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新聞: 截至 2026-10-12
這些標記是什麼意思

重要性是模型對已發布報導給出的 1–5 分，不是對市場的預測。

已排定事件列上的影響是公司顯著度層級（高/中由圖譜中心度與規模判定；低僅用於人工整理的次要事件），不是對波動幅度的預測。

標記為已確認的財報日期，是 Yahoo Finance 認定由公司確認的；預估表示尚未公布。未加標記的列沒有可查的出處記錄。

經濟數據發布屬於總體經濟、不歸屬任何產業，因此在任何檢視下都會保留。沒有數值的發布表示尚未公布，頁面會直說，而不是顯示為零。

涵蓋被追蹤公司的即將到來的事件；已過去的事件會歸檔，並在可得時補上結果——這些結果都經人工整理並附引用，絕不杜撰。沒有結果的歷史列會顯示「結果待定」。

閉鎖期屆滿或指數調整的列會多出一行算術——將變得可賣出的股數，或指數基金必須買進的股數，以佔流通股的比例表示——依招股說明書或指數編製方法讀出，兩個數字都在該列註明出處。它陳述的是機制，不是價格走勢。由 IPO + 180 天推算出的閉鎖期日期會一直標為預估，直到公司自己說明為止。

未來

已排定 · 今天與明天 · 行事曆更新於 2026-10-13

10月13日週二 · 今天

10月14日週三

過往

已發布 · 最新在前

10月12日週一

合作

15:00
NVIDIA Blog

NVIDIA contributes Vera Rubin rack designs to OCP; Meta adopts Spectrum-6 switches

At the OCP Global Summit, NVIDIA contributed key Vera Rubin rack and compute tray designs to OCP through its open MGX architecture. Meta is adopting NVIDIA Spectrum-6 102.4Tb/s Ethernet switches to build larger Vera Rubin AI factories, and NVIDIA joined AMD, Google and Meta to publish the Open Data Center Specification v0.7, a blueprint for AI factory facility design.

文章預覽

As AI factories grow from megawatts to gigawatts, building them takes more than advanced computing. Open standards are helping the industry scale AI infrastructure faster, more efficiently and more reliably. At the Open Compute Project (OCP) Global Summit, taking place in the San Jose McEnery Convention Center, NVIDIA announced new partnerships and contributions aimed at creating a common foundation for next-generation AI infrastructure. NVIDIA contributed key NVIDIA Vera Rubin rack and compute tray designs to OCP through the open NVIDIA MGX architecture, giving system builders a common founda…

AMDAlphabetMeta PlatformsNVIDIA 開啟原文 ↗

合作

15:00
NVIDIA Newsroom

NVIDIA and Cisco announce USFP, a 400Gb/s-per-lane pluggable optics form factor

NVIDIA and Cisco announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), an optical module for 400Gb/s-per-lane signals enabling capacity up to 12.8Tb/s, with 4x the bandwidth density and 1.3x the power efficiency of 200Gb/s-per-lane optics. The companies are working with TE Connectivity and Amphenol on USFP cages, connectors and modules and plan an open industry specification through a community-led multi-source project.

文章預覽

NVIDIA Commits $1 Billion to Advance US Science Over the Next Five Years October 8, 2026

AmphenolCisco SystemsNVIDIATE Connectivity 開啟原文 ↗

產品

13:01
The Official Microsoft Blog

Microsoft to scale Azure Maia to multi-gigawatt deployments from 2027; details Maia 300

Microsoft said it will scale its Azure Maia chip family to multi-gigawatt deployments starting in 2027, making Maia the primary inference system for Microsoft products and services. Maia 300, whose compute chiplets are built on TSMC's N2P process, is expected to deliver 40% more tokens per megawatt than leading GPU-based systems and will begin production deployments in 2027; Maia 200 is already serving production workloads including Microsoft Copilot.

文章預覽

Azure Maia 200 now in production; Azure Maia 300 coming in 2027 As we move into the era of Super Intelligence, Microsoft is entering a new phase of infrastructure. We will scale our Azure Maia family to multi-gigawatt deployments starting in 2027, making Maia the primary inference system for Microsoft products and services. The multigenerational Azure Maia program has become a foundational element of Microsoft’s AI infrastructure strategy. Maia 200 is now serving Microsoft production workloads, including Microsoft Copilot , and supporting the MAI team as they develop next-generation models, wi…

MicrosoftTSMC 開啟原文 ↗

產品

13:00
Credo Technology

Credo unveils 1.6T ZeroFlap Active Light Cable for AI data centers, shipping in 2027

Credo unveiled a 1.6T ZeroFlap active light cable (ALC), a wide-parallel optical interconnect for AI scale-out and front-end networks designed to draw 12W per cable-end, roughly 30% less than comparable active electrical cables, with a targeted reach up to 50m. The product will be shipping in 2027.

Credo Technology 開啟原文 ↗

產品

13:00
AMD

AMD introduces Helion, an open OCP-based rack blueprint for agentic AI

AMD introduced the AMD Helion agentic AI rack, an open blueprint based on an Open Compute Project spec design, with configurations including a CPU-only rack of 6th Gen EPYC processors supporting up to 32,768 CPU cores and an all-in-one rack combining EPYC CPU nodes with Instinct MI350P GPU nodes. AMD plans to contribute the specification to OCP, and Helion configurations are planned to be available in November 2026.

文章預覽

Introducing AMD Helion, Agentic AI Compute at Rack Scale October 12, 2026 9:00 am EDT Download as PDF News Highlights: AMD Helion lets customers tailor CPU core density, performance and power to agentic workloads, with CPU-only configurations for hyperscale deployments and integrated CPU/GPU configurations for enterprises. AMD Helion combines open hardware and software with an integrated token router that directs agents’ model calls across frontier and open-source models. SANTA CLARA, Calif., Oct. 12, 2026 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today introduced the AMD Helion agentic AI rack, a…

AMD 開啟原文 ↗

原始消息流

所有到達的消息 · 7 天