Skip to content

Compare moats

Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing Tokyo Electron×Hewlett Packard Enterprise× add + AMD AMD+ ASE Technology Holding ASX+ ASM International ASMIY+ ASML ASML+ Adobe ADBE+ Advantest ATEYY+ Alibaba Group BABA+ Alphabet GOOGL+ Amazon AMZN+ Amkor Technology AMKR+ Amphenol APH+ AppLovin APP+ Apple AAPL+ Applied Digital APLD+ Applied Materials AMAT+ Applied Optoelectronics AAOI+ Arista Networks ANET+ Arm Holdings ARM+ Astera Labs ALAB+ Bloom Energy BE+ Broadcom AVGO+ C3.ai AI+ CXMT 688825.SS+ Cadence Design Systems CDNS+ Celestica CLS+ Cerebras Systems CBRS+ Ciena CIEN+ Cisco Systems CSCO+ Cloudflare NET+ Coca-Cola KO+ Coherent Corp COHR+ Constellation Energy CEG+ CoreWeave CRWV+ Corning GLW+ Credo Technology CRDO+ CrowdStrike CRWD+ Datadog DDOG+ Dell Technologies DELL+ Digital Realty Trust DLR+ Duolingo DUOL+ Eaton ETN+ Eli Lilly and Company LLY+ Equinix EQIX+ Everpure, Inc. P+ Fabrinet FN+ GE Vernova GEV+ GitLab GTLB+ GlobalFoundries GFS+ Hon Hai Precision (Foxconn) HNHPF+ Hut 8 HUT+ IBM IBM+ IREN IREN+ Intel INTC+ JPMorgan Chase JPM+ KLA Corporation KLAC+ Kioxia Holdings KXIAY+ Lam Research LRCX+ Lumentum Holdings LITE+ Marvell Technology MRVL+ MediaTek 2454.TW+ Meta Platforms META+ Micron MU+ Microsoft MSFT+ Moderna MRNA+ MongoDB MDB+ Montage Technology 688008.SS+ NVIDIA NVDA+ Nebius Group NBIS+ NetApp NTAP+ Netflix NFLX+ Nokia NOK+ Oracle ORCL+ Palantir Technologies PLTR+ Palo Alto Networks PANW+ Penguin Solutions PENG+ Pfizer PFE+ Powell Industries, Inc. POWL+ Qualcomm QCOM+ SAP SAP+ SK Hynix SKHY+ Salesforce CRM+ Samsung Electronics 005930.KS+ SanDisk SNDK+ Schneider Electric SBGSY+ Seagate Technology STX+ ServiceNow NOW+ Snowflake SNOW+ SoundHound AI SOUN+ Space Exploration Technologies Corp. (SpaceX) SPCX+ Super Micro Computer SMCI+ Synopsys SNPS+ TE Connectivity TEL+ TSMC TSM+ Talen Energy TLN+ Tempus AI TEM+ Tencent Holdings TCEHY+ Teradyne TER+ Tesla, Inc. TSLA+ The Walt Disney Company DIS+ Trane Technologies TT+ United Microelectronics Corporation UMC+ Vertiv VRT+ Visa V+ Vistra VST+ Walmart WMT+ Western Digital WDC+ Wistron 3231.TW+ Wiwynn 6669.TW+ X-energy XE
Tokyo Electron TOELY ai moat: latest change 2026-09-15 Hewlett Packard Enterprise HPE ai moat: latest change 2025-12-18
Moat rating narrow

Integrated Report 2026 (issued 2026-09-15) documents strong positions across the line: by Tokyo Electron's own estimate it ranks No. 1 in diffusion furnaces, batch deposition, metal deposition, coater/developers, gas chemical etch and wafer probers, No. 2 in plasma etch and bonders and No. 3 in cleaning, and holds a "100% share" of coater/developers for EUV lithography; its installed base, industry-leading by its own estimate, is approximately 100,000 units, growing by approximately 4,000-6,000 units a year; and its 26,592 patents rank No. 1 in the semiconductor production equipment industry on the LexisNexis PatentSight+ database. Reported returns stayed high through a sales decline: gross profit margin stayed between 44.6% and 47.1% and ROE between 21.8% and 37.2% across fiscal 2022-2026, including fiscal 2024 when net sales fell to ¥1,830.5 billion. The share ranks, the EUV share and the installed-base lead are company estimates, not third-party data.

