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Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing United Microelectronics Corporation×TSMC×Salesforce× maximum of 3 — remove one to swap
United Microelectronics Corporation UMC ai moat: latest change 2026-04-30 TSMC TSM ai moat: latest change 2026-04-16 Salesforce CRM ai moat: latest change 2026-08-05
Moat rating narrow

The FY2025 20-F Competition section cuts both ways: UMC calls itself "one of the world's largest independent semiconductor foundries" with production capacity "currently among the largest of all semiconductor foundries in the world" and says it believes it competes favorably with competitors on each principal element of foundry competition, yet in the same section concedes that "[s]ome of our competitors have substantially greater production, financial, research and development and marketing resources than we have" and that "several new dedicated foundries have commenced operations and compete directly with us," whose entry is "likely to initiate a trend of competitive pricing and create potential overcapacity in legacy technology" that "may erode our profit margins." A real but bounded advantage, not a durable wide one.

source: sec.gov

wide

TSMC's 2025 Form 20-F reports a 59.9% gross margin (up from 56.1% in 2024) and describes the company as "the technology leader among the dedicated foundries" in advanced (7-nanometer-and-below) node revenue — a durable, hard-to-replicate process-and-scale advantage that rivals with "greater financial and other resources" have not matched.

source: sec.gov

narrow

Salesforce's own language caps this at narrow: Item 1 calls its market "highly competitive, rapidly evolving and fragmented, and subject to changing technology with low barriers to entry." What holds it above none is scale and contract duration: $72.4B total RPO at 2026-01-31 versus $63.4B (+14%), current RPO $35.1B versus $30.2B (+16%), on revenue of $41.5B (+10%). But cRPO growth "was positively impacted by three percent" by currency, and total RPO "includes approximately $2.2 billion" from Informatica, acquired November 2025. Adjusted, the contracted base still outgrows revenue, but by less than the headline implies.

source: sec.gov

Moat type intangibles ip

The 20-F states plainly that "Our success depends on our ability to obtain patents, licenses and other intellectual property (IP) rights covering our production processes and activities," and reports more than 16,700 patents worldwide as of December 31, 2025, of which more than 7,490 are in the U.S., 623 domestic and foreign patents granted in 2025 alone, NT$17,725 million of R&D (7.5% of operating revenues) and 1,591 R&D professionals. The Competition section names where UMC believes it wins: it competes favorably "particularly [on] our technical competence and research and development capabilities." The proprietary specialty-process library, not scale or a network, is the cited source of the advantage.

source: sec.gov

intangibles ip

Per its 2025 Form 20-F, TSMC "compete[s] primarily on process technologies, manufacturing excellence, customer trust and service quality" and has "been issued a substantial number of patents," with 2-nanometer in volume production in 2025 and 16-angstrom risk production targeted for 2026 — proprietary process-technology know-how and IP, not merely capital (the filing explicitly notes some competitors may have greater financial resources yet still trail), are the core barrier.

source: sec.gov

switching costs

Switching costs, with a caveat: the filing's clearest lock-in sentence is about rivals' customers, not its own. "Many prospective customers have invested substantial personnel and financial resources to implement and integrate their current enterprise software... may be reluctant or unwilling to migrate away" is a headwind to Salesforce's own growth. Evidence for its own base is architectural: Data 360 unifies data into "a single, governed source of truth," Agentforce runs on existing processes "without requiring customers to remove and rebuild," behind $72.4B of contracted revenue. Contracts run "typically 12 to 36 months" with no renewal obligation.

source: sec.gov

Leadership fast follower

UMC describes a deliberate follow strategy in the 20-F: it intends "to avoid investments in technologies that do not present commercial potential for volume production" and believes "it is beneficial to defer investment in premature equipment needed to claim the earliest advanced technology and instead to purchase more advanced and less expensive versions of such equipment from vendors who design this equipment based on pre-production lessons learned from the earliest technology." The node ladder bears this out: the most advanced process in production in 2025 is Fab 12A's 0.014 micron, wafers at 14 nanometers and under rounded to 0.0% of wafer sales in each of 2023, 2024 and 2025, and the next rung — UMC's own 12nm FinFET process, which Intel replicated in 2025 "based on our electrical design rules and UMC-verified process" for manufacture at its Arizona fab — is only "expected to begin in 2027."

source: sec.gov

clear leader

Self-described in its 2025 20-F as "the technology leader among the dedicated foundries" in net revenue of advanced semiconductors at 7-nanometer and below; reached 2nm volume production in 2025, and Epoch AI estimates ~90% share of global advanced-node fabrication.

source: sec.gov

clear leader

Clear leader in the category as it exists today, runner-up in the one it is being rebuilt into. Per IDC's Worldwide Semiannual Software Tracker on 2025 data, Salesforce was first in worldwide CRM applications for a thirteenth consecutive year at 20.0% share, and first in Sales (fourteenth year), Customer Service (thirteenth), Marketing (seventh), model-driven application platform (eleventh) and Integration (fourth). These come from Salesforce announcing its own IDC results via a trade outlet, in translation, not IDC primary material. In the same tracker's new Agent Build and Deploy segment it ranked second at 17.5%, albeit as fastest-growing vendor.

