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Accessibility: Skip TopNav UC Berkeley to Join Applied Materials’ EPIC Center to Speed Chip Innovation August 11, 2026 09:00 ET | Source: Applied Materials, Inc. Applied Materials, Inc. Collaboration pairs UC Berkeley’s semiconductor research strength with Applied’s state-of-the-art equipment and process integration expertise Located in Silicon Valley, Applied’s EPIC Center provides industry-scale R&D environment with access to cutting-edge chipmaking equipment to enable rapid co-innovation and faster commercialization SANTA CLARA, Calif., Aug. 11, 2026 (GLOBE NEWSWIRE) -- Applied Materials, I…

Accessibility: Skip TopNav OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development August 11, 2026 06:00 ET | Source: Tower Semiconductor Tower Semiconductor OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA InP-on-silicon photonics platform SANTA BARBARA, Calif., and MIGDAL HAEMEK, Israel, - August 11, 2026 - OpenLight , a leader in heterogeneous III-V-on-silicon photonic integration and custom Photonic Application-Specific Integrated Circuits (PASICs), and Tower Semiconductor (NASDAQ/TASE: TSE…

Microsoft to unveil Maia 300 AI chip this fall, targets 300,000 units Microsoft to unveil Maia 300 AI chip this fall, targets 300,000 units · Quartz · Bloomberg / Getty Images Cris Tolomia Tue, August 11, 2026 at 4:28 AM GMT+10 2 min read MSFT TSM Microsoft is planning to unveil its next-generation Maia 300 AI chip this fall, potentially as soon as September, according to Reuters, citing a report from The Information. Microsoft is negotiating with TSMC over production capacity to manufacture upward of 300,000 Maia 300 chips, targeting delivery sometime in 2027. Reuters also notes that Microsof…