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新聞: 截至 2026-10-12
這些標記是什麼意思

重要性是模型對已發布報導給出的 1–5 分，不是對市場的預測。

已排定事件列上的影響是公司顯著度層級（高/中由圖譜中心度與規模判定；低僅用於人工整理的次要事件），不是對波動幅度的預測。

標記為已確認的財報日期，是 Yahoo Finance 認定由公司確認的；預估表示尚未公布。未加標記的列沒有可查的出處記錄。

經濟數據發布屬於總體經濟、不歸屬任何產業，因此在任何檢視下都會保留。沒有數值的發布表示尚未公布，頁面會直說，而不是顯示為零。

涵蓋被追蹤公司的即將到來的事件；已過去的事件會歸檔，並在可得時補上結果——這些結果都經人工整理並附引用，絕不杜撰。沒有結果的歷史列會顯示「結果待定」。

閉鎖期屆滿或指數調整的列會多出一行算術——將變得可賣出的股數，或指數基金必須買進的股數，以佔流通股的比例表示——依招股說明書或指數編製方法讀出，兩個數字都在該列註明出處。它陳述的是機制，不是價格走勢。由 IPO + 180 天推算出的閉鎖期日期會一直標為預估，直到公司自己說明為止。

未來

已排定 · 今天與明天 · 行事曆更新於 2026-10-13

10月13日週二 · 今天

10月14日週三

過往

已發布 · 最新在前

9月14日週一

產品

09:52
ROI-NJ

CoreWeave launches physical AI field engineering service for industrial AI models

CoreWeave announced Physical AI Field Engineering on 10 September: its specialist engineers work alongside a customer's own engineering team to build AI models from data the customer already holds and integrate them into existing workflows and applications. Named target sectors are automotive, aerospace, mechanical engineering and robotics. The offering stems from CoreWeave's acquisition of Monolith AI.

文章預覽

Home Tech CoreWeave launches physical AI field engineering service for industrial AI models Tech CoreWeave launches physical AI field engineering service for industrial AI models By ROI-NJ Staff September 14, 2026 Facebook Twitter Linkedin CoreWeave Inc. has launched Physical AI Field Engineering, a service that helps industrial and engineering teams turn proprietary data into production-ready artificial intelligence models. The offering pairs customer teams with CoreWeave domain specialists to build, validate and deploy AI across the engineering lifecycle, from research and development throug…

CoreWeave 開啟原文 ↗

融資

08:07
TradingView

Toshiba cuts stake in Kioxia Holdings Corp to 12.84% from 14.06%, filing shows

A regulatory filing shows Toshiba has cut its shareholding in Kioxia Holdings to 12.84%, down from the 14.06% reported previously. No reason is given in the filing flash.

Kioxia Holdings 開啟原文 ↗

合作

07:11
KED Global

Samsung, SK Hynix reject KEPCO's $17 billion power-bill prepayment plan

Samsung Electronics and SK Hynix have turned down Korea Electric Power Corp.'s proposal that they prepay a combined 25 trillion won (about $17 billion) in electricity charges. KEPCO had sought the prepayment from its two largest industrial customers.

Samsung ElectronicsSK Hynix 開啟原文 ↗

融資

06:08
The Investor

Samsung, SK hynix reject Kepco's W25tr power-bill proposal

Samsung Electronics and SK hynix have rejected Korea Electric Power Corp.'s proposal that they prepay a combined 25 trillion won (about $18.4 billion) in electricity charges, roughly five years of bills — about 20 trillion won from Samsung and 5 trillion won from SK hynix. Kepco sought the advance payments primarily to invest in the national power grid and accelerate electricity infrastructure for the semiconductor clusters in Yongin and the Honam region, offering an interest rate higher than the yield on two-year government bonds with accrued interest applied against electricity bills every six months. The Investor reports the chipmakers determined that committing such a large amount of cash upfront would be difficult to justify amid uncertainty over the longer-term semiconductor cycle, and that a large advance payment could limit financial flexibility while both companies are making heavy investments in advanced chips and production capacity.

文章預覽

▶주메뉴 바로가기 ▶본문 바로가기 MOBILE Sept. 15, 2026 Markets Stocks & Bonds | Deals | Economy | Finance | Office Consulting Companies Automobiles | Retail & Consumer | Industrials | The Boardroom Tech Samsung | LG | Mobile & Internet Bio Startups Blockchain Industrials Samsung, SK hynix reject Kepco’s W25tr power-bill proposal PUBLISHED : Sept. 14, 2026 - 15:08:28 The headquarters of Samsung Electronics in Suwon (left) and SK hynix in Icheon, both in Gyeonggi Province (Newsis) Samsung Electronics and SK hynix have rejected a proposal from Korea Electric Power Corp. to prepay a combined 25 trillion won ($1…

Samsung ElectronicsSK Hynix 開啟原文 ↗

產品

03:29
TrendForce

TSMC Reportedly Targets 22% 2nm, 16%+ 3nm Capacity Boost by Mid-2027; CoWoS to Double by 2028

Supply-chain reporting says TSMC plans to raise 2nm capacity about 22% and 3nm capacity more than 16% by mid-2027, and to roughly double CoWoS advanced-packaging capacity by 2028. CoWoS is the binding constraint on AI accelerator output.

TSMC 開啟原文 ↗

原始消息流

所有到達的消息 · 7 天