合作
Applied Materials and Besi expand advanced-packaging partnership
Besi joined Applied Materials' EPIC Center as an Innovation Partner, extending the companies' hybrid-bonding collaboration across the interconnect technologies customers need to scale AI systems.
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Accessibility: Skip TopNav Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling October 01, 2026 09:00 ET | Source: Applied Materials, Inc. Applied Materials, Inc. Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in Singapore Expanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications supporting AI infrastructure build-out Partnership expands beyond die-to-wafer hybr…