source: sec.gov

Pricing power weak

The 20-F claims no premium — "our current level of pricing is comparable to that of other leading foundries in each respective geometry" — and reports that 2025 average selling price declined 5.4%, driving gross margin down from 32.6% in 2024 to 29.0% in 2025 even as 12-inch-equivalent wafer shipments rose from 3,446 thousand to 3,870 thousand and average capacity utilization improved from 68.7% to 75.2%. It also notes that "[p]rices for wafers of a given level of technology generally decline over the processing technology life cycle."

source: sec.gov

strong

2025 gross margin of 59.9% (up from 56.1% in 2024), attributed in the 20-F to higher capacity utilization and cost improvement, reflects strong pricing power at the leading edge despite the heavy capital intensity of new-node ramps.

source: sec.gov

moderate

Gross margin rises across the Item 7 table — gross profit of $32,255M on $41,525M of revenue, 78% of total revenues in FY2026 against 77% in FY2025 and 75% in FY2024 — yet MD&A denies price as the cause: growth "was primarily caused by volume-driven increases from new business," and "Pricing was not a significant driver of the increase in revenues for the period." Item 1A names consumption-based pricing among attrition factors, says Agentforce and Data 360 monetization "remain relatively new and uncertain," and concedes "limited experience with determining optimal pricing for our consumption-based contracts."

source: sec.gov

Summary

UMC's durable asset is a proprietary mature- and specialty-node process library — 55/40/28/22nm embedded memory for MCU and automotive, 55/40/28/22/14nm embedded high-voltage for display drivers, 110/55nm BCD for power management, 55/28/22nm BSI-CSI for image sensors and 110/90/55/40nm RF-SOI — backed by more than 16,700 patents worldwide at end-2025 and 7.5% of revenue spent on R&D. That library keeps a concentrated customer base qualified into UMC's fabs (top ten customers were 57.0% of 2025 operating revenues; Texas Instruments, Intel, MediaTek, Realtek and Novatek are named as primary customers). What it does not buy is price: 2025 average selling price fell 5.4% and gross margin fell from 32.6% to 29.0%, while the filing warns that new dedicated foundries are likely to initiate competitive pricing and overcapacity in legacy technology.

TSMC is the world's largest dedicated semiconductor foundry and, per its 2025 Form 20-F, the self-described technology leader among dedicated foundries in advanced (7nm-and-below) node revenue, having reached 2-nanometer volume production in 2025 with 16-angstrom risk production on track for 2026. Independent research (Epoch AI) estimates it controls roughly 90% of global advanced-node fabrication; sustained by US$7.9 billion of 2025 R&D, a large patent portfolio and 59.9% gross margins, this process-technology and scale advantage has proven durable even against rivals with greater financial resources.

Salesforce is the incumbent of record in CRM applications and is paid like one: $41.5B of FY2026 revenue (+10%), 78% gross margin, $72.4B of contracted revenue not yet recognized, and first place in worldwide CRM for a thirteenth consecutive year at 20.0% share per IDC's tracker as announced by Salesforce. Enterprise data and workflow embedded through Data 360 and Agentforce is costly to unwind, and the agentic layer is deliberately built atop existing processes rather than requiring re-implementation. The limits are the company's own: it twice describes its market as having low barriers to entry, names AI-native startups whose solutions "may bypass traditional business process workflows or displace established user interfaces," ranks second at 17.5% in IDC's new Agent Build and Deploy segment, and concedes pricing did not drive FY2026 growth.

Chain position

Mature- and specialty-node wafer supplier: 2025 wafer sales were 41.4% communication, 30.6% consumer and 11.6% computer, with the AI tie indirect — 2.5D silicon interposers with deep-trench capacitors shipped to major customers for HPC, cloud computing and LLM applications.

The critical leading-edge fabrication and advanced-packaging (CoWoS) layer of the AI supply chain — high-performance computing was 58% of TSMC's 2025 revenue, and it supplies leading-edge N2/N3/N4 logic to the fabless IC-design and system companies that design AI accelerators.

Applications-layer incumbent: sells enterprise CRM and agentic software to end customers across industries, consumes cloud infrastructure (third-party IaaS partners plus its own Hyperforce estate) and third-party LLMs, and sits upstream of no hardware supply chain. Exposure is to enterprise software budgets and to whether the agentic layer is captured by incumbent suites or AI-native entrants.

Products (share / barrier)
  • 12-inch 28nm/22nm logic and specialty foundry Challenger · Moderate source: sec.gov
  • 12-inch silicon photonics Unknown · Moderate source: sec.gov
  • 2.5D silicon interposer and 3D hybrid bonding Unknown · Moderate source: sec.gov
  • 8-inch and legacy-node foundry (0.11 micron and above) Challenger · Moderate source: sec.gov
  • Embedded non-volatile memory platforms (eFlash, RRAM, MRAM) Unknown · Deep source: sec.gov
  • Specialty mixed-signal platforms (eHV, BCD, BSI-CSI, RF-SOI) Unknown · Moderate source: sec.gov
  • Advanced packaging (CoWoS) Leader · Deep source: epoch.ai
  • Leading-edge foundry (advanced-node logic, 7nm and below incl. N3/N2) Leader · Deep source: sec.gov
  • Mainstream & specialty foundry technologies Top 3 · Moderate source: sec.gov
Long-horizon vote -0.01 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

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+0.42 at weight 0.20 · swarm bullish

Editorial prior, not backtested.

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+0.20 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

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