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GlobalFoundries signs $2B deal to make silicon interposers for TSMC's CoWoS packaging
GlobalFoundries announced a multi-year $2 billion manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem, adding fabrication capacity at its Malta, New York facility. Volume production is expected to begin ramping in the first half of 2028, and the agreement has an initial term of five years.
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Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies MALTA, N.Y., Oct. 8, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS ® advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agr…