Compare moats
Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.
| Qualcomm | FormFactor | ASMPT | |
|---|---|---|---|
| Moat rating | narrow Qualcomm's advantage is real but concentrated in one segment. The FY2025 10-K (filed 2025-11-05) describes its portfolio as "the most widely and extensively licensed in the industry" and says the industry "generally recognizes that any company seeking to develop, manufacture and/or sell certain cellular products requires a license or other rights to use our patents". That licensing leg produced $5,582M of FY2025 revenue against $38,367M at QCT, where Apple, Samsung and Xiaomi are all named in the vertical-integration risk factor and Apple already "utilizes its own modem... in certain of its smartphones". The filing frames the QCT loss as expected rather than realised. | narrow An independent tracker places FormFactor in a small group of suppliers, but the same tracker expects it to lose the top spot. TrendForce's June 2026 report on the probe card market (Part 2, 2026-06-26, https://www.trendforce.com/research/download/RP260626XO3) says 'FormFactor, Technoprobe, and MJC dominate, while Taiwan's CHPT, MPI, and WinWay gain share riding the AI wave'. It describes the economics as 'Consumable probe tips create a high-margin hardware subscription model; repair and replacement fees are key profit drivers'. Its outlook reads: 'Total revenue is forecast to surge sharply in 2026, with Technoprobe poised to overtake FormFactor as the top global supplier.' FormFactor's own margins over the last three fiscal years do not show exceptional returns. TradingPilot's fundamentals record from the FY2025 10-K (https://www.sec.gov/Archives/edgar/data/1039399/000103939926000009/0001039399-26-000009-index.htm) shows gross profit of $258.6M on $663.1M of revenue in FY2023, $307.9M on $763.6M in FY2024 and $308.9M on $785.0M in FY2025. Gross margin has since risen to 50.7% (GAAP) in Q2 2026. A defended place among three dominant suppliers, but one whose rank is slipping to a rival, is a narrow moat rather than a wide one. | narrow ASMPT has a real but contested position in thermo-compression bonding (TCB), and its returns were thin until 2026. On the durable side, TrendForce (2025-12-12, citing The Elec) reports that SK hynix 'is using about fifty sets of TC bonders for HBM4 production, with roughly half supplied by ASMPT'. It adds that Hanmi had been SK hynix's exclusive TC bonder supplier for HBM 'until last year, when ASMPT joined the supply chain toward year-end'. ASMPT's FY2025 results announcement reports TCB revenue growth of about 146% and calls the company the 'Process-Of-Record' in chip-to-substrate bonding, which is its own claim. On the limiting side, the market is shared. TrendForce (2026-06-09, citing ET News) reports a 44.2 billion won SK hynix TC bonder order to Hanmi, and Kulicke & Soffa's FY2025 10-K lists ASM Pacific Technology among eight major equipment competitors. Returns were modest: the FY2025 announcement shows a continuing-operations adjusted gross margin of 38.3%, down 172 bps, and an adjusted SEMI segment profit margin of 8.4%. The 2026 interim results show a recovery, with SEMI's adjusted segment margin at 18.1% for 1H 2026. A contested technology lead with cyclical and recently thin returns supports a narrow moat, not a wide one. |
| Moat type | intangibles ip The durable asset is intellectual property accumulated since Qualcomm's founding "in 1985". The patents have "broad coverage in many countries, including Brazil, China, India, Japan, South Korea, Taiwan, the United States and countries in Europe" and are licensed "to hundreds of companies on industry-accepted terms", with royalties set as "a percentage of the wholesale (i.e., licensee's) selling price... subject to per unit minimums and/or per unit caps". R&D of $9,042M equalled 20% of revenues. Manufacturing is fabless "other than for certain of our RFFE modules and RF filter products", for which Qualcomm owns fabs in Germany and Singapore. | intangibles ip The tracker locates the advantage in proprietary probe technology. TrendForce's Part 1 report (2026-06-23, https://www.trendforce.com/research/download/RP260623JC3) says 'MEMS has become the mainstream probe process; proprietary tip alloy formulas are now the key differentiator for current capacity and longevity'. FormFactor's own example is SmartMatrix, its full-wafer contactor for high-bandwidth memory (HBM). On the Q1 2026 call (https://www.fool.com/earnings/call-transcripts/2026/04/29/formfactor-form-q1-2026-earnings-transcript/), management called it 'FormFactor's differentiated Smart Matrix full wafer contactor technology'. The consumable-tip model TrendForce describes is a recurring-revenue feature of the product rather than a separate lock-in, so intangibles/IP is the better-supported moat source. | intangibles ip The advantage sits in bonding process technology rather than in customer lock-in. The FY2025 results announcement credits chip-to-wafer TCB orders to an 'ultrafine pitch TCB solution equipped with proprietary plasma AOR technology', and says its HBM4 12H TCB solutions 'were the first to secure orders from multiple players'. TrendForce (2026-01-28, citing EE Times China) says ASMPT holds TCB and hybrid bonding capability, 'which the industry widely regards as the second most important technologies after lithography'. Kulicke & Soffa's FY2025 10-K says assembly equipment competes on 'price, speed/throughput, production yield, process control, delivery time, innovation, quality and customer support', which rewards technology. Switching costs are the weaker candidate: TrendForce (2025-12-12) shows SK hynix sourcing HBM4 TC bonders from both ASMPT and Hanmi. |
