產品
TSMC Reportedly Targets 22% 2nm, 16%+ 3nm Capacity Boost by Mid-2027; CoWoS to Double by 2028
Supply-chain reporting says TSMC plans to raise 2nm capacity about 22% and 3nm capacity more than 16% by mid-2027, and to roughly double CoWoS advanced-packaging capacity by 2028. CoWoS is the binding constraint on AI accelerator output.