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Focus Taiwan App Download Business Hon Hai reports first monthly sales over NT$1 trillion in September 10/05/2026 05:19 PM Listen Link Whatsapp Reddit Line Email To activate the text-to-speech service, please first agree to the privacy policy below. CNA file photo Taipei, Oct. 5 (CNA) Taiwan-based manufacturing giant Hon Hai Precision Industry Co. said on Monday that its monthly sales passed the NT$1 trillion (US$31.50 billion) mark for the first time in September, largely based on the performance of its cloud and networking division during the current AI era. In a statement, Hon Hai, also kno…

Exhibit 99.1 Tesla Third Quarter 2026 Production, Deliveries & Deployments   In the third quarter, we produced over 464,000 vehicles, delivered over 486,000 vehicles and deployed 13.7 GWh of energy storage products. Thank you to all of our customers, employees, suppliers, shareholders and supporters who helped us achieve these results.   Q3 2026 Production Deliveries Subject to operating lease accounting Model 3/Y 457,387 478,237 1% Other Models 7,004 8,295 4% Total 464,391 486,532 1% ***   Tesla will post its financial results for the third quarter of 2026 after market…

Applied Digital Brings an Additional 75 MW of AI Infrastructure Online at Polaris Forge 1 October 02, 2026 8:00am EDT Download as PDF Completion of three additional 25 MW data halls brings fully operational capacity at Polaris Forge 1 to 250 MW DALLAS, Oct. 02, 2026 (GLOBE NEWSWIRE) -- Applied Digital (NASDAQ: APLD), a U.S. based designer, developer, owner and operator of large-scale, purpose-built data centers engineered to support high-performance computing (“HPC”) workloads, including artificial intelligence (“AI”), machine learning, and other accelerated-compute applications, today announc…

Accessibility: Skip TopNav Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling October 01, 2026 09:00 ET | Source: Applied Materials, Inc. Applied Materials, Inc. Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in Singapore Expanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications supporting AI infrastructure build-out Partnership expands beyond die-to-wafer hybr…

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