Compare moats
Up to three covered companies, band by band. Every call is a curated editorial judgment, never a disclosed figure — and every band carries its cited basis.
| Tokyo Electron | Eaton | Intel | |
|---|---|---|---|
| Moat rating | narrow Integrated Report 2026 (issued 2026-09-15) documents strong positions across the line: by Tokyo Electron's own estimate it ranks No. 1 in diffusion furnaces, batch deposition, metal deposition, coater/developers, gas chemical etch and wafer probers, No. 2 in plasma etch and bonders and No. 3 in cleaning, and holds a "100% share" of coater/developers for EUV lithography; its installed base, industry-leading by its own estimate, is approximately 100,000 units, growing by approximately 4,000-6,000 units a year; and its 26,592 patents rank No. 1 in the semiconductor production equipment industry on the LexisNexis PatentSight+ database. Reported returns stayed high through a sales decline: gross profit margin stayed between 44.6% and 47.1% and ROE between 21.8% and 37.2% across fiscal 2022-2026, including fiscal 2024 when net sales fell to ¥1,830.5 billion. The share ranks, the EUV share and the installed-base lead are company estimates, not third-party data. | wide The FY2025 10-K asserts a durable competitive position across essentially all of the revenue base: for Electrical Americas and Electrical Global it states 'Eaton has a strong competitive position in these segments and, with respect to many products, is considered among the market leaders'; it repeats that language verbatim for Aerospace ('industry-leading portfolio', 'considered among the market leaders'); and for Vehicle it states 'Eaton is considered among the market leaders in this segment.' That is a claimed leadership position in four of the five reported segments, on a base of $27.4 billion of 2025 revenue, ~97,000 employees and customers in 180 countries, from a company founded in 1911. The rating is tempered rather than lifted higher by the filing's own admissions - price is named among the principal methods of competition in the Electrical, Vehicle and eMobility segments, and the risk factors flag 'newly competitive market players' and that 'our positions may also be impacted by new entrants into our product or regional markets.' | eroding The FY2025 10-K (filed 2026-01-23) repeats the concession, now broadened: 'we have lost market share in recent years, including in both client and data center markets, in the market for x86-based semiconductor products, and more generally in the markets for semiconductor compute products, as competitors have introduced highly competitive data center and client platform products.' It adds that the data-center business 'has been further negatively impacted in the past few years by the significant shift of customer spend toward GPUs optimized for AI workloads' — a historically wide moat still actively eroding. |
| Moat type | intangibles ip The report calls its patent portfolio its "fifth strength" and says that "by supporting our other four strengths, it serves a vital role as the foundation" for medium- to long-term corporate value: 26,592 patents as of March 31, 2026, 1,415 inventions created in Japan and 345 overseas in 2025, and Clarivate Top 100 Global Innovators recognition for the fifth consecutive year. The other strengths rest on the same proprietary process know-how — co-created technology roadmaps that evaluate technologies "for the next four generations and beyond" with customers, "numerous development PORs" (process of record) in the frontend business, and the EUV coater/developer position — so proprietary process technology, reinforced by qualification in customers' process flows, is the moat source. | switching costs The filing's own description of how it competes points at designed-in and qualified positions rather than IP or pure scale. In Aerospace the principal methods of competition are listed as 'total cost of ownership, product and system performance, quality, design engineering capabilities, and timely delivery' - price is conspicuously absent, and 20% of segment sales go to three large aircraft OEMs, i.e. platform-level content that is qualified in and hard to displace mid-programme. In the Electrical segments 'customer service and support' sits alongside performance and technology as a method of competition, and 22% of sales go to six large customers. Intangibles_ip is explicitly ruled out as the primary source by the company itself: 'management believes that the loss or expiration of any single intellectual property right would not in and of itself have a material effect on Eaton's consolidated financial statements or its business segments.' Scale is real but secondary - the filing notes raw materials are bought 'from many suppliers' and 'under normal circumstances, the Company has no difficulty obtaining its raw materials,' which reads as supply resilience rather than a cost advantage claim. | intangibles ip The durable assets remain the x86 architecture and process-technology IP: the FY2025 10-K claims 'We are a global leader in the design and manufacturing of CPUs and other semiconductor products' and stakes the recovery on process IP — 'Intel 18A introduces two industry firsts in high-volume semiconductor manufacturing: gate-all-around transistors (RibbonFET) and backside power delivery (PowerVia).' |
| Leadership | co leader The CEO's message describes Tokyo Electron as "one of the world's leading suppliers of semiconductor production equipment" and states a "goal of becoming number one globally" — it does not claim to be the largest supplier overall — while by its own estimate it ranks No. 1 in six charted segments (diffusion furnace, batch deposition, metal deposition, coater/developer, gas chemical etch, wafer prober), No. 2 in plasma etch and bonders, and No. 3 in cleaning. | co leader The filing's leadership language is plural and hedged, not exclusive: 'considered among the market leaders' for the Electrical segments (qualified further by 'with respect to many products'), 'among the market leaders' for Aerospace, and 'Eaton is considered among the market leaders' for Vehicle. Nowhere does the 10-K claim to be the single leader in any market, and it never names a competitor or cites a market-share figure. 'Among the market leaders' maps to co_leader, not clear_leader. | fast follower The FY2025 10-K still opens 'We are a global leader in the design and manufacturing of CPUs', yet concedes lost share 'in both client and data center markets' and a spend shift 'toward GPUs optimized for AI workloads' where Intel participates via 'Xeon, AI PCs, Arc GPUs and our open software stack' plus 'inference-optimized GPUs on a targeted annual cadence' — following the AI compute market rather than setting its pace. |
