合作
Applied Materials and Intel collaborate on chipmaking R&D for AI computing
Applied Materials is working with Intel to accelerate development of next-generation transistors, interconnects and advanced packaging, linking Applied's EPIC Center in Silicon Valley with Intel's R&D campus in Hillsboro, Oregon. No financial terms were disclosed.
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Accessibility: Skip TopNav Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing October 06, 2026 09:00 ET | Source: Applied Materials, Inc. Applied Materials, Inc. Collaborations at Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems Collaboration builds on the companies’ long history of working together to solve complex semiconductor device scaling challenges SANTA CLARA, Calif., Oct. 06, 20…