合作
RTX's Collins Aerospace to support modernization of U.S. Army's Chinook helicopters
RTX's Collins Aerospace secured work to support modernization of the U.S. Army's Chinook helicopter fleet.
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新聞與行事曆
新聞: 截至 2026-10-15這些標記是什麼意思
重要性是模型對已發布報導給出的 1–5 分，不是對市場的預測。
已排定事件列上的影響是公司顯著度層級（高/中由圖譜中心度與規模判定；低僅用於人工整理的次要事件），不是對波動幅度的預測。
標記為已確認的財報日期，是 Yahoo Finance 認定由公司確認的；預估表示尚未公布。未加標記的列沒有可查的出處記錄。
經濟數據發布屬於總體經濟、不歸屬任何產業，因此在任何檢視下都會保留。沒有數值的發布表示尚未公布，頁面會直說，而不是顯示為零。
涵蓋被追蹤公司的即將到來的事件；已過去的事件會歸檔，並在可得時補上結果——這些結果都經人工整理並附引用，絕不杜撰。沒有結果的歷史列會顯示「結果待定」。
閉鎖期屆滿或指數調整的列會多出一行算術——將變得可賣出的股數，或指數基金必須買進的股數，以佔流通股的比例表示——依招股說明書或指數編製方法讀出，兩個數字都在該列註明出處。它陳述的是機制，不是價格走勢。由 IPO + 180 天推算出的閉鎖期日期會一直標為預估，直到公司自己說明為止。
未來
已排定 · 今天與明天 · 行事曆更新於 2026-10-2210月22日週四 · 今天
- 財報 Bloom Energy 已確認
- 財報 Comfort Systems USA 已確認
- 財報 MaxLinear 已確認
- 財報 Nokia 已確認
- 財報 Western Digital 已確認
- 閉鎖期屆滿 Space Exploration Technologies Corp. (SpaceX) 1.3B 股 預估
- 數據發布 Weekly Jobless Claims 已排定
過往
已發布 · 最新在前8月11日週二
合作
OpenLight and Tower Semiconductor expand PH18DA photonics ecosystem with Cadence
OpenLight's photonic process design kit for Tower Semiconductor's PH18DA InP-on-silicon photonics platform is now available in Cadence EDA tools, letting customers design photonic ICs for applications including optical interconnects and AI infrastructure within a standard IC design environment.
文章預覽
Accessibility: Skip TopNav OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development August 11, 2026 06:00 ET | Source: Tower Semiconductor Tower Semiconductor OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA InP-on-silicon photonics platform SANTA BARBARA, Calif., and MIGDAL HAEMEK, Israel, - August 11, 2026 - OpenLight , a leader in heterogeneous III-V-on-silicon photonic integration and custom Photonic Application-Specific Integrated Circuits (PASICs), and Tower Semiconductor (NASDAQ/TASE: TSE…
產品
Microsoft to unveil Maia 300 AI chip this fall, targets 300,000 TSMC units for 2027
Reuters, citing a report from The Information, said Microsoft plans to unveil its next-generation Maia 300 AI accelerator this fall, potentially as soon as September, and is negotiating with TSMC for production capacity targeting more than 300,000 units for 2027 delivery, with eventual production potentially exceeding 1 million units. The unit target is reported as under negotiation, not a signed purchase order.
文章預覽
Microsoft to unveil Maia 300 AI chip this fall, targets 300,000 units Microsoft to unveil Maia 300 AI chip this fall, targets 300,000 units · Quartz · Bloomberg / Getty Images Cris Tolomia Tue, August 11, 2026 at 4:28 AM GMT+10 2 min read MSFT TSM Microsoft is planning to unveil its next-generation Maia 300 AI chip this fall, potentially as soon as September, according to Reuters, citing a report from The Information. Microsoft is negotiating with TSMC over production capacity to manufacture upward of 300,000 Maia 300 chips, targeting delivery sometime in 2027. Reuters also notes that Microsof…
合作
Firefly's SciTec awarded $94 million U.S. Space Force contract for ground-based radar digitization
Firefly Aerospace's SciTec unit was awarded a $94 million U.S. Space Force contract to advance a ground-based radar digitization program.
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合作
Firefly Aerospace extends multi-launch agreement with Lockheed Martin through 2031
Firefly announced a two-year contract extension of its multi-launch agreement with Lockheed Martin, using the Alpha Block II rocket configuration for up to 25 launches through 2031.
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- 財報 ChipMOS Technologies
- 財報 CoreWeave
- 財報 Lumentum Holdings
- 財報 MiTAC Holdings
- 財報 Netlist
- 財報 Super Micro Computer
原始消息流
所有到達的消息 · 7 天- 大盤 2026-10-15 00:00 PR Newswire Financial Services BDG Law Group Provides Notice Following Data Security Incident