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Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.

comparing MediaTek×ASE Technology Holding×Jabil× maximum of 3 — remove one to swap
MediaTek 2454.TW ai moat: latest change 2026-07-31 ASE Technology Holding ASX ai moat: latest change 2026-04-01 Jabil JBL ai moat: latest change 2025-10-17
Moat rating narrow

Counterpoint's public quarterly AP-SoC table, published 8 September 2026, shows MediaTek first in all ten quarters it covers (Q1 2024 through Q2 2026), never below 31%, with the nearest rival never above 30% -- a sustained position, not one good quarter. What the same table does not show is a widening one: the share oscillates inside a 31% to 41% band, the Q1 readings step down 41% (2024), 38% (2025), 33% (2026), and the 31% of Q2 2026 matches the lows already set in Q4 2024 and Q4 2025 rather than breaking them; Q2-on-Q2 the series runs 34%, 36%, 31%. Counterpoint also records MediaTek's shipments down more than 30% year-over-year in the quarter, the mainstream and entry tiers hit by the memory shortage and the premium tier by a 'slowdown in sales of Dimensity 9000 series powered devices.' MediaTek's own 2Q26 remarks show the gross line holding and the operating line not: gross margin 46.2%, down only 0.1 percentage points sequentially and guided at 46% plus or minus 1.5 for Q3, while operating income fell 22.2% year-over-year on revenue up 1.2% as operating expenses rose to NT$47.4 billion from NT$44.5 billion. A first place held for ten quarters without extending it, and earning less on it, is defensible rather than compounding.

source: mediatek.com

narrow

The FY2025 20-F argues ASEH out-competes IDM in-house lines because serving "a large base of customers across a wide range of products" lets it "reduce costs and shorten production cycles through high-capacity utilization and process expertise" and gives its equipment "a longer useful life" — a real but bounded edge, since the same filing calls the global packaging and testing market "highly competitive", notes "most of our customers obtain services from more than one source", flags foundry encroachment ("TSMC has offered advanced packaging technologies such as integrated fan-out"), and warns that "some of our competitors may have superior financial, marketing, manufacturing, research and development and technological resources than we do", offering P.R.C. government support of its domestic semiconductor companies as the example.

source: sec.gov

none

Jabil's FY2025 10-K (fiscal year ended August 31, 2025) says it plainly: "Our business is highly competitive, and our manufacturing processes are generally not subject to significant proprietary protection." It adds that "The significant purchasing power and market power of these competitors, many of which are large companies, has and could increase pricing and competitive pressures for us", that some "have substantially greater manufacturing, research and development (R&D) and marketing resources", and that customers "are continually evaluating the merits of manufacturing products internally against the advantages of outsourcing". Stored fundamentals from the 10-Ks show gross profit of $2,867 million on $34,702 million of revenue in fiscal 2023, $2,676 million on $28,883 million in fiscal 2024 and $2,646 million on $29,802 million in fiscal 2025. AI demand has since accelerated growth (fiscal 2026 net revenue of $36.0 billion, per the 2026-09-30 release), but growth is not protection, and the filing's own description is of an unprotected, competitive service. No moat is claimable.

source: sec.gov

Moat type intangibles ip

MediaTek manufactures nothing itself -- its 2Q26 remarks describe 'deep design-technology co-optimization (DTCO) with TSMC' and close collaboration with advanced-packaging partners -- so the durable asset cannot be plant scale, and the remarks do not claim customer lock-in either. They locate it in a reusable design library: 'Building on our industry-leading IP portfolio, we offer best-in-class, pre-validated subsystems solutions for memory, I/O, and connectivity' -- which, the company says, 'largely reduces design complexity and shortens time to market for our data center customers'. The same remarks itemise 448G SerDes with a Co-Package Copper system solution, CPO development on TSMC's COUPE platform, and an end-to-end 3.5D platform with 'best-in-class 3.5D IP, packaging, and design flows,' and say design wins come 'backed by our industry-leading IPs, deep ecosystem partnerships, and proven execution capabilities'. The spending behind that library shows in the cost line: operating expenses of NT$47.4 billion in the quarter against NT$44.5 billion a year earlier, with the Q3 operating expense ratio guided at 31% plus or minus 2 points. It is the same library MediaTek re-amortises across mobile, edge and now data-center ASIC.

