Yahoo Finance (Business Wire) · 2026-10-27 · 产品
Intel and Oracle announced a planned multiyear collaboration covering current and future Xeon platforms, capacity planning and planned Diamond Rapids-based OCI offerings. Future products and roadmap coordination remain plans.
Applied Materials · 2026-10-12 · 产品
Applied Materials unveiled its Equipment and Process Innovation and Commercialization (EPIC) Center at its Sunnyvale, California, campus, a $5 billion capital investment in a 600,000-square-foot facility with nearly four acres of advanced cleanroom space. Founding partners TSMC, Intel, Samsung Electronics, Micron and SK hynix are joined by innovation partners including Broadcom, Advantest and KIOXIA.
Intel · 2026-10-12 · 产品
At the OCP Global Summit, Intel shared new technical details on the Intel GPU D-series, formerly code-named Crescent Island, which combines up to 480 GB of LPDDR5X memory, 1.5 TB/s of memory bandwidth and 1.3 petaflops of FP8 compute within a 350-watt power envelope, with customer sampling underway. Intel also introduced Xeon-based rack designs, with select Xeon 6+ configurations scaling beyond 46,000 cores per rack at 133.45 kW total rack power.
Astera Labs · 2026-10-08 · 产品
Astera Labs announced its Aries 7 PCIe 7 signal conditioning portfolio spanning smart retimers, redrivers, cable modules, optical drivers and optical TIAs, extending reach from centimeters of PCB trace to 50+ meters over optical cables spanning multiple racks. The products are expected to begin sampling in Q4 2026 to select hyperscale, OEM and NPO customers. AMD and Intel, which have each validated Aries Smart Retimers in production from PCIe 4 through 6, are collaborating with Astera Labs on the transition to PCIe 7.
GlobeNewswire · 2026-10-06 · 合作
Applied Materials is working with Intel to accelerate development of next-generation transistors, interconnects and advanced packaging, linking Applied's EPIC Center in Silicon Valley with Intel's R&D campus in Hillsboro, Oregon. No financial terms were disclosed.
The Motley Fool · 2026-10-05 · 合作
Elon Musk said on X that Terafab, the chip-manufacturing project his companies are planning in Texas, is in talks with TSMC: "Just discussions, but something may come of it." Intel joined Terafab in April and has been its only named chip partner.
Google · 2026-09-21 · 产品
Google opened pre-orders for Googlebook, its new category of Android-based laptops designed for Gemini, with initial devices built by Acer, ASUS, Dell, HP and Lenovo on Intel and Qualcomm processors. Prices start at $899, and devices arrive on U.S. shelves starting October 4.
Verdict · 2026-09-17 · 合作
Verdict, citing Reuters, reports SK Hynix is in discussions with Intel about producing memory chips in the US for the first time, with scenarios including SK Hynix leasing part of Intel's planned Ohio facility or forming a partnership. A source described the discussions as initial and exploratory with no definite decision reached. SK Hynix said nothing has been finalised regarding cooperation with any specific companies mentioned in the article, and Intel declined to comment while confirming ongoing Ohio investment.
PR Newswire · 2026-09-14 · 融资
Construction-AI company Buildots announced a $130 million round led by O.G. Venture Partners, with participation from Lightspeed Venture Partners, Intel Capital, Mohari Ventures, Human Capital, Qumra Capital, Avigdor Willenz, Viola Growth and Poalim Equity, bringing total capital raised to $297 million.
Yahoo Finance · 2026-09-11 · 产品
Intel said it has processed over one million wafers through High-NA EUV lithography, which it claims exceeds the rest of the industry combined. The figure is a process-maturity marker for its 18A and successor nodes and for its foundry pitch.
Intel · 2026-09-11 · 合作
Intel Foundry and ASML said their joint High-NA EUV work has passed one million wafers processed and is moving the tool toward production readiness. Intel remains the lead customer proving out ASML's next-generation lithography.
Reuters · 2026-09-10 · 融资
Altera, the FPGA business Intel sold a majority stake in to Silver Lake, is preparing an IPO that could raise more than $2 billion as soon as 2026. Intel retains a minority stake in the company.
Tom's Hardware · 2026-09-08 · 产品
Intel said it has processed more than one million wafers on High-NA EUV tooling, more than the rest of the industry combined, and is pioneering 6x12 photomasks to speed production and cut cost. It is a concrete marker of its advanced-node manufacturing ramp.
Barchart · 2026-08-17 · 融资
Intel completed an upsized follow-on equity offering that, including the 30-day option given to underwriters to purchase additional shares, raised about $23 billion — up from an initial $15 billion offering that was increased to $20 billion. Proceeds are earmarked for general corporate purposes including capital expenditures and working capital, supporting Intel Foundry expansion and data-center build-outs. The raise marks a shift toward funding the capital-intensive manufacturing and AI build-out with fresh equity rather than additional debt.
Google News: Intel · 2026-07-15 · 产品
Intel becomes the first chipmaker to deploy ASML's High-NA EUV lithography tool in mass chip production.
Tom's Hardware · 2026-07-03 · 产品
Intel confirmed price increases on select consumer and server CPUs, citing supply costs and demand, with some Xeon processors rising over $1,000.
Tom's Hardware · 2026-07-03 · 产品
A report claims Intel has resolved wafer-to-wafer yield issues on its 18A process, with production reaching up to 15,000 wafers per month at both sites.
Wccftech · 2026-07-03 · 合作
Apple reportedly plans to adopt Intel's 18A process to manufacture the A20 chip for the base iPhone 18, advancing its dual-foundry strategy.
The Mercury News · 2026-07-01 · 产品
Intel broke ground on a new chip manufacturing hub in Santa Clara, California.
Tom's Hardware · 2026-07-01 · 人事
Tesla hired 17-year Intel veteran Gary Jiang to oversee fab efforts for its Terafab project, which is tied to licensing Intel's 14A process.