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新聞: 截至 2026-10-12
這些標記是什麼意思

重要性是模型對已發布報導給出的 1–5 分，不是對市場的預測。

已排定事件列上的影響是公司顯著度層級（高/中由圖譜中心度與規模判定；低僅用於人工整理的次要事件），不是對波動幅度的預測。

標記為已確認的財報日期，是 Yahoo Finance 認定由公司確認的；預估表示尚未公布。未加標記的列沒有可查的出處記錄。

經濟數據發布屬於總體經濟、不歸屬任何產業，因此在任何檢視下都會保留。沒有數值的發布表示尚未公布，頁面會直說，而不是顯示為零。

涵蓋被追蹤公司的即將到來的事件；已過去的事件會歸檔，並在可得時補上結果——這些結果都經人工整理並附引用，絕不杜撰。沒有結果的歷史列會顯示「結果待定」。

閉鎖期屆滿或指數調整的列會多出一行算術——將變得可賣出的股數，或指數基金必須買進的股數，以佔流通股的比例表示——依招股說明書或指數編製方法讀出，兩個數字都在該列註明出處。它陳述的是機制，不是價格走勢。由 IPO + 180 天推算出的閉鎖期日期會一直標為預估，直到公司自己說明為止。

未來

已排定 · 今天與明天 · 行事曆更新於 2026-10-14

10月14日週三 · 今天

10月15日週四

過往

已發布 · 最新在前

10月12日週一

產品

13:05
PR Newswire

Flex expands prefabricated modular data center portfolio with Axiom AI Modules

Flex announced an expanded portfolio of prefabricated modular data center solutions, including AI Modules that integrate power, high-density compute and liquid cooling into factory-built systems that it says can cut deployment timelines by up to 50% compared with traditional construction. The modules, including an 800 VDC power rack and cooling distribution units, belong to Flex's Cloud and Power Infrastructure segment, which Flex plans to separate into Axiom, an independent publicly traded company, in the first quarter of calendar 2027.

文章預覽

Integrated solutions combine power, compute and cooling to speed deployment by up to 50% News summary Introduces AI Modules that integrate power, compute and cooling in prefabricated modular solutions to accelerate AI factory deployment by up to 50% Enables faster deployment of next-generation AI infrastructure through factory-built, integrated systems Strengthens Flex's Cloud and Power Infrastructure portfolio, which Flex plans to separate into Axiom Solutions International, Inc. (Axiom), in the first quarter of calendar 2027 SAN JOSE, Calif. , Oct. 12, 2026 /PRNewswire/ -- Flex (NASDAQ: FLEX…

Flex 開啟原文 ↗

產品

13:01
The Official Microsoft Blog

Microsoft to scale Azure Maia to multi-gigawatt deployments from 2027; details Maia 300

Microsoft said it will scale its Azure Maia chip family to multi-gigawatt deployments starting in 2027, making Maia the primary inference system for Microsoft products and services. Maia 300, whose compute chiplets are built on TSMC's N2P process, is expected to deliver 40% more tokens per megawatt than leading GPU-based systems and will begin production deployments in 2027; Maia 200 is already serving production workloads including Microsoft Copilot.

文章預覽

Azure Maia 200 now in production; Azure Maia 300 coming in 2027 As we move into the era of Super Intelligence, Microsoft is entering a new phase of infrastructure. We will scale our Azure Maia family to multi-gigawatt deployments starting in 2027, making Maia the primary inference system for Microsoft products and services. The multigenerational Azure Maia program has become a foundational element of Microsoft’s AI infrastructure strategy. Maia 200 is now serving Microsoft production workloads, including Microsoft Copilot , and supporting the MAI team as they develop next-generation models, wi…

MicrosoftTSMC 開啟原文 ↗

產品

13:00
Teradyne

Teradyne launches UltraFLEXplus S series testers for edge AI chips

Teradyne launched the UltraFLEXplus S series, an extension of its UltraFLEXplus test platform for high-mix, variable-volume semiconductor manufacturing of edge AI devices. The first model, the 24-slot UltraFLEXplus S24, supports engineering and production test for MCUs, multimedia and edge AI devices across automotive, industrial and consumer markets and reuses the instrument ecosystem and IG-XL software of the UltraFLEXplus Q series.

文章預覽

Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications October 12, 2026 9:00am EDT New Series of Testers Extend the UltraFLEXplus Architecture to Deliver Superior Floor Space Economics for High-Mix, Variable-Volume Manufacturing NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc . (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the UltraFLEXplus S series , an extension of its UltraFLEXplus platform engineered to maximize output per square meter and operational efficiency for high-mix, variable-volume semiconduct…

Teradyne 開啟原文 ↗

產品

13:00
Credo Technology

Credo unveils 1.6T ZeroFlap Active Light Cable for AI data centers, shipping in 2027

Credo unveiled a 1.6T ZeroFlap active light cable (ALC), a wide-parallel optical interconnect for AI scale-out and front-end networks designed to draw 12W per cable-end, roughly 30% less than comparable active electrical cables, with a targeted reach up to 50m. The product will be shipping in 2027.

Credo Technology 開啟原文 ↗

產品

13:00
AMD

AMD introduces Helion, an open OCP-based rack blueprint for agentic AI

AMD introduced the AMD Helion agentic AI rack, an open blueprint based on an Open Compute Project spec design, with configurations including a CPU-only rack of 6th Gen EPYC processors supporting up to 32,768 CPU cores and an all-in-one rack combining EPYC CPU nodes with Instinct MI350P GPU nodes. AMD plans to contribute the specification to OCP, and Helion configurations are planned to be available in November 2026.

文章預覽

Introducing AMD Helion, Agentic AI Compute at Rack Scale October 12, 2026 9:00 am EDT Download as PDF News Highlights: AMD Helion lets customers tailor CPU core density, performance and power to agentic workloads, with CPU-only configurations for hyperscale deployments and integrated CPU/GPU configurations for enterprises. AMD Helion combines open hardware and software with an integrated token router that directs agents’ model calls across frontier and open-source models. SANTA CLARA, Calif., Oct. 12, 2026 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today introduced the AMD Helion agentic AI rack, a…

AMD 開啟原文 ↗

原始消息流

所有到達的消息 · 7 天