026-08-29) names scale and IDM technology as core competencies, but also concedes gaps. It says that compared with the leading international manufacturers the Company 'still has a certain gap in overall scale, technology accumulation and customer resources' (与国际头部厂商相比,公司在整体规模、技术积累、客户资源等方面仍然存在一定差距). It describes its scale effect as 'gradually emerging' (逐步显现), and its gross-margin risk covers the case where the scale effect cannot materialise over the long term (公司规模效应长期无法显现). Its excess returns span a single shortage. The retained-earnings note shows an accumulated deficit of ¥36.65bn entering 2026, after ¥1.87bn of 2025 net profit attributable to the parent, and the first-half 2025 net loss attributable to shareholders was ¥2.33bn. Then first-half 2026 revenue rose 873.64%, which the report attributes to the global DRAM supply shortage, higher prices and sharply higher volumes, and the main-business gross margin reached 84.84%.

source: static.cninfo.com.cn

Moat type intangibles ip

The report calls its patent portfolio its "fifth strength" and says that "by supporting our other four strengths, it serves a vital role as the foundation" for medium- to long-term corporate value: 26,592 patents as of March 31, 2026, 1,415 inventions created in Japan and 345 overseas in 2025, and Clarivate Top 100 Global Innovators recognition for the fifth consecutive year. The other strengths rest on the same proprietary process know-how — co-created technology roadmaps that evaluate technologies "for the next four generations and beyond" with customers, "numerous development PORs" (process of record) in the frontend business, and the EUV coater/developer position — so proprietary process technology, reinforced by qualification in customers' process flows, is the moat source.

source: tel.com

none

On the report's own evidence, no candidate moat source qualifies. Cost scale: the report calls DRAM a highly standardised product (高度标准化的产品) in which the cost advantage of scale is a core competency. But CXMT ranks fourth globally by capacity, and the report, calculating on sales, puts Samsung, SK hynix and Micron at 33.96%, 34.48% and 23.41% of the 2025 global DRAM market, so the scale advantage lies with the leaders. IP: it reports 4,484 domestic patents (3,744 of them invention patents) and 3,400 overseas patents as of 2026-06-30. Yet it describes its core technology as reaching 'international advanced level' (国际先进水平) and flags possible IP disputes with competitors. Switching costs: ¥133.48bn of ¥150.31bn first-half 2026 revenue went through distributors, who under the report's revenue note decide their own resale prices.

source: static.cninfo.com.cn

Leadership co leader

The CEO's message describes Tokyo Electron as "one of the world's leading suppliers of semiconductor production equipment" and states a "goal of becoming number one globally" — it does not claim to be the largest supplier overall — while by its own estimate it ranks No. 1 in six charted segments (diffusion furnace, batch deposition, metal deposition, coater/developer, gas chemical etch, wafer prober), No. 2 in plasma etch and bonders, and No. 3 in cleaning.

source: tel.com

fast follower

TrendForce (2026-09-24) reports that CXMT's global DRAM revenue share rose to 9.5% in 2Q26 from 7.6% in 1Q26, 'placing it fourth behind Samsung at 39.4%, SK hynix at 24.9%, and Micron at 23.3%'. It is catching up through generation-skipping R&D. The interim report had its fifth process platform in customer certification, and a voluntary disclosure on 2026-09-21 announced that platform's mass production, adding that its products are not yet in scale sales and yields need time to ramp. TrendForce's listing analysis (2026-07-28) still says CXMT 'still trails Samsung, SK hynix, and Micron in advanced processes, product performance, yields, and certification by high-end customers'.

source: static.cninfo.com.cn

Pricing power moderate

Gross profit margin held in a 44.6%-47.1% range over fiscal 2022-2026, including fiscal 2024's sales decline, but in fiscal 2026 it fell 1.8 points to 45.3% "due to factors such as higher raw material prices and increased labor costs" even as net sales reached a record, and the CEO lists "revising prices appropriately with respect to cost increases caused by inflation" among five initiatives needed to improve the operating margin.

