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Lumentum, Qualcomm, and Corning to Demonstrate High-Density 1060 nm VCSEL Optical D2D Connectivity for AI Scale-Up at ECOC 2026
Lumentum announced plans for a joint demonstration with Qualcomm Technologies and Corning of a high-density die-to-die optical interconnect for AI scale-up at ECOC 2026. It pairs Qualcomm's D2D interface IP subsystem with Lumentum's 1060 nm VCSEL optical engine (about 10 Tb/s aggregate transmit and receive) and Corning's multimode fiber glass ferrules.
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View All News Lumentum, Qualcomm, and Corning to Demonstrate High-Density 1060 nm VCSEL Optical D2D Connectivity for AI Scale-Up at ECOC 2026 September 21, 2026 Download (opens in new window) Joint demonstration showcases a massively parallel optical die-to-die architecture designed to extend high-bandwidth, low-power, low-latency connectivity over multimode fiber MALAGA, Spain--(BUSINESS WIRE)-- Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) op…