| Leadership | co leader Leadership is clear in licensing and contested in silicon. The 10-K names no rival licensing programme and asserts the portfolio is "the most widely and extensively licensed in the industry", while calling QCT's industries "intensely competitive" and naming eleven competitors (Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP, Qorvo, Samsung, Skyworks, TI, UNISOC); "continue to be a leader in mobile" appears in a list of things future success depends on, so it reads as aspiration, not share. The band therefore rests on the licensing leg, roughly 13% of revenue. FY2025 10%-plus customers were 21%, 20% and 13%; in 9M FY2026 only two cleared 10%. | co leader TrendForce's Part 2 report (2026-06-26) names 'FormFactor, Technoprobe, and MJC' as the dominant suppliers and says 'Total revenue is forecast to surge sharply in 2026, with Technoprobe poised to overtake FormFactor as the top global supplier', which implies FormFactor holds the top rank now and that TrendForce expects it to lose that rank. In logic, the rival reports a large position. Technoprobe's May 2026 company presentation (https://www.technoprobe.com/wp-content/uploads/2026/05/Technoprobe-Company-Presentation-May-2026.pdf, citing Yole's Q3 2024 test consumables monitor) gives Technoprobe 'Market Share: 34%' of the $1.6 billion 2024 logic probe card market and 60% of the $937 million MEMS logic probe card market. TrendForce gives no percentage for FormFactor. A shared front rank, with the overall lead forecast to pass to Technoprobe, is co-leadership. | co leader In HBM TCB, TrendForce (2025-12-12, citing The Elec) reports that roughly half of the about fifty TC bonders SK hynix uses for HBM4 came from ASMPT, and that SK hynix ordered seven more ASMPT systems at about 4 billion won each. Hanmi remains a major supplier: TrendForce (2026-06-09, citing ET News and Hankyung) reports a new SK hynix order to Hanmi worth 44.2 billion won, believed to cover around 15 units. In logic, ASMPT calls itself the 'Process-Of-Record' for chip-to-substrate TCB, which is its own claim. In wire and die bonders, Kulicke & Soffa's FY2025 10-K names ASM Pacific Technology among its major equipment competitors. The only third-party supplier split found covers one customer, SK hynix, and no third-party share figure for TCB, wire bonders or SMT was found, so the band is co_leader rather than clear_leader. |
| Pricing power | moderate QTL margins held at 72% in FY2025 and 73% in 9M FY2026, though Q3 FY2026 alone slipped to 69% from 71%, and the $111M revenue gain there is attributed to revenues per unit "primarily driven by favorable mix" rather than to price. At QCT, the fall to 26% from 30% is explained by "lower gross margin, primarily driven by higher product cost, partially offset by higher average selling prices" plus lower revenues, so the pressure is cost rather than price; FY2025 handsets rose $2,930M, of which $2.5B came from higher revenue per chipset. Against that, "declining average selling prices" is a standing risk-factor title, "particularly pronounced in emerging regions and China". | moderate Gross margin sat near 39-40% for three years, per TradingPilot's fundamentals record from the FY2025 10-K ($258.6M on $663.1M, $307.9M on $763.6M and $308.9M on $785.0M for FY2023-FY2025). It then jumped. The Q2 2026 results release (https://seekingalpha.com/pr/20600102, 2026-07-29) reports GAAP gross margin of 50.7%, against 38.4% in Q1 2026 and 37.3% in Q2 2025, and guides Q3 2026 to 52.0% plus or minus 1.5%. Management attributes the gain to cost and yield rather than price. On the Q1 2026 call it said 'pricing really is not a driver of the gross margin improvement. It's COGS reduction and our operations team continuing to improve yields and cycle times'. TrendForce describes consumable probe tips as 'a high-margin hardware subscription model'. Margins are higher now, but FormFactor itself does not credit price for the improvement. | moderate Margins are healthy for equipment but not exceptional, and they move with volume. The FY2025 results announcement reports SEMI's adjusted gross margin at 43.3% (down 240 bps) and SMT's gross margin at 32.4% (down 218 bps), with a group adjusted gross margin of 38.3%. The 2026 interim results report Q2 2026 adjusted gross margins of 46.5% for SEMI and 36.8% for SMT, and attribute both year-on-year increases largely to higher volume. TrendForce (2026-01-28, citing EE Times China) says SMT 'mainly serves traditional PCB assembly', while semiconductor packaging equipment, 'especially advanced packaging tools for AI chips', offers 'significantly higher pricing power and margins'. |