source: tel.com

weak

CXMT is a price taker riding the cycle. The interim report attributes first-half revenue growth to the global DRAM supply shortage, rising prices and sharply higher volumes. It records industry prices between 2015 and 2025 as high as $7.89/GB and as low as $1.78/GB in first-half 2023, and it states that the continued steep price rise is not sustainable. Main-business revenue was ¥15.22bn against cost of ¥13.29bn in first-half 2025, and ¥150.04bn against ¥22.75bn in first-half 2026. Most sales go through distributors, who set their own resale prices.

source: static.cninfo.com.cn

Summary

Tokyo Electron makes wafer fab equipment for what its Integrated Report 2026 calls the "four key processes necessary for semiconductor scaling: deposition, coater/developer, etch, and cleaning", plus wafer probers and bonders for test and advanced packaging. The report grounds its edge in breadth and incumbency: leading share estimates in most of its segments, an estimated 100% share of EUV coater/developers, an installed base of approximately 100,000 units, industry-leading by its own estimate, feeding a Field Solutions business that sold ¥626.0 billion of parts, services, used equipment and modifications in fiscal 2026, and the industry's largest patent portfolio. Fiscal 2026 net sales were a record ¥2,443,533 million, but gross profit margin fell 1.8 points to 45.3% on higher raw material prices and labor costs, and operating margin fell 3.1 points to 25.6% as R&D expenses rose 11.1% to ¥277,866 million. China accounted for 34.1% of fiscal 2026 net sales, down from 41.7% the year before.

CXMT (ChangXin) is a Hefei-based IDM that designs and fabricates DDR5 and LPDDR4X/LPDDR5/5X/LPDDR6 memory and sells DRAM wafers, chips and modules. Its 2026 interim report says it reached its fourth process platform through a 'generation-skipping' (跳代研发) R&D strategy, and that it ranks first in China and fourth globally by shipments and sales. First-half 2026 revenue was ¥150.31bn (DDR series ¥69.47bn, LPDDR series ¥78.19bn), with a main-business gross margin of 84.84%. TrendForce puts its 2Q26 DRAM revenue share at 9.5%, up from 7.6% in 1Q26. The position is real but recent. The report concedes gaps to the three leaders in scale, technology and customers. The customers it names are Alibaba Cloud, ByteDance, Tencent, Lenovo, Xiaomi, Transsion, Honor, OPPO and vivo. On 2026-06-08 the US Defense Department added its subsidiary ChangXin Memory to the Section 1260H list. TrendForce notes that export controls leave CXMT relying on DUV multiple patterning rather than EUV, and that its prospectus 'has not disclosed a clear mass-production timetable' for HBM. The report itself warns that the continued steep rise in DRAM prices is not sustainable (价格的持续大幅上涨不具备可持续性) as international makers add capacity.

Chain position

Upstream equipment supplier to chipmakers: fiscal 2026 new-equipment sales of ¥1,775.4 billion went 59% to non-memory (logic, foundry, others), 31% to DRAM and 10% to NAND; by region, China took 34.1%, South Korea 22.3% and Taiwan 20.4% of net sales.

Upstream DRAM IDM selling wafers, chips and modules to server, smartphone, PC and automotive makers, mostly through distributors (¥133.48bn of ¥150.31bn first-half 2026 revenue).

Products (share / barrier)
  • Cleaning systems (CELLESTA single-wafer and batch cleaning) Top 3 · Moderate source: tel.com
  • Coater/developers (CLEAN TRACK LITHIUS Pro series) Leader · Deep source: tel.com
  • Deposition systems (thermal processing, batch ALD/CVD, single-wafer metal deposition) Leader · Deep source: tel.com
  • Etch systems (Tactras and Episode UL plasma etch, Certas LEAGA gas chemical etch) Top 3 · Deep source: tel.com
  • Field Solutions (parts, services, used equipment and modifications) Unknown · Moderate source: tel.com
  • Wafer bonding and laser systems (Synapse, Ulucus) Top 3 · Moderate source: tel.com
  • Wafer probers (Prexa, WDF 12DP+) Leader · Moderate source: tel.com
Long-horizon vote +0.13 at weight 0.20 · swarm bearish

Editorial prior, not backtested.

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-0.06 at weight 0.20 · swarm bullish

Editorial prior, not backtested.

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