source: mediatek.com

cost scale

The advantage the 20-F actually claims is unit economics from volume, not lock-in: specialization and "economies of scale by providing services to a large base of customers", high capacity utilization spreading "relatively high fixed costs", and equipment that lasts longer because of the breadth of the order book. Capital intensity reinforces it — the filing says "semiconductor businesses are capital intensive and require significant investment in expensive equipment manufactured by a limited number of vendors", with the equipment market itself "characterized by intense demand, limited supply, and long delivery cycles".

source: sec.gov

none

The 10-K says "We currently have a relatively modest number of patents for various innovations" and that Jabil relies "largely upon a combination of intellectual property laws, non-disclosure agreements with our customers, employees, and suppliers and our internal security systems, policies, and procedures", with other proprietary-rights factors being "the knowledge and experience of our management and workforce". Its stated advantages are operating methods (customer-dedicated business units, "highly automated, continuous flow manufacturing", global production and centralized procurement), not lock-in: "In the past, some of our customers moved a portion of their manufacturing from us in order to more fully utilize their excess internal manufacturing capacity." On the Q4 FY2026 call (https://earningswhispers.com/transcript/JBL/Q42026) management described a build-to-customer-design model rather than proprietary platforms: "We help customers build the system they've designed with their silicon, their architecture, and whichever suppliers they choose."

source: sec.gov

Leadership co leader

Counterpoint has MediaTek ahead of every rival in all ten quarters of its public table -- 31% against Qualcomm's 23% and Apple's 19% in Q2 2026 -- but that count covers smartphone application processors only, and MediaTek's 2Q26 remarks put mobile phone at 41% of group revenue, no longer its largest business. Smart Edge Platforms is larger at 53%, and while the remarks claim 'continued market share gains across connectivity, computing and automotive products', no independent count of those positions appears in the sources used here. In data center MediaTek holds nothing yet: production of its first AI accelerator ASIC is scheduled for the fourth quarter of 2026, and 15% to 20% is a 2027 target raised from 10% to 15% a quarter earlier. Inside its core market the flagship tier is a stated plan rather than a claimed position -- a 2nm SoC launching in the third quarter and, 'together with ongoing engagements with global players, we will increase our presence continuously in the flagship smartphone market in 2027' -- while Counterpoint records MediaTek's premium-tier shipments declining on a 'slowdown in sales of Dimensity 9000 series powered devices.'

source: mediatek.com

co leader

The 20-F calls ASEH "a leading provider of semiconductor manufacturing services in assembly and testing" and "a market leader in SiP technologies from design to assembly with high-volume manufacturing", and says it has "established ourselves as a leader through the successful introduction of leading-edge advanced packaging solutions, which have played a pivotal role in bringing advanced ASIC and HBM products to the marketplace" — but the hedged "we believe we are among the leaders in such packaging processes and technologies", alongside named consolidating rivals (Jiangsu Changjiang Electronics Technology/STATS ChipPAC, Amkor/J-Devices, Tianshui Huatian Technology/Unisem) and TSMC's InFO, describes shared rather than sole leadership.

source: sec.gov

at parity

The 10-K calls Jabil "one of the leading providers of engineering, manufacturing, and supply chain solutions" and claims no rank. Independently, EMSNOW/in4ma's "EMS&ODM Global 100" (2026-03-06, https://www.emsnow.com/?p=53535) groups Jabil with Flex, Celestica and Sanmina as the US "big four", "representing about 85% of the revenue base among ~20 US headquartered EMS/ODM", while Wistron, Quanta and Wiwynn "plus Foxconn together account for nearly 57% of global EMS/ODM production". The 10-K concedes some competitors have "substantially greater manufacturing, research and development (R&D) and marketing resources". Among the largest Western contract manufacturers but behind the Taiwanese leaders in scale: at parity, not a leader.

source: sec.gov

Pricing power moderate

The 2Q26 remarks describe price as cost pass-through rather than capture: 'As rising costs across the supply chain have become an industry-wide reality, we are taking pricing actions to ensure these increases are appropriately reflected in our product pricing', with the full-year aim, 'through our disciplined pricing strategy', to 'deliver our full year gross margin within the current quarter guidance range' -- holding a band, not widening it. The realised figures show that defence working: gross margin 46.2%, down 0.1 percentage points sequentially, with Q3 guided at 46% plus or minus 1.5 points. The 2.9-point year-over-year decline is not an erosion rate; the company states it 'was mainly due to a one-time benefit in the year-ago quarter.' Holding a mid-40s gross margin through a market the company expects to decline 'by about 15% in units this year' is genuine discipline, but passing rising costs through to defend a guided band is not the ability to price above it.

