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Compare moats

Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing United Microelectronics Corporation×Intel×GE Vernova× maximum of 3 — remove one to swap
United Microelectronics Corporation UMC ai moat: latest change 2026-04-30 Intel INTC ai moat: latest change 2026-01-23 GE Vernova GEV ai moat: latest change 2026-01-29
Moat rating narrow

The FY2025 20-F Competition section cuts both ways: UMC calls itself "one of the world's largest independent semiconductor foundries" with production capacity "currently among the largest of all semiconductor foundries in the world" and says it believes it competes favorably with competitors on each principal element of foundry competition, yet in the same section concedes that "[s]ome of our competitors have substantially greater production, financial, research and development and marketing resources than we have" and that "several new dedicated foundries have commenced operations and compete directly with us," whose entry is "likely to initiate a trend of competitive pricing and create potential overcapacity in legacy technology" that "may erode our profit margins." A real but bounded advantage, not a durable wide one.

source: sec.gov

eroding

The FY2025 10-K (filed 2026-01-23) repeats the concession, now broadened: 'we have lost market share in recent years, including in both client and data center markets, in the market for x86-based semiconductor products, and more generally in the markets for semiconductor compute products, as competitors have introduced highly competitive data center and client platform products.' It adds that the data-center business 'has been further negatively impacted in the past few years by the significant shift of customer spend toward GPUs optimized for AI workloads' — a historically wide moat still actively eroding.

source: sec.gov

wide

FY2025 10-K (filed 2026-01-29): the installed base generates approximately 25% of the world's electricity; the Power segment carries ~$94.4B of remaining performance obligations with ~1,800 of ~7,000 installed gas turbines under long-term service agreements averaging ~10 years of remaining contract life; and the filing states demand is 'exceeding available capacity' for its products — a contracted, decade-scale service annuity on proprietary installed equipment.

source: sec.gov

Moat type intangibles ip

The 20-F states plainly that "Our success depends on our ability to obtain patents, licenses and other intellectual property (IP) rights covering our production processes and activities," and reports more than 16,700 patents worldwide as of December 31, 2025, of which more than 7,490 are in the U.S., 623 domestic and foreign patents granted in 2025 alone, NT$17,725 million of R&D (7.5% of operating revenues) and 1,591 R&D professionals. The Competition section names where UMC believes it wins: it competes favorably "particularly [on] our technical competence and research and development capabilities." The proprietary specialty-process library, not scale or a network, is the cited source of the advantage.

source: sec.gov

intangibles ip

The durable assets remain the x86 architecture and process-technology IP: the FY2025 10-K claims 'We are a global leader in the design and manufacturing of CPUs and other semiconductor products' and stakes the recovery on process IP — 'Intel 18A introduces two industry firsts in high-volume semiconductor manufacturing: gate-all-around transistors (RibbonFET) and backside power delivery (PowerVia).'

source: sec.gov

switching costs

10-K: ~1,800 gas turbines under long-term service agreements with ~10-year average remaining life, plus services agreements on ~24,000 of ~59,000 installed onshore wind turbines — service revenue is contractually tied to GE Vernova's own installed fleet; the filing adds it derives 'a sustained competitive advantage both from our IP portfolio as well as technical know-how embedded in our products and manufacturing techniques developed over decades'.

source: sec.gov

Leadership fast follower

UMC describes a deliberate follow strategy in the 20-F: it intends "to avoid investments in technologies that do not present commercial potential for volume production" and believes "it is beneficial to defer investment in premature equipment needed to claim the earliest advanced technology and instead to purchase more advanced and less expensive versions of such equipment from vendors who design this equipment based on pre-production lessons learned from the earliest technology." The node ladder bears this out: the most advanced process in production in 2025 is Fab 12A's 0.014 micron, wafers at 14 nanometers and under rounded to 0.0% of wafer sales in each of 2023, 2024 and 2025, and the next rung — UMC's own 12nm FinFET process, which Intel replicated in 2025 "based on our electrical design rules and UMC-verified process" for manufacture at its Arizona fab — is only "expected to begin in 2027."

source: sec.gov

fast follower

The FY2025 10-K still opens 'We are a global leader in the design and manufacturing of CPUs', yet concedes lost share 'in both client and data center markets' and a spend shift 'toward GPUs optimized for AI workloads' where Intel participates via 'Xeon, AI PCs, Arc GPUs and our open software stack' plus 'inference-optimized GPUs on a targeted annual cadence' — following the AI compute market rather than setting its pace.

source: sec.gov

co leader

10-K opens with 'GE Vernova is a global leader in the electric power industry' and its installed base generates ~25% of world electricity, but the filing names peer-scale competitors in every segment — Siemens Energy in both Power and Electrification, Mitsubishi Power, Vestas, Hitachi Energy, Schneider Electric, ABB — so co-leader across the portfolio rather than clear leader.

source: sec.gov

Pricing power weak

The 20-F claims no premium — "our current level of pricing is comparable to that of other leading foundries in each respective geometry" — and reports that 2025 average selling price declined 5.4%, driving gross margin down from 32.6% in 2024 to 29.0% in 2025 even as 12-inch-equivalent wafer shipments rose from 3,446 thousand to 3,870 thousand and average capacity utilization improved from 68.7% to 75.2%. It also notes that "[p]rices for wafers of a given level of technology generally decline over the processing technology life cycle."