source: tel.com

narrow

The FY2025 10-K describes strong but bounded advantages. On the positive side it cites ~21,000 issued and pending patents as of October 31, 2025, Hewlett Packard Labs research in AI, networking and fabrics, novel accelerators and quantum computing, a claimed 'long-term sustained market leadership in supercomputing', a global manufacturing services footprint, and a large channel/partner ecosystem. Against that, the filing names a crowded set of large incumbents in every segment (Dell, Super Micro, Cisco, Lenovo in servers; Broadcom, Cisco, Dell, IBM, NetApp, Nutanix, Pure Storage plus AWS/Google Cloud/Azure in hybrid cloud; Cisco, Arista, Nokia, Huawei, Ciena, NVIDIA, Extreme, Palo Alto, Fortinet, Zscaler and others in networking), concedes competition from 'generically branded or white-box manufacturers' in certain regions, states 'we anticipate that we will have to continue to adjust prices on many of our products and services to stay competitive', and adds that 'no single patent is in itself essential to our company as a whole or to any of our business segments'. That is a durable franchise, not a wide one.

source: sec.gov

Moat type intangibles ip

The report calls its patent portfolio its "fifth strength" and says that "by supporting our other four strengths, it serves a vital role as the foundation" for medium- to long-term corporate value: 26,592 patents as of March 31, 2026, 1,415 inventions created in Japan and 345 overseas in 2025, and Clarivate Top 100 Global Innovators recognition for the fifth consecutive year. The other strengths rest on the same proprietary process know-how — co-created technology roadmaps that evaluate technologies "for the next four generations and beyond" with customers, "numerous development PORs" (process of record) in the frontend business, and the EUV coater/developer position — so proprietary process technology, reinforced by qualification in customers' process flows, is the moat source.

source: tel.com

intangibles ip

The filing's own competitive-advantage language is repeated near-verbatim for both the Server and Networking segments: 'our broad end-to-end solutions portfolio, supported by our strong intellectual property portfolio and research and development capabilities, coupled with our global reach and partner ecosystem.' It grounds that in ~21,000 worldwide issued and pending patents, decades of large-scale infrastructure engineering (it names fanless direct liquid cooling as an example), and Hewlett Packard Labs. Switching costs are the natural alternative given GreenLake consumption contracts, but the filing explicitly disclaims lock-in as a strategy: 'the cloud experience should be open and seamless across all our customers' clouds, rather than requiring customers to be locked into a cloud stack.' Accumulated engineering IP and brand, not customer captivity, is the source the document actually asserts.

source: sec.gov

Leadership co leader

The CEO's message describes Tokyo Electron as "one of the world's leading suppliers of semiconductor production equipment" and states a "goal of becoming number one globally" — it does not claim to be the largest supplier overall — while by its own estimate it ranks No. 1 in six charted segments (diffusion furnace, batch deposition, metal deposition, coater/developer, gas chemical etch, wafer prober), No. 2 in plasma etch and bonders, and No. 3 in cleaning.

source: tel.com

co leader

The filing claims specific leadership only in narrow places — 'long-term sustained market leadership in supercomputing' and 'AI-native networking leadership' after the Juniper Networks acquisition — while describing every market it serves as 'characterized by strong competition among major corporations with long-established positions and a large number of new and rapidly growing firms.' It names itself alongside, not above, Dell, Super Micro, Cisco and Lenovo in data-center infrastructure and alongside Cisco, Arista, Nokia, Huawei and NVIDIA in networking, and frames AI data-center networking as a market it 'aims to capture' rather than one it holds. One of a handful of scaled incumbents, not the clear leader.

source: sec.gov

Pricing power moderate

Gross profit margin held in a 44.6%-47.1% range over fiscal 2022-2026, including fiscal 2024's sales decline, but in fiscal 2026 it fell 1.8 points to 45.3% "due to factors such as higher raw material prices and increased labor costs" even as net sales reached a record, and the CEO lists "revising prices appropriately with respect to cost increases caused by inflation" among five initiatives needed to improve the operating margin.

source: tel.com

weak

The 10-K is unusually explicit on this. It states 'We face aggressive price competition'; that competitors with a greater presence in lower-cost markets or better component allocation 'may be able to offer lower prices than we are able to offer'; that 'to maintain our competitive position, from time-to-time we take pricing actions to offer heavier than normal discounts or elect not to pass on cost increases to customers ... which has had and could have a negative impact on our financial results'; and that 'we anticipate that we will have to continue to adjust prices on many of our products and services to stay competitive.' Its AI-systems orders are called out as 'generally subject to intense competition and pricing pressure, which can have an impact on our margins', and a separate risk factor warns that failure to sustain gross margins would reduce profitability. The filing states no gross-margin trend figure in these sections; the qualitative direction it does state is defensive.