source: mediatek.com

weak

The 20-F states the industry has "a general trend toward declining prices for products and services of a given technology over time" and that ASEH's own "average selling prices of our packaging and testing services have experienced sharp declines" under "intense price competition". FY2025 consolidated gross margin was 17.7% (up from 16.3%), and management attributes the gain to "higher packaging and testing revenue mix and higher factory utilization" rather than price; the EMS half earned a 9.2% gross margin on raw-material costs equal to 78.7% of EMS revenue, and the five largest customers supplied 46.5% of 2025 operating revenues.

source: sec.gov

weak

Stored fundamentals show gross profit of $2,867 million on $34,702 million of revenue in fiscal 2023, $2,676 million on $28,883 million in fiscal 2024 and $2,646 million on $29,802 million in fiscal 2025. The 10-K says "Most of our significant long-term customer contracts permit quarterly or other periodic prospective adjustments to pricing based on decreases and increases in component prices and other factors", so component costs largely pass through, while competitors may "be better positioned to compete on price for their services". Management's fiscal 2027 outlook is a core operating margin (non-GAAP) of 6.1% (release, https://www.sec.gov/Archives/edgar/data/898293/000162828026063890/jbl-20260930ex991.htm).

source: sec.gov

Summary

MediaTek is the largest supplier of smartphone application processors by units and has been for as long as Counterpoint's public quarterly table runs. Across all ten quarters it covers, Q1 2024 through Q2 2026, MediaTek is first every time and never below 31%, while the nearest rival never clears 30%; in Q2 2026 it holds 31% against Qualcomm's 23%, Apple's 19%, UNISOC's 13%, Samsung's 9% and HiSilicon's 5%. That is a real, independently counted position, and it is the only part of MediaTek's business for which such a count exists in the sources used here. The same table is the clearest evidence that the position is being defended rather than extended. MediaTek's share moves inside a 31% to 41% band across the ten quarters, and the top of that band has come down -- 41% in Q1 2024, 38% in Q1 2025, 33% in Q1 2026 -- while the 31% of Q2 2026 matches the lows already set in Q4 2024 and Q4 2025 rather than breaking them; measured like for like against the same quarter a year earlier the series runs 34%, 36%, 31%. Counterpoint records MediaTek's shipments falling more than 30% year-over-year in the quarter -- hit in the mainstream and entry tiers by the memory shortage, and in the premium tier by a slowdown in Dimensity 9000 series devices -- while Samsung's Exynos climbed to 9% on Galaxy S26 base variants and mid-tier A-series wins. MediaTek's own 2Q26 remarks show the gross line holding and the operating line not: gross margin of 46.2%, down 0.1 percentage points sequentially and guided at 46% plus or minus 1.5 for the third quarter, against operating income down 22.2% year-over-year on revenue up 1.2%, with operating expenses of NT$47.4 billion against NT$44.5 billion a year earlier. Unit leadership held while the return on it did not. What MediaTek re-uses is design IP. It manufactures nothing itself -- the remarks describe deep design-technology co-optimization with TSMC and close work with advanced-packaging partners -- and they locate the durable asset in a pre-validated library of memory, I/O and connectivity subsystems, 448G SerDes with a Co-Package Copper system solution, CPO development on TSMC's COUPE platform, and an end-to-end 3.5D platform. The spending behind that library is visible in the cost line: operating expenses of NT$47.4 billion in the quarter against NT$44.5 billion a year earlier, with the Q3 operating expense ratio guided at 31% plus or minus 2 points against a gross margin guided at 46% plus or minus 1.5 -- an operating cost base running near a third of revenue. That library is now pointed at two adjacencies. Smart Edge Platforms -- connectivity, computing, automotive and TV SoCs -- is now the larger business, at 53% of revenue in Q2 against mobile's 41%, and grew 26% year-over-year while mobile fell 20%. And the company says it has built its first AI accelerator ASIC for a major US cloud customer, with production scheduled for the fourth quarter of 2026. One adjacency is a target and one is a contribution, and this profile treats them as exactly that. The data center share figure of 15% to 20% is a 2027 target against a served market MediaTek itself sizes at US$80 billion, raised from 10% to 15% only one quarter earlier, and production of the first ASIC was still scheduled for the fourth quarter at the date of the remarks. The RTX Spark AI PC work is corroborated by NVIDIA's own announcement, which credits MediaTek with collaborating on the custom CPU design and contributing to its power efficiency, performance and connectivity -- but the superchip, its Grace CPU, its NVLink-C2C interconnect and its software stack are NVIDIA's, and the systems ship from PC makers, so what MediaTek holds is a design contribution rather than a franchise with a share to count. The claimed share gains in connectivity, computing and automotive carry no number and no third-party count. The honest reading is a company with one durable, independently verified franchise it is holding rather than extending, funding a credible but still unproven move into higher-value silicon on the strength of its IP portfolio.

