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新聞: 截至 2026-10-16
這些標記是什麼意思

重要性是模型對已發布報導給出的 1–5 分，不是對市場的預測。

已排定事件列上的影響是公司顯著度層級（高/中由圖譜中心度與規模判定；低僅用於人工整理的次要事件），不是對波動幅度的預測。

標記為已確認的財報日期，是 Yahoo Finance 認定由公司確認的；預估表示尚未公布。未加標記的列沒有可查的出處記錄。

經濟數據發布屬於總體經濟、不歸屬任何產業，因此在任何檢視下都會保留。沒有數值的發布表示尚未公布，頁面會直說，而不是顯示為零。

涵蓋被追蹤公司的即將到來的事件；已過去的事件會歸檔，並在可得時補上結果——這些結果都經人工整理並附引用，絕不杜撰。沒有結果的歷史列會顯示「結果待定」。

閉鎖期屆滿或指數調整的列會多出一行算術——將變得可賣出的股數，或指數基金必須買進的股數，以佔流通股的比例表示——依招股說明書或指數編製方法讀出，兩個數字都在該列註明出處。它陳述的是機制，不是價格走勢。由 IPO + 180 天推算出的閉鎖期日期會一直標為預估，直到公司自己說明為止。

未來

已排定 · 今天與明天 · 行事曆更新於 2026-10-22

10月24日週六

過往

已發布 · 最新在前

9月17日週四

合作

12:35
Yahoo Finance

GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity

GlobalFoundries and Marvell announced an expanded multi-year agreement to increase capacity for GF's silicon germanium (SiGe) technology at its Burlington, Vermont facility, supporting pluggable optical transceivers, Near-Packaged Optics and Co-packaged Optics. GF's technology supports 200G-per-lane optical connectivity with a roadmap to higher-speed generations. No capacity or dollar figures were disclosed; the agreement is described as expected to add significant capacity for Marvell's growing requirements.

文章預覽

This is a paid press release. Contact the press release distributor directly with any inquiries. GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity GlobalFoundries Inc. Thu, September 17, 2026 at 10:35 PM GMT+10 3 min read GFS MRVL GlobalFoundries Inc. Multi-year strategic agreement increases capacity for high-performance SiGe technology to support growing AI infrastructure demand MALTA, N.Y., Sept. 17, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) and Marvell Technology, Inc. (Nasdaq: MRVL), a leader in data infrastructure semiconductor sol…

GlobalFoundriesMarvell Technology 開啟原文 ↗

合作

11:47
Verdict

SK Hynix and Intel explore US memory chip partnership

Verdict, citing Reuters, reports SK Hynix is in discussions with Intel about producing memory chips in the US for the first time, with scenarios including SK Hynix leasing part of Intel's planned Ohio facility or forming a partnership. A source described the discussions as initial and exploratory with no definite decision reached. SK Hynix said nothing has been finalised regarding cooperation with any specific companies mentioned in the article, and Intel declined to comment while confirming ongoing Ohio investment.

文章預覽

SK Hynix’s product line includes DRAM, NAND flash memory, and HBM chips. Credit: Samuel Boivin/Shutterstock.com. SK Hynix is in discussions with Intel regarding a possible agreement to produce memory chips in the US for the first time, reported Reuters , citing three individuals familiar with the matter. The talks encompass multiple scenarios, two sources said. These include SK Hynix leasing part of Intel’s planned chipmaking facility in Ohio or possibly forming a partnership with Intel and major cloud computing firms seeking secure memory chip supplies. Go deeper with GlobalData Reports…

IntelSK Hynix 開啟原文 ↗

產品

11:09
Inc42

Applied Materials Commits $5 Bn To Boost India’s Semiconductor Ecosystem

Applied Materials announced a $5 Bn investment commitment under its 'Applied Materials India Vision 2035', to be deployed over the next decade, unveiled at SEMICON India 2026 in New Delhi. The plan includes a new 140-acre advanced semiconductor research park and growing its India-based supply chain capacity 10X by 2035.

文章預覽

News SUMMARY Applied Materials has announced a $5 Bn (₹47,980.8 Cr) investment commitment as part of its Applied Materials India Vision 2035 Semicon 2.0 is eyeing to attract more chipmakers to set up facilities in India, including silicon fabs, compound semiconductor fabs, discrete component fabs and display fabs This investment will be used over the next decade to accelerate and integrate India's semiconductor ecosystem into the global value chain --> FOLLOW US FOLLOW US Added to Saved Stories in Login VIEW SAVED STORIES US-based semiconductor equipment and materials-engineering company Appli…

Applied Materials 開啟原文 ↗

產品

10:00
GlobeNewswire

NewPhotonics and Tower Semiconductor Begin High-Volume Shipments of Laser-Integrated, Serviceable Optical Engine PICs for Scale-Out and Scale Up AI Interconnect

Tower Semiconductor and fabless photonic IC company NewPhotonics announced high-volume shipment of laser-integrated optical engine PICs for AI infrastructure interconnect, built on the PH18DA silicon photonics platform. The volume-production PICs support data rates from 800G to 1.6T, with future volume manufacturing planned for 6.4T NPO solutions.

文章預覽

Accessibility: Skip TopNav NewPhotonics® and Tower Semiconductor Begin High-Volume Shipments of Laser-Integrated, Serviceable Optical Engine PICs for Scale-Out and Scale Up AI Interconnect September 17, 2026 06:00 ET | Source: Tower Semiconductor Tower Semiconductor Companies commercialize scale manufacturability of 800G to 1.6T PICs in external pluggable and CPX MSA compliant NPO socket pluggable solutions built on PH18DA platform designed for high-density monolithic laser integration, SOAs, modulators and detectors MIGDAL HAEMEK, Israel, and TEL AVIV, Israel, September 17, 2026 – Tower Semic…

Tower Semiconductor 開啟原文 ↗

融資

00:00
Tokyo Electron

Announcement Regarding Establishment of Sponsored ADR (American Depositary Receipt) Program

Tokyo Electron set up a sponsored Level I ADR program in the United States, with JPMorgan Chase Bank, N.A. as depositary. The ADRs (ticker TELWY, 2 ADRs = 1 ordinary share) were expected to start trading over the counter on September 17, 2026 (U.S. Eastern Time), with no capital raising, and the previously unsponsored ADRs are expected to move into the program.

文章預覽

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Tokyo Electron 開啟原文 ↗

原始消息流

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