source: sec.gov

Summary

Tokyo Electron makes wafer fab equipment for what its Integrated Report 2026 calls the "four key processes necessary for semiconductor scaling: deposition, coater/developer, etch, and cleaning", plus wafer probers and bonders for test and advanced packaging. The report grounds its edge in breadth and incumbency: leading share estimates in most of its segments, an estimated 100% share of EUV coater/developers, an installed base of approximately 100,000 units, industry-leading by its own estimate, feeding a Field Solutions business that sold ¥626.0 billion of parts, services, used equipment and modifications in fiscal 2026, and the industry's largest patent portfolio. Fiscal 2026 net sales were a record ¥2,443,533 million, but gross profit margin fell 1.8 points to 45.3% on higher raw material prices and labor costs, and operating margin fell 3.1 points to 25.6% as R&D expenses rose 11.1% to ¥277,866 million. China accounted for 34.1% of fiscal 2026 net sales, down from 41.7% the year before.

HPE's FY2025 10-K positions the company around three stated megatrends — networking, cloud and AI — delivered through five segments (Server, Hybrid Cloud, Networking, Financial Services, Corporate Investments and Other), with Server products and Networking products each exceeding 10% of consolidated net revenue in fiscal 2025. Its defensibility rests on an accumulated intellectual-property and engineering base (~21,000 issued and pending patents as of October 31, 2025), a claimed sustained leadership position in supercomputing via HPE Cray EX, a full networking stack acquired with Juniper Networks in July 2025 spanning campus, data-center switching, WAN routing and SASE, and a captive Financial Services arm that funds consumption-based deployments. The same filing bounds that moat: it warns of 'aggressive price competition', notes that AI systems have historically been bought 'primarily by a small number of larger customers and cloud service providers' and that such orders are 'generally subject to intense competition and pricing pressure, which can have an impact on our margins', and lists a long roster of well-capitalized competitors in every market it serves.

Chain position

Upstream equipment supplier to chipmakers: fiscal 2026 new-equipment sales of ¥1,775.4 billion went 59% to non-memory (logic, foundry, others), 31% to DRAM and 10% to NAND; by region, China took 34.1%, South Korea 22.3% and Taiwan 20.4% of net sales.

Downstream AI-infrastructure integrator and networking supplier: HPE assembles and sells the AI servers and rack-scale systems (ProLiant, Cray EX/XD), turnkey AI-factory stacks (HPE Private Cloud AI) and the data-center/AI networking fabric that sit between silicon vendors and enterprise, sovereign and cloud-service-provider buyers. The AI exposure is central rather than incidental — the filing's strategy section, a dedicated AI risk factor and the AI-systems order-concentration disclosure all address it — but HPE is a buyer of accelerators and components, not a designer of them, and it names NVIDIA as a competitor in networking rather than only as a supplier.

Products (share / barrier)
  • Cleaning systems (CELLESTA single-wafer and batch cleaning) Top 3 · Moderate source: tel.com
  • Coater/developers (CLEAN TRACK LITHIUS Pro series) Leader · Deep source: tel.com
  • Deposition systems (thermal processing, batch ALD/CVD, single-wafer metal deposition) Leader · Deep source: tel.com
  • Etch systems (Tactras and Episode UL plasma etch, Certas LEAGA gas chemical etch) Top 3 · Deep source: tel.com
  • Field Solutions (parts, services, used equipment and modifications) Unknown · Moderate source: tel.com
  • Wafer bonding and laser systems (Synapse, Ulucus) Top 3 · Moderate source: tel.com
  • Wafer probers (Prexa, WDF 12DP+) Leader · Moderate source: tel.com
  • HPE Alletra Storage portfolio Challenger · Moderate source: sec.gov
  • HPE Cray EX supercomputing systems Leader · Deep source: sec.gov
  • HPE GreenLake cloud Challenger · Moderate source: sec.gov
  • HPE Networking (Juniper Mist, Aruba Central, QFX/EX/CX switches, MX/PTX routers) Challenger · Moderate source: sec.gov
  • HPE Private Cloud AI Challenger · Moderate source: sec.gov
  • HPE ProLiant servers and rack-scale solutions Unknown · Moderate source: sec.gov
Long-horizon vote +0.13 at weight 0.20 · swarm bearish

Editorial prior, not backtested.

see exactly how it voted →

+0.05 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

see exactly how it voted →