ASEH sells turnkey assembly and test at a scale most captive IDM lines cannot match: the 20-F says it is "involved in all stages of the semiconductor manufacturing process except circuit design and wafer fabrication", and leans on Taiwan, "currently the largest center for outsourced semiconductor manufacturing in the world", plus a "strategic alliance with TSMC", to sit next to the foundries its customers already use. The durable part is cost position from utilization, not customer capture — the filing concedes customers multi-source and that foundries are moving into advanced packaging from above.

Jabil provides engineering, manufacturing and supply chain services through three segments. Per its FY2025 10-K, Intelligent Infrastructure serves "capital equipment, cloud and data center infrastructure, and networking and communications" customers; Regulated Industries serves automotive and transportation, healthcare and packaging, and renewables and energy infrastructure; and Connected Living and Digital Commerce is focused on "digitalization and automation, including warehouse automation and robotics". AI demand now drives growth: the fiscal 2026 release (2026-09-30) reports net revenue of $36.0 billion, with the CEO saying Jabil "grew revenue 21%, expanded core operating margin 40 basis points", and on the Q4 FY2026 call management said "AI-related revenue was up 60% year-over-year", that Jabil "ended the year with four customers with AI related revenue above a billion dollars annually", and that it expects cloud and data center infrastructure revenue of "approximately $17.5 billion" in fiscal 2027. The 10-K shows the limits: the five largest customers were approximately 36% of fiscal 2025 revenue and one customer, reported primarily in Intelligent Infrastructure, 16%; manufacturing processes are "generally not subject to significant proprietary protection"; and competitors may "be willing or able to make sales or provide services at lower margins than we do". An independent tally (EMSNOW/in4ma, 2026-03-06) counts Jabil among the US "big four" EMS providers while putting Foxconn, Wistron, Quanta and Wiwynn at "nearly 57% of global EMS/ODM production". A large, fast-growing contractor without a protected position.

Chain position

A fabless designer sitting between its customers and the TSMC-centred manufacturing chain. The 2Q26 remarks describe 'deep design-technology co-optimization (DTCO) with TSMC' and close work with advanced-packaging partners to build 'high-performance ASICs across a broad range of very-large chip sizes using CoWoS and EMIB-T technologies' at nodes down to 2nm, and say MediaTek creates 'significant value beyond semiconductor by orchestrating other key components throughout the supply chain such as memory and substrate' -- a coordinator role as much as a design one.

Back-end contractor to the AI silicon chain: the 20-F ties its FOCoS, FOCoS-Bridge and 2.5D/3D lines to "ASICs and HBM for HPC, networking, server and AI/ML applications" and "AI accelerators for AI training", and warns that a slowdown in AI demand would leave "lower utilization rates for our specialized equipment".

Contract manufacturer for cloud, networking, semiconductor-equipment, automotive, healthcare and consumer customers. On the Q4 FY2026 call management said "Others in the industry are building product companies around their own power and cooling platforms and asking customers to standardize on them. That's a legitimate model. Ours is different."

Products (share / barrier)
  • Electronic manufacturing services (USI Group) Challenger · Low source: sec.gov
  • Leading-edge advanced packaging (FOCoS, FOCoS-Bridge, 2.5D/3D IC, co-packaged optics) Top 3 · Deep source: sec.gov
  • Semiconductor packaging services Top 3 · Moderate source: sec.gov
  • Semiconductor testing services Top 3 · Moderate source: sec.gov
  • System-in-Package (SiP) and module solutions Leader · Moderate source: sec.gov
Long-horizon vote +0.13 at weight 0.20 · swarm neutral

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+0.05 at weight 0.20 · swarm neutral

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-0.06 at weight 0.20 · swarm neutral

Editorial prior, not backtested.

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