source: sec.gov

weak

The FY2025 10-K states the mechanism itself: higher-priced products 'have lower margins as they are produced at external foundries rather than in our manufacturing facilities. To the extent demand shifts from our higher-margin to lower-margin products in any of our market segments, our gross margin percentage has decreased and may decrease again' — plus $878 million of 2025 inventory reserves on the early Intel 18A ramp.

source: sec.gov

strong

10-K: 'increasing demand exceeding available capacity', Electrification customer lead-times 'increased as a result of demand outstripping supply', and both Power and Electrification state they adjust pricing 'in line with market demand, inflation, and industry dynamics'; trade press (Power Engineering, 2026-04-23) reported new gas-turbine order pricing in H1 2026 tracking 10-20 points higher on a dollar-per-kilowatt basis than Q4 2025 orders.

source: sec.gov

Summary

UMC's durable asset is a proprietary mature- and specialty-node process library — 55/40/28/22nm embedded memory for MCU and automotive, 55/40/28/22/14nm embedded high-voltage for display drivers, 110/55nm BCD for power management, 55/28/22nm BSI-CSI for image sensors and 110/90/55/40nm RF-SOI — backed by more than 16,700 patents worldwide at end-2025 and 7.5% of revenue spent on R&D. That library keeps a concentrated customer base qualified into UMC's fabs (top ten customers were 57.0% of 2025 operating revenues; Texas Instruments, Intel, MediaTek, Realtek and Novatek are named as primary customers). What it does not buy is price: 2025 average selling price fell 5.4% and gross margin fell from 32.6% to 29.0%, while the filing warns that new dedicated foundries are likely to initiate competitive pricing and overcapacity in legacy technology.

Still the incumbent x86 CPU designer-manufacturer — FY2025 revenue was $52.9 billion, roughly flat — but the filing concedes lost share in client and data center and an AI-driven customer shift toward GPUs; the counter-thesis is process IP, with Intel 18A shipping in Core Ultra Series 3 ('the first products to be manufactured using our new Intel 18A process technology') and Intel 14A 'designed from inception as an offering to external customers.'

GE Vernova's moat rests on its installed base: the FY2025 10-K states its equipment generates approximately 25% of the world's electricity, with ~7,000 installed gas turbines (~1,800 under long-term service agreements averaging ~10 years of remaining life) and ~$94.4B of Power-segment remaining performance obligations. The filing reports demand 'exceeding available capacity', lengthening Electrification lead-times 'as a result of demand outstripping supply', and pricing adjusted with demand — scarcity trade press later quantified as new gas-turbine order pricing tracking 10-20 points higher per kW in H1 2026 than Q4 2025, with only ~10 GW of production slots left across 2029-2030 (Power Engineering, 2026-04-23). The moat is not uniform: the 10-K risk section flags intensifying competition as manufacturers from China 'improve quality and reliability and pursue markets outside their home countries', and Offshore Wind is delivering its backlog under project-cost and execution pressure, compounded by the U.S. Interior Department's December 22, 2025 pause of leases for all large-scale U.S. offshore projects under construction, which directly impacted the Vineyard Wind timeline. Nuclear adds optionality: the 10-K cites an SMR deployment agreement it calls 'the first commercial contract of its kind in North America' via its joint ventures with Hitachi.

Chain position

Mature- and specialty-node wafer supplier: 2025 wafer sales were 41.4% communication, 30.6% consumer and 11.6% computer, with the AI tie indirect — 2.5D silicon interposers with deep-trench capacitors shipped to major customers for HPC, cloud computing and LLM applications.

x86 compute incumbent and would-be US leading-edge foundry; its 18A/14A ramp is the main Western alternative to TSMC at the leading edge.

Power supplier to the AI buildout: the 10-K states gas power serves 'rising electricity demand from hyperscalers and data centers' and Electrification benefits from orders to electrify data centers 'playing a key role in the development of artificial intelligence (AI)'; trade press (Power Engineering, 2026-04-23) put roughly 20% of the ~100 GW of gas capacity under contract as explicitly tied to data-center load.

Products (share / barrier)
  • 12-inch 28nm/22nm logic and specialty foundry Challenger · Moderate source: sec.gov
  • 12-inch silicon photonics Unknown · Moderate source: sec.gov
  • 2.5D silicon interposer and 3D hybrid bonding Unknown · Moderate source: sec.gov
  • 8-inch and legacy-node foundry (0.11 micron and above) Challenger · Moderate source: sec.gov
  • Embedded non-volatile memory platforms (eFlash, RRAM, MRAM) Unknown · Deep source: sec.gov
  • Specialty mixed-signal platforms (eHV, BCD, BSI-CSI, RF-SOI) Unknown · Moderate source: sec.gov
  • AI accelerators (Gaudi and inference-optimized GPUs) Niche · Moderate source: sec.gov
  • Intel Core / Core Ultra (client PC CPUs) Leader · Moderate source: sec.gov
  • Intel Foundry (leading-edge contract manufacturing) Niche · Deep source: sec.gov
  • Intel Xeon (data center CPUs) Leader · Moderate source: sec.gov
Long-horizon vote -0.01 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

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-0.24 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

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+0.35 at weight 0.20 · swarm bullish

Editorial prior, not backtested.

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