| Pricing power | moderate Gross profit margin held in a 44.6%-47.1% range over fiscal 2022-2026, including fiscal 2024's sales decline, but in fiscal 2026 it fell 1.8 points to 45.3% "due to factors such as higher raw material prices and increased labor costs" even as net sales reached a record, and the CEO lists "revising prices appropriately with respect to cost increases caused by inflation" among five initiatives needed to improve the operating margin. | moderate The filing describes pass-through ability that is real but bounded. On input costs: 'While we strive to recoup these increased costs through our pricing, product modifications or other mediating responses, if we are unable to do so without compromising the competitive position of our products and services, our results could continue to be impacted by this trend.' On macro conditions: 'our responses to mitigate the impact of these conditions, such as potential price increases, could negatively impact our market share or relationships with distributors or customers.' On tariffs: 'potential price increases or other mitigating efforts could negatively impact market share or otherwise increase the risk of customer disputes.' Price is also listed as a principal method of competition in Electrical Americas, Electrical Global, Vehicle and eMobility - so raising price is described by the company as costing share. Aerospace is the exception, where price is not among the listed methods of competition. The filing states no gross-margin trend in Item 1 or Item 1A. | weak The FY2025 10-K states the mechanism itself: higher-priced products 'have lower margins as they are produced at external foundries rather than in our manufacturing facilities. To the extent demand shifts from our higher-margin to lower-margin products in any of our market segments, our gross margin percentage has decreased and may decrease again' — plus $878 million of 2025 inventory reserves on the early Intel 18A ramp. |
| Summary | Tokyo Electron makes wafer fab equipment for what its Integrated Report 2026 calls the "four key processes necessary for semiconductor scaling: deposition, coater/developer, etch, and cleaning", plus wafer probers and bonders for test and advanced packaging. The report grounds its edge in breadth and incumbency: leading share estimates in most of its segments, an estimated 100% share of EUV coater/developers, an installed base of approximately 100,000 units, industry-leading by its own estimate, feeding a Field Solutions business that sold ¥626.0 billion of parts, services, used equipment and modifications in fiscal 2026, and the industry's largest patent portfolio. Fiscal 2026 net sales were a record ¥2,443,533 million, but gross profit margin fell 1.8 points to 45.3% on higher raw material prices and labor costs, and operating margin fell 3.1 points to 25.6% as R&D expenses rose 11.1% to ¥277,866 million. China accounted for 34.1% of fiscal 2026 net sales, down from 41.7% the year before. | Eaton describes itself in the FY2025 10-K as an 'intelligent power management company' making products for the data center, utility, industrial, commercial, machine building, residential, aerospace and mobility markets, capitalising on 'the megatrends of the electrification, digitalization, and the reindustrialization of and growth of megaprojects in North America.' Its defensibility rests on positions the filing says are already at or near the front of their markets - a 'strong competitive position' in both Electrical segments and Aerospace, competed on performance, technology, service and, in Aerospace, engineering and total cost of ownership rather than price - reinforced by acquisitions aimed at owning more of the electrical value chain into the data center (Fibrebond for 'modular solutions for multi-tenant and hyperscale data center customers,' Resilient Power Systems to accelerate 'commercialization of solid-state transformer technology,' and an agreed acquisition of Boyd Thermal adding 'critical liquid cooling technology, enabling the Company to serve hyperscale and colocation customers from the chip to the grid'). The counterweight, stated by the company, is customer concentration and a portfolio in flux: on January 26, 2026 Eaton announced its intention to spin off its Mobility business (the legacy Vehicle and eMobility segments) into an independent public company, and re-segmented accordingly in Q1 2026. | Still the incumbent x86 CPU designer-manufacturer — FY2025 revenue was $52.9 billion, roughly flat — but the filing concedes lost share in client and data center and an AI-driven customer shift toward GPUs; the counter-thesis is process IP, with Intel 18A shipping in Core Ultra Series 3 ('the first products to be manufactured using our new Intel 18A process technology') and Intel 14A 'designed from inception as an offering to external customers.' |
| Chain position | Upstream equipment supplier to chipmakers: fiscal 2026 new-equipment sales of ¥1,775.4 billion went 59% to non-memory (logic, foundry, others), 31% to DRAM and 10% to NAND; by region, China took 34.1%, South Korea 22.3% and Taiwan 20.4% of net sales. | Upstream electrical infrastructure into AI compute: Eaton supplies the power path from grid to rack, and the 10-K makes that link itself - data center is the first market it names, it cites 'momentum in the data center and utility end markets,' and its 2025-26 acquisitions target hyperscale/colocation modular buildings, solid-state transformers and liquid cooling 'from the chip to the grid.' Its exposure to AI is as a supplier to AI buildout, not as an AI technology vendor; the filing's only AI discussion of its own products is a risk factor about keeping pace with AI internally and about generative-AI compliance risk, which is incidental to the thesis. | x86 compute incumbent and would-be US leading-edge foundry; its 18A/14A ramp is the main Western alternative to TSMC at the leading edge. |
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| Long-horizon vote | +0.13 at weight 0.20 · swarm bearish Editorial prior, not backtested. | +0.30 at weight 0.20 · swarm neutral Editorial prior, not backtested. | -0.24 at weight 0.20 · swarm neutral Editorial prior, not backtested. |