Compare moats
Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.
| Tokyo Electron | Micron | |
|---|---|---|
| Moat rating | narrow Integrated Report 2026 (issued 2026-09-15) documents strong positions across the line: by Tokyo Electron's own estimate it ranks No. 1 in diffusion furnaces, batch deposition, metal deposition, coater/developers, gas chemical etch and wafer probers, No. 2 in plasma etch and bonders and No. 3 in cleaning, and holds a "100% share" of coater/developers for EUV lithography; its installed base, industry-leading by its own estimate, is approximately 100,000 units, growing by approximately 4,000-6,000 units a year; and its 26,592 patents rank No. 1 in the semiconductor production equipment industry on the LexisNexis PatentSight+ database. Reported returns stayed high through a sales decline: gross profit margin stayed between 44.6% and 47.1% and ROE between 21.8% and 37.2% across fiscal 2022-2026, including fiscal 2024 when net sales fell to ¥1,830.5 billion. The share ranks, the EUV share and the installed-base lead are company estimates, not third-party data. | narrow Micron sits in a three-firm DRAM oligopoly (with Samsung and SK hynix), holds "over 60,000 patents" and leading-edge process technology (industry-first 1-gamma EUV DRAM node in FY2025), yet its FY2025 10-K concedes competitors "may use aggressive pricing" and "may have a larger market share," and consolidated gross margin swung from negative 9% (FY2023) to 40% (FY2025) — a real but commodity-cyclical, non-durable advantage. |
| Moat type | intangibles ip The report calls its patent portfolio its "fifth strength" and says that "by supporting our other four strengths, it serves a vital role as the foundation" for medium- to long-term corporate value: 26,592 patents as of March 31, 2026, 1,415 inventions created in Japan and 345 overseas in 2025, and Clarivate Top 100 Global Innovators recognition for the fifth consecutive year. The other strengths rest on the same proprietary process know-how — co-created technology roadmaps that evaluate technologies "for the next four generations and beyond" with customers, "numerous development PORs" (process of record) in the frontend business, and the EUV coater/developer position — so proprietary process technology, reinforced by qualification in customers' process flows, is the moat source. | intangibles ip The 10-K roots Micron's edge in proprietary technology and IP: "over 60,000 patents" granted as of Aug 28, 2025, "significant investments to develop proprietary product and process technology," the industry's first 1-gamma (EUV) DRAM node, ninth-generation G9 NAND, and HBM4 samples to key AI customers. |
| Leadership | co leader The CEO's message describes Tokyo Electron as "one of the world's leading suppliers of semiconductor production equipment" and states a "goal of becoming number one globally" — it does not claim to be the largest supplier overall — while by its own estimate it ranks No. 1 in six charted segments (diffusion furnace, batch deposition, metal deposition, coater/developer, gas chemical etch, wafer prober), No. 2 in plasma etch and bonders, and No. 3 in cleaning. | co leader A member of the three-supplier DRAM oligopoly and at the technology frontier (industry-first 1-gamma EUV node), but the smallest of the three by share — the 10-K acknowledges competitors "may have a larger market share" — and a later entrant scaling up in HBM behind SK hynix and Samsung. |
| Pricing power | moderate Gross profit margin held in a 44.6%-47.1% range over fiscal 2022-2026, including fiscal 2024's sales decline, but in fiscal 2026 it fell 1.8 points to 45.3% "due to factors such as higher raw material prices and increased labor costs" even as net sales reached a record, and the CEO lists "revising prices appropriately with respect to cost increases caused by inflation" among five initiatives needed to improve the operating margin. | weak Memory is a commodity with cyclical ASPs: the 10-K flags "volatility in average selling prices" and competitors' "aggressive pricing" as key risks, and consolidated gross margin swung from -9% (FY2023) to 22% (FY2024) to 40% (FY2025), marking Micron largely as a cyclical price-taker; contract-based, supply-tight HBM is a partial exception. |
| Summary | Tokyo Electron makes wafer fab equipment for what its Integrated Report 2026 calls the "four key processes necessary for semiconductor scaling: deposition, coater/developer, etch, and cleaning", plus wafer probers and bonders for test and advanced packaging. The report grounds its edge in breadth and incumbency: leading share estimates in most of its segments, an estimated 100% share of EUV coater/developers, an installed base of approximately 100,000 units, industry-leading by its own estimate, feeding a Field Solutions business that sold ¥626.0 billion of parts, services, used equipment and modifications in fiscal 2026, and the industry's largest patent portfolio. Fiscal 2026 net sales were a record ¥2,443,533 million, but gross profit margin fell 1.8 points to 45.3% on higher raw material prices and labor costs, and operating margin fell 3.1 points to 25.6% as R&D expenses rose 11.1% to ¥277,866 million. China accounted for 34.1% of fiscal 2026 net sales, down from 41.7% the year before. | Micron is one of only three scaled DRAM suppliers (with Samsung and SK hynix) and a leading-edge NAND maker, defended by proprietary product and process technology and more than 60,000 granted patents. In FY2025 it shipped the industry's first 1-gamma (EUV) DRAM production node and sampled HBM4 36GB 12-high to multiple key customers for next-generation AI platforms, evidencing process-technology leadership in AI memory (FY2025 10-K). |
| Chain position | Upstream equipment supplier to chipmakers: fiscal 2026 new-equipment sales of ¥1,775.4 billion went 59% to non-memory (logic, foundry, others), 31% to DRAM and 10% to NAND; by region, China took 34.1%, South Korea 22.3% and Taiwan 20.4% of net sales. | US-based supplier of the memory tier of the AI stack — DRAM, HBM and NAND; the 10-K notes cloud servers for AI and data-centric workloads "require significantly increasing quantities of DRAM, including HBM," and Micron sampled HBM4 to power next-generation AI platforms. |
| Products (share / barrier) |
|
|
| Long-horizon vote | +0.13 at weight 0.20 · swarm bearish Editorial prior, not backtested. | +0.05 at weight 0.20 · swarm bullish Editorial prior, not backtested. |