| Summary | Qualcomm has two legs pointing in opposite directions. QTL (FY2025 revenue $5,582M, EBT margin 72%) rests on a portfolio the 10-K calls "the most widely and extensively licensed in the industry", with royalties struck on the licensee's wholesale device price under per-unit minimums and caps; its durability is dated in the filing, since "our patent license agreements with key OEMs are generally long-term, with terms expiring at varying dates between fiscal 2027 and 2031", some with binding-arbitration renewal clauses, and Huawei's licence has already expired, removing its royalties from QTL revenue from Q2 FY2025. QCT ($38,367M, 87% of segment revenue) is the leg under pressure: its three 10%-plus customers all build their own silicon, Apple already ships its own modem, and QCT EBT margin fell to 26% in Q3 FY2026 from 30%. | FormFactor makes probe cards, the consumable interfaces used to test chips at wafer level, for foundry and logic customers and for DRAM including HBM. It also has a Systems business, whose co-packaged-optics probing products management said on the Q1 2026 call were ramping. TrendForce's June 2026 probe card reports name FormFactor, Technoprobe and MJC as the dominant suppliers. They say MEMS probes are now mainstream, with 'proprietary tip alloy formulas' the key differentiator. They describe consumable probe tips as 'a high-margin hardware subscription model', with order visibility stretching 'from one quarter to up to two years'. FormFactor is benefiting: Q2 2026 revenue was $258.2 million, up 31.9% year over year, and GAAP gross margin was 50.7% against 37.3% a year earlier. On the Q1 2026 call, management said a second HBM customer was increasing adoption of SmartMatrix, and that networking probe cards had made a leader in high-performance compute a 10% customer. The limits are competitive. TrendForce forecasts that Technoprobe will overtake FormFactor as the top global supplier in 2026, and says Taiwanese suppliers CHPT, MPI and WinWay are gaining share. Technoprobe's May 2026 presentation, citing Yole, puts its own share at 34% of the 2024 logic probe card market and 60% of MEMS logic probe cards. | ASMPT makes back-end manufacturing equipment in two segments. Semiconductor Solutions (SEMI) sells die and wire bonders, thermo-compression and hybrid bonders, and photonics assembly tools. SMT Solutions sells surface-mount systems for circuit-board assembly. In FY2025, continuing-operations revenue was HK$13,736.2 million, up 10.0%. SEMI contributed HK$7,380.5 million and SMT HK$6,355.8 million. Advanced packaging revenue was US$532.1 million, up 30.2% and 30% of group revenue, with a significant contribution from TCB. The company estimates the TCB market at about US$760.0 million in 2025, rising to US$1.6 billion in 2028, and targets a 35 to 40 percent share. Business accelerated in 2026. Continuing revenue for 1H 2026 was HK$8,902.6 million, up 42.5% year on year, at a 41.1% gross margin. In July 2026 the company received bulk orders for more than 50 chip-to-substrate TCB tools from OSAT customers. In memory, the interim results say the timing of new TCB purchases 'remains dependent on HBM4 product rollout schedules'. The portfolio is being reshaped. The sale of the NEXX deposition business closed on 3 June 2026, and TrendForce (2026-05-05) reported Applied Materials as the buyer at a base value of US$120 million. On 21 January 2026, ASMPT began a strategic options assessment for SMT that includes a possible divestiture, joint venture, spin-off or listing. The verdict is a narrow moat: a credible TCB position in a market shared with Hanmi and others, attached to mainstream bonder and SMT businesses with ordinary margins. |
| Chain position | Every figure and quotation is drawn from the FY2025 10-K and the Q3 FY2026 10-Q. Where the filings state no market share, the share band is left unknown rather than inferred, and barrier bands follow the filings' own language, which states a barrier to entry only for automotive. | A wafer-test consumables supplier between chipmakers and tester makers. Its customers include HBM and DRAM makers and foundry/logic chip designers. TrendForce's Part 1 report (2026-06-23) says 'Advantest and Teradyne have taken stakes in Technoprobe, FormFactor, and MJC, signaling accelerated vertical integration ahead.' | Back-end equipment supplier to IDMs, OSATs, memory makers and electronics assemblers. China was 41% of 2025 revenue and the top five customers about 16%, per the FY2025 results announcement. |
| Products (share / barrier) |
|
|
|
| Long-horizon vote | +0.13 at weight 0.20 · swarm bearish Editorial prior, not backtested. | +0.13 at weight 0.20 · swarm neutral Editorial prior, not backtested. | +0.13 at weight 0.20 · swarm bearish Editorial prior, not backtested. |