人事
Applied Materials Appoints Akash Palkhiwala to Board of Directors
Applied Materials added Akash Palkhiwala, Qualcomm's chief financial and operating officer, to its board of directors.
重要性是模型對已發布報導給出的 1–5 分,不是對市場的預測。
已排定事件列上的影響是公司顯著度層級(高/中由圖譜中心度與規模判定;低僅用於人工整理的次要事件),不是對波動幅度的預測。
標記為已確認的財報日期,是 Yahoo Finance 認定由公司確認的;預估表示尚未公布。未加標記的列沒有可查的出處記錄。
經濟數據發布屬於總體經濟、不歸屬任何產業,因此在任何檢視下都會保留。沒有數值的發布表示尚未公布,頁面會直說,而不是顯示為零。
涵蓋被追蹤公司的即將到來的事件;已過去的事件會歸檔,並在可得時補上結果——這些結果都經人工整理並附引用,絕不杜撰。沒有結果的歷史列會顯示「結果待定」。
閉鎖期屆滿或指數調整的列會多出一行算術——將變得可賣出的股數,或指數基金必須買進的股數,以佔流通股的比例表示——依招股說明書或指數編製方法讀出,兩個數字都在該列註明出處。它陳述的是機制,不是價格走勢。由 IPO + 180 天推算出的閉鎖期日期會一直標為預估,直到公司自己說明為止。
10月14日週三 · 今天
10月15日週四
9月8日週二
人事
Applied Materials added Akash Palkhiwala, Qualcomm's chief financial and operating officer, to its board of directors.
產品
ASML broke ground on a new manufacturing campus in Eindhoven that will eventually span about 350,000 square meters, choosing the Netherlands after warning it might expand abroad. The build-out targets ASML's own output bottleneck on EUV and High-NA systems.
合作
ASML secured commitments from leading chipmakers, led by TSMC, to move High-NA EUV lithography toward a larger photomask format that allows bigger single-die chips. The industry alignment on a new mask standard is a structural change to how advanced logic and memory will be printed.
產品
Intel said it has processed more than one million wafers on High-NA EUV tooling, more than the rest of the industry combined, and is pioneering 6x12 photomasks to speed production and cut cost. It is a concrete marker of its advanced-node manufacturing ramp.
合作
ASML and TSMC announced a joint initiative to move the industry to large-format photomasks for High NA EUV lithography. The two companies will coordinate the mask-infrastructure transition that High NA adoption at leading-edge nodes depends on.
Accessibility: Skip TopNav ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV September 08, 2026 02:04 ET | Source: ASML Netherlands BV ASML Netherlands BV ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV On September 7, in advance of the SPIE Bacus Conference, ASML and TSMC formed a collaborative industry initiative to drive the transition to 12-inch photomasks, maximizing the value of High NA EUV lithography. The initiative targets establishing a 12-inch mask pilot line by 2031…